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STPS2L60
POWER SCHOTTKY RECTIFIER
STPS2L60/ANovember 2002- Ed:1A
POWER SCHOTTKY RECTIFIER
Axial and Surface Mount Power Schottky rectifier
suited for Switch Mode Power Supplies and high
frequency DC to DC converters. Packagedin
DO-41 and SMA, this deviceis intendedfor usein
low voltage, high frequency inverters and small
battery chargers.
DESCRIPTION NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP
FEATURES AND BENEFITS
ABSOLUTE RATINGS (limiting values)
MAIN PRODUCT CHARACTERISTICS dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STPS2L60/A
THERMAL RESISTANCESPulse test:*tp= 380 μs,δ <2% evaluate the maximum conduction losses use the following equation:
P=0.43xIF(AV) +0.06xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS (W)F(AV)0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Fig.1: Average forward power dissipation versus
average forward current.
(A)F(AV)2.2 25 50 75 100 125 150
Fig.2: Average forward current versus ambient
temperature(δ= 0.5).
(A)M1.E-03 1.E-02 1.E-01 1.E+00
Fig. 3-1: Nonrepetitive surge peak forward current
versus overload duration (maximum values)
(DO-41).
(A)M1.E-03 1.E-02 1.E-01 1.E+00
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values)
(SMA).
STPS2L60/A
Z/Rth(j-a) th(j-a)1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 4-1: Relative variationof thermal impedance
junctionto ambient versus pulse duration (DO-41).
Z/Rth(j-a) th(j-a)1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Fig. 4-2: Relative variationof thermal impedance
junctionto ambient versus pulse duration (SMA).
(μA)R1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05 102030 405060
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
C(pF)1000 10 100
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
(A)FM0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Fig. 7: Forward voltage drop versus forward
current (low level, maximum values).
(°C/W)th120 10152025
Fig. 8: Thermal resistance versus lead length
(DO-41).
STPS2L60/A
PACKAGE MECHANICAL DATASMA (JEDEC DO-214AC)
FOOT PRINT DIMENSIONS (in millimeters)
(°C/W)th(j-)0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 9-1: Thermal resistance junctionto ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, Cu: 35μm) (SMA).
012 34567 89 10
(°C/W)th(j-)
Fig. 9-2: Thermal resistance junctionto ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, Cu: 35μm) (DO-41).
STPS2L60/AInformation furnishedisbelievedtobeaccurateandreliable.However,STMicroelectronics assumesno responsibility fortheconsequencesof
useofsuch informationnorfor anyinfringementofpatentsorother rightsof third parties which mayresultfromits use.No licenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedes and replacesall information previously supplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express writtenap-
provalof STMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2002 STMicroelectronics- Printedin Italy-All rights reserved.
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http:// Epoxy meets UL94,V0
PACKAGE MECHANICAL DATADO-41 plastic
:
www.ic-phoenix.com
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