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TPS65921BZQZTIN/a196avaiIntegrated Power Management IC (PMIC) with 3 DC/DC's, 4 LDOs, USB HS Transceiver 120-BGA MICROSTAR JUNIOR
TPS65921BZQZRTIN/a6000avaiIntegrated Power Management IC (PMIC) with 3 DC/DC's, 4 LDOs, USB HS Transceiver 120-BGA MICROSTAR JUNIOR


TPS65921BZQZR ,Integrated Power Management IC (PMIC) with 3 DC/DC's, 4 LDOs, USB HS Transceiver 120-BGA MICROSTAR JUNIOR Features1– 32-kHz Crystal Oscillator• Three Step-Down Converters:– Clock Slicer for 26, 19.2, and 3 ..
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TPS65921BZQZ-TPS65921BZQZR
Integrated Power Management IC with 3 DC/DC's, 4 LDO's, USB HS Transceiver
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TPS65921

SWCS048G –MARCH 2010–REVISED SEPTEMBER 2014
TPS65921 Power Management and USB Single Chip Device Overview
1.1 Features
32-kHz Crystal Oscillator• Three Step-Down Converters: Clock Slicer for 26, 19.2, and 38.4 MHz– Upto 1.2Aof Output Currentfor VDD1 HF Clock Output Buffer• TPS65921B Supports VDD1upto 1.2A USB:• TPS65921B1 Supports VDD1 upto 1.4A USB HS 2.0 Transceiver(Necessary for 1-GHz Operation) USB 1.3 OTG-Compliant– SmartReflex™ Dynamic Voltage Management 12-Bit ULPI 1.1 Interface– 3.2-MHz Fixed Frequency Operation USB Power Supply (5-V CP for VBUS)– VIN Range from 2.7to 4.5V Control– Typical30 µA Quiescent per Converter High-SpeedI2C Interface• Four General-Purpose Configurable LDOs: All Resource ConfigurablebyI2C– Dynamic Voltage Scaling Keypad Interfaceupto8×8– 220-mA Maximum Current for One LDO 10-Bit A/D Converter– VIN Range from 2.7to 4.5V Hot-Die, Thermal Shutdown Protection–2 LDOs With Low Noise and High PSRR µ*BGA 120 Balls ZQZ• RTC With Alarm Wake-Up Mechanism Clock Management
1.2 Applications
Mobile Phones and Smart Phones • E-Books MP3 Players • OMAP™ and Low-Power DSP Supply Handheld Devices
1.3 Description

The TPS65921 deviceisa highly integrated power-management circuit (IC) that supports the power and
peripheral requirementsof the OMAP application processors. The device contains power management,a
universal serial bus (USB) high-speed (HS) transceiver, an analog-to-digital converter (ADC),a real-time
clock (RTC),a keypad interface, and an embedded power control (EPC). The power portionof the device
contains three buck converters, two controllable bya dedicated SmartReflex class-3 interface, multiple
low-dropout (LDO) regulators,an EPCto manage the power-sequencing requirementsof OMAP, and an
RTC module. The USB module provides an HS 2.0 transceiver suitable for direct connectionto the OMAP
universal transceiver macrocell interface (UTMI)+ low pin interface (ULPI) withan integrated charge pump
(CP).
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