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STPS3H100U
Schottky Barrier, Power Schottky
January 2010 Doc ID 16776 Rev 1 1/9
STPS3H100Power Schottky rectifier
Features Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and
forward voltage drop Avalanche capability specified
DescriptionThese Schottky rectifiers are designed for high
frequency miniature switched mode power
supplies such as adaptators and on board DC/DC
converters. They are available in SMB, and low-
profile SMB.
Table 1. Device summary
Characteristics STPS3H100
2/9 Doc ID 16776 Rev 1
1 Characteristics
o evaluate the conduction losses use the following equation:
P = 0.6 x IF(AV) + 0.027 IF2 (RMS)
Table 2. Absolute ratings (limiting values) condition to avoid thermal runaway for a diode on its own heatsink
Table 3. Thermal resistance
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2% Pulse test: tp = 380 µs, δ < 2%
STPS3H100 Characteristics
Doc ID 16776 Rev 1 3/9
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
Characteristics STPS3H100
4/9 Doc ID 16776 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 8. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
STPS3H100 Characteristics
Doc ID 16776 Rev 1 5/9
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(SMBflat)
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
Package Information STPS3H100
6/9 Doc ID 16776 Rev 1
2 Package Information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 5. SMB dimensions
