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STTH30L06D from ST,ST Microelectronics

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STTH30L06D

Manufacturer: ST, STM

TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER

Partnumber Manufacturer Quantity Availability
STTH30L06D ST, STM 100 In Stock

Description and Introduction

TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER The **STTH30L06D** is a **30A, 600V** ultrafast recovery diode manufactured by **STMicroelectronics (STM)**.  

### **Key Specifications:**  
- **Voltage Rating (VRRM):** 600V  
- **Average Forward Current (IF(AV)):** 30A  
- **Peak Forward Surge Current (IFSM):** 300A (non-repetitive)  
- **Forward Voltage Drop (VF):** ~1.7V (typical at IF = 30A)  
- **Reverse Recovery Time (trr):** ≤ 35ns (ultrafast recovery)  
- **Operating Junction Temperature (TJ):** -40°C to +175°C  
- **Package:** TO-220AB (isolated tab)  

### **Features:**  
- **Ultrafast recovery** for high-efficiency switching applications  
- **Low reverse recovery charge (Qrr)** for reduced switching losses  
- **High surge current capability**  
- **Isolated mounting tab** for simplified thermal management  
- **AEC-Q101 qualified** for automotive applications  

### **Applications:**  
- Power factor correction (PFC) circuits  
- Switch-mode power supplies (SMPS)  
- Freewheeling diodes in motor drives  
- Inverters and converters  

This diode is designed for high-performance power electronics requiring fast switching and low power dissipation.

Application Scenarios & Design Considerations

TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER

Alternative Part Number

  • VS-30ETH06-M3 --: Ultrafast 30A 600V TO-247/TO-220 diode with similar forward voltage and recovery characteristics, direct functional replacement.
  • IDH30G60C5 --: 30A 600V ultrafast diode in TO-220 package with comparable Vf and trr, suitable drop-in substitute.
  • FFA30U60DN --: 30A 600V ultrafast rectifier with similar switching performance and package options, good alternative for the STTH30L06D.
  • BYV34X-600 --: Dual ultrafast 30 A, 600 V rectifier with similar switching characteristics, usable as an alternative where package and thermal layout allow.

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