TMSDC6722BRFPA225 ,Floating-Point Digital Signal Processor 144-HTQFP SPRS370E–SEPTEMBER 2006–REVISED JULY 2008The C6727B extends SDRAM support to 256M-bit and 512M-bit ..
TMSDC6727BGDHA250 ,Floating-Point Digital Signal Processor 256-BGA features such as the capability to perform three-dimensional data transfersfor advanced data sortin ..
TMSDC6727BZDHA250 ,Floating-Point Digital Signal Processor 256-BGA SPRS370E–SEPTEMBER 2006–REVISED JULY 20081 TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 D ..
TMV0505EN , DC/DC Converters (TMV-EN Series, 1 Watt)
TMV0505EN , DC/DC Converters (TMV-EN Series, 1 Watt)
TMX320C6204GLW ,Fixed-Point Digital Signal Processorelectrical characteristics over recommended thermal/mechanical data ....... 89ranges of supply volt ..
TPS650732RSLR ,5-Channel Power Management IC (PMIC) with 3 DC/DCs, 2 LDOs in 6x6mm QFN 48-VQFN -40 to 85 SLVS950H–JULY 2009–REVISED SEPTEMBER 2015Changes from Revision B (December 2009) to Revision C Pag ..
TPS65090ARVNR ,Frontend Power Management IC (PMIC) with Switchmode Charger for 2-3 Cells In Series 100-VQFN-MR -40 to 85Features 2 Applications1• Wide Input Voltage Charger and Power Path • Battery-Powered Products Usin ..
TPS65100PWPR ,Triple Output TFT LCD Supply w/VCOM BufferFeatures 3 DescriptionThe TPS6510x series offers a compact and small1• 2.7-V to 5.8-V Input Voltage ..
TPS65100PWPRG4 ,4-CH LCD Bias w/ Fully Int. Pos. Charge Pump, 3.3V LDO Contr., 1.6A Min. Boost Ilim, Fault & VCOM 24-HTSSOP -40 to 85Block Diagram... 1312.8 Glossary. 298.3 Feature Description.... 1413 Mechanical, Packaging, and Ord ..
TPS65100RGE , TRIPLE OUTPUT LCD SUPPLY WITH LINEAR REGULATOR AND VCOM BUFFER
TPS65100RGER ,Triple Output TFT LCD Supply w/VCOM BufferBlock Diagram (1)Device InformationTPS6510xPART NUMBER PACKAGE BODY SIZE (NOM)HTSSOP (24) 7.80 mm × ..
TMSDC6722BRFPA225
Floating-Point Digital Signal Processor
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs1.1 Features
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processorswww.ti.com SPRS370E–SEPTEMBER 2006–REVISED JULY 2008
C672x: 32-/64-Bit 350-MHz Floating-Point DSPs •
Three Multichannel Audio Serial Ports Transmit/Receive Clocks upto50 MHz•
Upgradesto C67x+ CPU From C67x™ DSP Six Clock Zones and16 Serial Data PinsGeneration: Supports TDM, I2S, and Similar Formats– 2X CPU Registers [64 General-Purpose] DIT-Capable (McASP2)– New Audio-Specific Instructions Compatible With the C67x CPU •
Universal Host-Port Interface (UHPI) 32-Bit-Wide Data Bus for High Bandwidth•
Enhanced Memory System Muxed and Non-Muxed Address and Data– 256K-Byte Unified Program/Data RAM 384K-Byte Unified Program/Data ROM •
Two 10-MHz SPI Ports With 3-,4-, and 5-Pin Single-Cycle Data Access From CPU Options Large Program Cache (32K Byte) Supports •
Two Inter-Integrated Circuit (I2C) PortsRAM, ROM, and External Memory •
Real-Time Interrupt Counter/Watchdog•
External Memory Interface (EMIF) Supports •
Oscillator- and Software-Controlled PLL– 133-MHz SDRAM (16-or 32-Bit) •
Applications:– Asynchronous NOR Flash, SRAM (8-,16-,or – Professional Audio32-Bit) •
Mixers– NAND Flash (8-or 16-Bit) •
Effects Boxes•
Enhanced I/O System •
Audio Synthesis– High-Performance Crossbar Switch •
Instrument/Amp Modeling– Dedicated McASP DMA Bus •
Audio Conferencing– Deterministic I/O Performance •
Audio Broadcast•
dMAX (Dual Data Movement Accelerator) •
Audio EncoderSupports: – Emerging Audio Applications– 16 Independent Channels – Biometrics– Concurrent Processingof Two Transfer – MedicalRequests – Industrial– 1-, 2-, and 3-Dimensional •
Commercialor Extended TemperatureMemory-to-Memory and
Memory-to-Peripheral Data Transfers •
144-Pin, 0.5-mm, PowerPAD™ Thin Quad Circular Addressing Where the Sizeofa Flatpack (TQFP) [RFP Suffix]
Circular Buffer (FIFO)is not Limitedto2n •
256-Terminal, 1.0-mm, 16x16 Array Plastic Ball Table-Based Multi-Tap Delay Read and Grid Array (PBGA) [GDH and ZDH Suffixes]Write Transfers From/Toa Circular BufferPleasebe aware thatan important notice concerning availability, standard warranty, and usein critical applicationsof Texas
Instruments semiconductor products and disclaimers thereto appearsatthe endof this document.
