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STTH8R03DSTN/a10avai300V HYPERFAST RECTIFIER


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STTH8R03D
300V HYPERFAST RECTIFIER
STTH8R03G/D
February 2001-Ed:1H
300V HYPERFAST RECTIFIER
The TURBOSWITCH "R"is an ultra high
performance diode.
This TURBOSWITCH family, which drastically
cuts lossesin associated MOSFET when runat
high dIF/dt,is suitedforHF OFF-Line SMPS and
DC/DC converters.
DESCRIPTION
Designedfor high frequency applications. Hyperfast recovery competes with GaAs devices. Allows size decreaseof snubbersand heatsinks.
FEATURES AND BENEFITS
ABSOLUTE RATINGS
(limiting values,per diode)
MAJOR PRODUCT CHARACTERISTICS
STTH8R03G/D
Pulse test:* tp=5ms,δ <2%tp= 380μs,δ <2% evaluatethe maximum conduction losses usethe following equation:
P=0.9xIF(AV)+ 0.05IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
THERMAL AND POWER DATA
RECOVERY CHARACTERISTICS
TURN-ON SWITCHING CHARACTERISTICS
STTH8R03G/D
0246 8 100.0
P(W)
Fig.1: Conduction losses versus averagecurrent
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.01
IFM(A)
Fig.2: Forward voltage drop versus forward
current.
1E-3 1E-2 1E-1 1E+00.0
Zth(j-c)/Rth(j-c)
Fig.3: Relative variationof thermal impedance
junctionto case versus pulse duration. 50 100 150 200 250 300 350 400 450 5000
trr(ns)
Fig.5:
Reverse recovery time versus dIF/dt
(90% confidence). 50 100 150 200 250 300 350 400 450 5000
IRM(A)
Fig.4:
Peak reverse recovery current versus
dIF/dt (90% confidence). 50 100 150 200 250 300 350 400 450 5000
Qrr(nC)
Fig.6: Reverse recovery charges versus dIF/dt
(90% confidence).
STTH8R03G/D 50 100 150 200 250 300 350 400 450 5000.0
S factor
Fig.7: Softness factor (tb/ta) versus dIF/dt
(typical values). 50 75 100 1250.0
Fig. 8: Relative variation of dynamic
parameters versus junction temperature
(Reference: Tj=125°C). 50 100 150 200 250 300 350 400 450 5000
VFP(V)
Fig.9:
Transient peak forward voltage versus
dIF/dt (90% confidence). 50 100 150 200 250 300 350 400 450 5000
tfr(ns)
Fig. 10: Forward recovery time versus dIF/dt
(90% confidence). 5 10 15 20 25 30 35 400
Rth(j-a) (°C/W)
Fig. 11:
Thermal resistance junctionto ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35μm)(D2 PAK)
STTH8R03G/D
PACKAGE MECHANICAL DATA
2 PAK
FOOTPRINT

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