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Partno	Mfg	Dc	Qty	Available	Descript
STPS3150	ST	N/a	147	avai	POWER SCHOTTKY RECTIFIER
STPS3150RL	ST	N/a	1	avai	POWER SCHOTTKY RECTIFIER
STPS3150U	ST	N/a	1675	avai	POWER SCHOTTKY RECTIFIER

STPS3150U ,POWER SCHOTTKY RECTIFIERFEATURES AND BENEFITSDO-201ADn NEGLIGIBLE SWITCHING LOSSESSTPS3150n LOW FORWARD VOLTAGE DROP FORHIG ..
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STPS340BTR ,POWER SCHOTTKY RECTIFIER® STPS340U/S/BPOWER SCHOTTKY RECTIFIERMAIN PRODUCT CHARACTERISTICSI 3AF(AV)KV 40 VRRMTj (max) 150 ° ..
STPS340B-TR ,POWER SCHOTTKY RECTIFIERapplications where lowswitching losses are required.ABSOLUTE RATINGS (limiting values)Symbol Param ..
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STPS3150-STPS3150RL-STPS3150U
POWER SCHOTTKY RECTIFIER
STPS3150/U
April 2003- Ed:1A
POWER SCHOTTKY RECTIFIER
150V Power Schottky rectifier are suitedfor switch
Mode Power Suppliesonupto 24V rails and high
frequency converters.
Packaged in SMB and Axial, this deviceis
intended for use in consumer & computer
applications like TV, STB, PC and DVD where low
drop forward voltagein requiredto reduce power
dissipation.
DESCRIPTION NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP FOR
HIGHER EFFICIENCY AND EXTENDED
BATTERY LIFE LOW THERMAL RESISTANCE
FEATURES AND BENEFITS
ABSOLUTE RATINGS (limiting values)
MAIN PRODUCT CHARACTERISTICS dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STPS3150/U
THERMAL RESISTANCES
Pulse test:*tp= 380 μs,δ <2% evaluate the maximum conduction losses use the following equation:
P=0.59xIF(AV)+ 0.023xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS (W)F(AV)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Fig.1: Conduction losses versus average current. (A)F(AV)
3.5 25 50 75 100 125 150 175
Fig.2: Average forward current versus ambient
temperature(δ= 0.5). (A)M
1.E-03 1.E-02 1.E-01 1.E+00
Fig. 3-1: Nonrepetitive surge peak forward current
versus overload duration (maximum values)
(SMB). (A)M
1.E-03 1.E-02 1.E-01 1.E+00
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values)
(DO-201AD).
STPS3150/U
Z/Rth(j-c) th(j-c)
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 4-1: Relative variationof thermal impedance
junctionto ambient versus pulse duration (SMB).
Z/Rth(j-c) th(j-c)
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 4-2: Relative variationof thermal impedance
junction to ambient versus pulse duration
(DO-201AD). (μA)R
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04 25 50 75 100 125 150
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
C(nF)
1000 10 100 1000
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values). (A)FM
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Fig. 7: Forward voltage drop versus forward
current. (°C/W)th(j-a)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig.8: Thermal resistance junctionto ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, Cu: 35μm) (SMB).
STPS3150/U
PACKAGE MECHANICAL DATA
SMB
FOOT PRINT DIMENSIONS (in millimeters) (°C/W)th 1015 2025
Fig. 9: Thermal resistance versus lead length
(DO-201AD).
STPS3150/U
Information furnishedisbelievedtobeaccurateandreliable.However,STMicroelectronics assumesno responsibility fortheconsequencesof
useofsuch informationnorfor anyinfringementofpatentsorother rightsof third parties which mayresultfromits use.No licenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedes and replacesall information previously supplied.
STMicroelectronics productsarenot authorizedfor useas critical componentsinlife support devicesor systems without express written
approval ofSTMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2003 STMicroelectronics- Printedin Italy-All rights reserved.
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http:// Epoxy meets UL94,V0
PACKAGE MECHANICAL DATA
DO-201AD plastic
:
www.ic-phoenix.com
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