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TLV3011AMDBVREPTIN/a10632avaiEnhanced Product Nanopower 1.8V Sot23 Comparator With Voltage Reference 6-SOT-23 -55 to 125


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TLV3011AMDBVREP
Enhanced Product Nanopower 1.8V Sot23 Comparator With Voltage Reference 6-SOT-23 -55 to 125
www.ti.com
FEATURES APPLICATIONS
DESCRIPTION

REF
IN-
OUT
IN+
DBV PACKAGE
(TOP VIEW)
TLV3011-EP, TLV3012-EP
SGLS349–OCTOBER 2006
NANOPOWER 1.8-V SOT23 COMPARATORS WITH VOLTAGE REFERENCE
Battery-Powered Level Detection Controlled Baseline Data Acquisition– One Assembly/Test Site System Monitoring– One Fabrication Site Oscillators Extended Temperature Performanceof Sensor Systems–55°Cto 125°C Smoke Detectors Enhanced Diminishing Manufacturing – Light SensorsSources (DMS) Support Alarms Enhanced Product-Change Notification Qualification Pedigree(1) Low Quiescent Current=5 μA (Max) The TLV3011 and TLV3012 are low-power,• Integrated Voltage Reference= 1.242V open-drain output comparators. The devices feature• Input Common-Mode Range= 200 mV an uncommitted on-chip voltage reference, have
Beyond Rails
5-μA (max) quiescent current, input common-mode
range 200 mV beyond the supply rails, and• Voltage Reference Initial Accuracy= 1% single-supply operation from 1.8Vto 5.5 V. The• Open-Drain Logic Compatible Output integrated 1.242-V series voltage reference offers(TLV3011) low 100-ppm/°C (max) drift,is stable with upto• Push-Pull Output (TLV3012) 10-nF capacitive load, and can provide up to
0.5 mA (typ)of output current.• Low Supply Voltage= 1.8Vto 5.5V Fast Response Time= 6-μs Propagation The TLV3011 and TLV3012 are availablein the tiny
SOT23-6 package for space-conservative designs.Delay With 100-mV Overdrive
The devices are specified for the temperature range(TLV3011: RPULLUP=10 kΩ) of –55°Cto 125°C.• Microsize Package: SOT23-6
(1) Component qualificationin accordance with JEDEC and
industry standardsto ensure reliable operation overan
extended temperature range. This includes,butisnot limited
to, Highly Accelerated Stress Test (HAST)or biased 85/85,
temperature cycle, autoclaveor unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing shouldnotbe viewedas
justifying useofthis component beyond specified
performance and environmental limits.
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