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STTH310RLSTN/a10avaiHIGH VOLTAGE ULTRAFAST RECTIFIER


STTH310RL ,HIGH VOLTAGE ULTRAFAST RECTIFIERapplications.ABSOLUTE RATINGS (limiting values)Symbol Parameter Value UnitV Repetitive peak reverse ..
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STTH310RL
HIGH VOLTAGE ULTRAFAST RECTIFIER
STTH310/S
January 2003- Ed:1
HIGH VOLTAGE ULTRAFAST RECTIFIER
The STTH310, whichis using ST ultrafast high
voltage planar technology,is specially suited for
free-wheeling, clamping, snubbering, demagneti-
zationin power supplies and other power switching
applications.
DESCRIPTION
Low forward voltage drop High reliability High surge current capability Soft switchingfor reduced EMI disturbances Planar technology
FEATURES AND BENEFITS
ABSOLUTE RATINGS
(limiting values)
MAIN PRODUCT CHARACTERISTICS
STTH310/S evaluate the maximum conduction losses use the following equation:
P=1.20xIF(AV)+ 0.075xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
THERMAL PARAMETERS
DYNAMIC ELECTRICAL CHARACTERISTICS
STTH310/S
P(W)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Fig.1:
Conduction losses versus averagecurrent. (A)FM
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Fig. 2:
Forward voltage drop versus forward
current.
Z/Rth(j-c) th(j-c)

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 3-1:
Relative variationof thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads= 10mm) (DO-201AD).
Z/Rth(j-c) th(j-c)

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 3-2:
Relative variationof thermal impedance
junction ambient versus pulse duration (epoxy
FR4, S=1cm2) (SMC). (°C/W)th(j-a)
012 345
Fig.4:
Thermal resistance junctionto ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness:
35μm).
STTH310/S
PACKAGE MECHANICAL DATA

SMC
FOOTPRINT
(in millimeters)
STTH310/S
PACKAGE MECHANICAL DATA

DO-201AD Epoxy meets UL 94,V0
Information furnishedis believedtobeaccurateandreliable.However,STMicroelectronics assumesno responsibility forthe consequencesof
useofsuchinformationnorfor anyinfringementof patentsorother rightsof third parties whichmayresultfromits use.Nolicenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedes and replacesall information previously supplied.
STMicroelectronics productsarenot authorizedfor useas critical componentsinlife support devicesor systems without express written
approval ofSTMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2003 STMicroelectronics- Printedin Italy-All rights reserved.
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