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STPS30100STSTN/a100avaiPower Schottky Rectifier


STPS30100ST ,Power Schottky Rectifierapplications a good efficiency at both low and high load. Table 1. Absolute Ratings (limiti ..
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STPS30100ST
Power Schottky Rectifier
October 2006 Rev 1 1/7
STPS30100ST

Power Schottky rectifier
Main product characteristics
Features and Benefits
Avalanche rated Low VF Good trade off between leakage current and
forward voltage drop High frequency operation Avalanche capability specified
Description

Single Schottky rectifier, suited for high frequency
switch mode power supply.
Packaged in TO-220AB, this device is intended to
be used in notebook and game station adaptors,
providing in these applications a good efficiency
at both low and high load.

Table 1. Absolute Ratings (limiting values)
condition to avoid thermal runaway for a diode on its own heatsink
dPtot
dTj--------------- 1
Rthja–()--------------------------<
Characteristics STPS30100ST
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1 Characteristics



To evaluate the conduction losses use the following equation:
P = 0.475 x IF(AV) + 0.006 x IF2 (RMS)
Table 2. Thermal resistance
Table 3. Static electrical characteristics (per diode)
Pulse test: tp = 5 ms, δ < 2% Pulse test: tp = 380 µs, δ < 2%
STPS30100ST Characteristics
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Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
Characteristics STPS30100ST
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Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 9. Forward voltage drop versus
forward current (high level)
Figure 10. Forward voltage drop versus
forward current (low level)
STPS30100ST Package Information
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2 Package Information

Epoxy meets UL94,V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOP ACK is an ST trademark.
ECOP ACK specifications are available at: .
Table 4. TO-220AB dimensions
Ordering Information STPS30100ST
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3 Ordering Information


4 Revision History


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