800V 6.5A Phase Control SCR in a D2-Pak package# Technical Documentation: 10TTS08S Schottky Diode
*Manufacturer: International Rectifier (IR)*
## 1. Application Scenarios
### Typical Use Cases
The 10TTS08S is a 100V, 10A dual center-tapped Schottky diode in a TO-220AB package, primarily employed in high-frequency, high-efficiency power conversion applications. Key use cases include:
- Switch-Mode Power Supplies (SMPS) : Used as output rectifiers in forward, flyback, and buck converter topologies
- DC-DC Converters : Serving as freewheeling diodes in synchronous and non-synchronous buck converters
- Motor Drive Circuits : Providing reverse polarity protection and freewheeling paths in H-bridge configurations
- Solar Power Systems : Implementing bypass diodes in photovoltaic arrays and charge controller circuits
- Uninterruptible Power Supplies (UPS) : Rectification and freewheeling functions in inverter sections
### Industry Applications
- Telecommunications : Power rectification in base station power supplies and network equipment
- Automotive Electronics : DC-DC converters for infotainment systems and LED lighting drivers
- Industrial Automation : Motor drives, PLC power supplies, and industrial UPS systems
- Consumer Electronics : High-efficiency power adapters and gaming console power supplies
- Renewable Energy : Solar inverters and wind turbine power conditioning systems
### Practical Advantages and Limitations
Advantages:
- Low Forward Voltage Drop : Typically 0.55V at 5A, reducing conduction losses
- Fast Switching Characteristics : Reverse recovery time <35ns, minimizing switching losses
- High Temperature Operation : Capable of junction temperatures up to 175°C
- Dual Diode Configuration : Center-tapped design saves board space and simplifies layout
- High Current Capability : 10A continuous forward current rating
Limitations:
- Voltage Rating : 100V maximum limits use in high-voltage applications
- Thermal Management : Requires adequate heatsinking at high current levels
- Reverse Leakage : Higher than standard PN junction diodes, especially at elevated temperatures
- Cost Consideration : More expensive than standard recovery diodes for non-critical applications
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Inadequate Thermal Management
- Problem : Excessive junction temperature leading to reduced reliability and potential thermal runaway
- Solution : Implement proper heatsinking using thermal interface materials and calculate thermal resistance requirements based on maximum power dissipation
Pitfall 2: Voltage Spikes and Ringing
- Problem : Parasitic inductance causing voltage overshoot during reverse recovery
- Solution : Incorporate snubber circuits and minimize loop inductance through proper PCB layout
Pitfall 3: Reverse Recovery Current Issues
- Problem : Unexpected current spikes affecting EMI performance and efficiency
- Solution : Ensure proper derating and consider soft-switching topologies for high-frequency applications
### Compatibility Issues with Other Components
Gate Drivers : Compatible with most MOSFET/IGBT drivers, but ensure proper dead-time control to prevent shoot-through
Control ICs : Works well with common PWM controllers (UC384x, TL494, etc.) but may require additional protection circuits
Passive Components :
- Input/output capacitors should have low ESR to handle high di/dt conditions
- Inductors must be rated for the full current range and switching frequency
### PCB Layout Recommendations
Power Stage Layout:
- Keep diode-to-inductor and diode-to-capacitor traces as short and wide as possible
- Use ground planes for improved thermal performance and noise immunity
- Maintain minimum 2mm creepage distance for 100V operation
Thermal Management:
- Provide adequate copper area for
