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STTH8S06D-STTH8S06FP
Turbo 2 ultrafast high voltage rectifier
December 2007 Rev 1 1/8
STTH8S06 urbo 2 ultrafast high voltage rectifier
Features Ultrafast recovery Low reverse recovery current Reduces losses in diode and switching
transistor Low thermal resistance Higher frequency operation Insulated TO-220FPAC version Insulation voltage = 1500 V rms Package capacitance = 12 pF
DescriptionST's STTH8S06 is a state of the art ultrafast
recovery diode. By the use of 600 V Pt doping
planar technology, this diode will out-perform the power factor corrections circuits operating in
hardswitching conditions. The extremely low
reverse recovery current of the STTH8S06,
reduces significantly the switching power losses
of the MOSFET and thus increases the efficiency
of the application. This leads designers to reduce
the size of their heatsinks.
This device is also intended for applications in
power supplies and power conversions systems,
motor drive, and other power switching
applications.
Table 1. Device summary
Characteristics STTH8S06
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1 Characteristics
To evaluate the maximum conduction losses use the following equation:
P = 1.20 x IF(AV) + 0.087 IF2 (RMS)
Table 2. Absolute ratings (limiting values)
Table 3. Thermal parameter
Table 4. Static electrical characteristics
Table 5. Dynamic electrical characteristics
STTH8S06 Characteristics
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Figure 1. Forward voltage drop versus
forward current
Figure 2. Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220AC)
Figure 3. Relative variation of thermal
impedance junction to case versus
pulse duration(TO-220FPAC)
Figure 4. Peak reverse recovery current
versus dIF /dt (typical values)
Characteristics STTH8S06
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Figure 7. Junction capacitance versus reverse voltage applied (typical values)
Figure 5. Reverse recovery time versus dIF/dt
(typical values)
Figure 6. Reverse recovery charges versus
dIF/dt (typical values)
STTH8S06 Package information
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2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOP ACK® packages are Lead-free. The category of second level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: .
Table 6. TO-220AC dimensions
Package information STTH8S06
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Table 7. TO-220FPAC dimensions
