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TYN625RG-TYN825RG Fast Delivery,Good Price
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TYN625RGST,STN/a10000avai25A SCRs, 600V
TYN625RGSTMN/a10000avai25A SCRs, 600V
TYN625RGSTN/a3500avai25A SCRs, 600V
TYN825RGST,STN/a10000avai25A SCRS
TYN825RGSTMN/a10000avai25A SCRS


TYN625RG ,25A SCRs, 600VTN25 and TYNx25 Series®STANDARD 25A SCRs MAIN
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TYN625RG-TYN825RG
N-Channel Enhancement Mode MOSFETs
1/7

TN25 and TYNx25 Series
STANDARD
25A SCRs
April 2002 - Ed: 4A
MAIN FEATURES:
DESCRIPTION

The TYN / TN25 SCR Series is suitable for
general purpose applications.
Using clip assembly technology, they provide a
superior performance in surge current capabilities.
ABSOLUTE RATINGS (limiting values)
TN25 and TYNx25 Series
2/7
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
THERMAL RESISTANCES

S = Copper surface under tab
PRODUCT SELECTOR
TN25 and TYNx25 Series3/7
ORDERING INFORMATION
OTHER INFORMATION
Note: x = voltage
TN25 and TYNx25 Series
4/7
Fig. 1:
Maximum average power dissipation
versus average on-state current.
Fig. 2-1: Average and
D.C. on-state current
versus case temperature.
Fig. 2-2: Average
and D.C. on-state current
versus ambient temperature (copper surface
under tab: S = 1 cm² (for D²PAK).
Fig. 3: Relative variation of thermal impedance

versus pulse duration.
Fig. 4: Relative variation of gate trigger current,

holding current and latching current versus
junction temperature.
Fig. 5: Surge
peak on-state current versus
number of cycles.
TN25 and TYNx25 Series5/7
Fig. 6: Non-repetitive surge
peak on-state
current for a sinusoidal pulse with width<10 ms, and corresponding values of I²t.
Fig. 7: On-state
characteristics (maximum
values).
Fig. 8: Thermal resistance junction to
ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 μm)2 PAK).
TN25 and TYNx25 Series
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PACKAGE MECHANICAL DATA
2 PAK (Plastic)
FOOTPRINT DIMENSIONS (in millimeters)
2 PAK (Plastic)
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