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STPS3L40S
POWER SCHOTTKY RECTIFIER
STPS3L40SApril 2000- Ed:1A
POWER SCHOTTKY RECTIFIER
Schottky rectifier suitedfor Switched Mode Power
Supplies and high frequency DCto DC converters.
Packagedin SMC, this deviceis intendedfor use DC/DC chargers.
DESCRIPTION Negligible switching losses Low thermal resistance Low forward voltage drop
FEATURES AND BENEFITS
ABSOLUTE RATINGS (limiting values)
MAIN PRODUCT CHARACTERISTICS dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STPS3L40SPulse test:*tp= 380 μs,δ <2% evaluate the maximum conduction losses use the following equation:
P=0.30xIF(AV)+ 0.047IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
THERMAL RESISTANCES0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.00.0
PF(av)(W)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500.0
IF(av)(A)
Fig.2: Average forward current versus ambient
temperature(δ= 0.5).
Zth(j-a)/Rth(j-a)
Fig.4: Relative variationof thermal impedance
junctionto ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35μm, recommended
pad layout).
IM(A)
Fig. 3: Non repetitive surge peak forward
current versus overload duration (maximum
values).
STPS3L40S 5 10 15 20 25 30 35 401E-3
1E-2
1E-1
1E+0
1E+1
5E+1
IR(mA)
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.01
IFM(A)
Fig. 7: Forward voltage drop versus forward
current (maximum values). 5 10 20 4010
C(pF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values). 10 100 10000
IFSM(A)
Fig.8: Non repetitive surge peak forward current
versus numberof cycles.
0123 450
Rth(j-a) (°C/W)
Fig.9: Thermal resistance junctionto ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35μm).
:
www.ic-phoenix.com
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