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TS820600STN/a366avai8A SCRs


TS820600 ,8A SCRsapplications such as overvoltage crowbarprotection, motor control circuits in power toolsand kitche ..
TS820-600B ,8A SCRSTN8, TS8 and TYNx08 Series®SENSITIVE & STANDARD 8A SCRs MAIN
TS820-600B ,8A SCRSapplications such as overvoltage crowbarprotection, motor control circuits in power toolsand kitche ..
TS820-600B-TR ,8A SCRSFEATURES:ASymbol Value UnitGI8AT(RMS)KV /V600 to 1000 VDRM RRM AAI0.2 to 15 mAGTKAGDESCRIPTIONKAIPA ..
TS820-600B-TR ,8A SCRSapplications such as overvoltage crowbarprotection, motor control circuits in power toolsand kitche ..
TS820-600B-TR ,8A SCRSTN8, TS8 and TYNx08 Series®SENSITIVE & STANDARD 8A SCRs MAIN
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TS820600
8A SCRs
1/9

TN8, TS8 and TYNx08 Series
SENSITIVE & STANDARD
8A SCRs
April 2002 - Ed: 4A
MAIN FEATURES:
DESCRIPTION

Available either in sensitive (TS8) or standard
(TN8 / TYN) gate triggering levels, the 8A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
ABSOLUTE RATINGS (limiting values)
TN8, TS8 and TYNx08 Series
2/9
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
SENSITIVE STANDARD
THERMAL RESISTANCES

S= copper surface under tab
TN8, TS8 and TYNx08 Series3/9
PRODUCT SELECTOR
ORDERING INFORMATION
TN8, TS8 and TYNx08 Series
4/9
OTHER INFORMATION
Note: x = voltage
Fig. 1:
Maximum average power dissipation
versus average on-state current.
Fig. 2-1: Average and
D.C. on-state current
versus case temperature.
Fig. 2-2: Average
and D.C. on-state current
versus ambient temperature (device mounted on
FR4 with recommended pad layout) (DPAK).
Fig. 3-1: Relative variation of thermal impedance

junction to case versus pulse duration.
TN8, TS8 and TYNx08 Series5/9
Fig. 3-2: Relative variation of thermal impedance

junction to ambient versus pulse duration
(recommended pad layout, FR4 PC board forAK).
Fig. 4-1: Relative variation of gate trigger current

and holding current versus junction temperature
for TS8 series.
Fig. 4-2: Relative variation of gate trigger current

and holding current versus junction temperature
for TN8 & TYN series.
Fig. 5:
Relative variation of holding current
versus gate-cathode resistance (typical values)
for TS8 series.
Fig. 6:
Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values)
for TS8 series.
Fig. 7: Relative variation of dV/dt immunity

versus gate-cathode capacitance (typical values)
for TS8 series.
TN8, TS8 and TYNx08 Series
6/9
Fig. 8: Surge peak on-state current versus

number of cycles. TS8/TN8/TYN.
Fig. 9:
Non-repetitive surge peak on-state
current for a sinusoidal pulse with width<10 ms, and corresponding values of I²t.
Fig. 10: On-state characteristics (maximum

values).
Fig. 11: Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 μm)
(DPAK).
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