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STPSC606DSTN/a280avai600 V power Schottky silicon carbide diode


STPSC606D ,600 V power Schottky silicon carbide diodeFeaturesK■ No or negligible reverse recovery■ Switching behavior independent of temperature■ Dedica ..
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STPSC606D
600 V power Schottky silicon carbide diode
September 2009 Doc ID 16284 Rev 1 1/8
STPSC606

600 V power Schottky silicon carbide diode
Features
No or negligible reverse recovery Switching behavior independent of
temperature Dedicated to PFC boost diode
Description

The SiC diode is an ultrahigh performance power
Schottky diode. It is manufactured using a silicon
carbide substrate. The wide bandgap material
allows the design of a Schottky diode structure
with a 600 V rating. Due to the Schottky
construction no recovery is shown at turn-off and
ringing patterns are negligible. The minimal
capacitive turn-off behavior is independent of
temperature.
ST SiC diodes will boost the performance of PFC
operations in hard switching conditions.
Table 1. Device summary
Characteristics STPSC606
2/8 Doc ID 16284 Rev 1
1 Characteristics



o evaluate the conduction losses use the following equation:
P = 1.20x IF(AV) + 0.15 x IF2 (RMS)

Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified)
Table 3. Thermal resistance
Table 4. Static electrical characteristics (per diode)
tp = 10 ms, δ < 2% tp = 500 µs, δ < 2%
Table 5. Other parameters
STPSC606 Characteristics
Doc ID 16284 Rev 1 3/8


Figure 1. Forward voltage drop versus
forward current (typical values)
Figure 2. Reverse leakage current versus
reverse voltage applied
(maximum values)
Figure 3. Peak forward current versus case
temperature
Figure 4. Junction capacitance versus
reverse voltage applied
(typical values)
Characteristics STPSC606
4/8 Doc ID 16284 Rev 1

Figure 7. Total capacitive charges versus dIF /dt (typical values)


Figure 5. Relative variation of thermal
impedance junction to case
versus pulse duration
Figure 6. Non-repetitive peak surge forward
current versus pulse duration
(sinusoidal waveform)
STPSC606 Package information
Doc ID 16284 Rev 1 5/8
2 Package information
Epoxy meets UL94, V0 Cooling method: convection (C) Recommended torque: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 6. TO-220AC dimensions
Package information STPSC606
6/8 Doc ID 16284 Rev 1

Figure 8. Footprint (dimensions in mm)


Table 7. D2 PAK dimensions
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