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STPS2545CT
POWER SCHOTTKY RECTIFIER
STPS2545CT/CG/CFPApril 2002- Ed:1A
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS Very small conduction losses Negligible switching losses Extremely fast switching Low thermal resistance
FEATURES AND BENEFITSDual center tap Schottky rectifier suited for
Switch Mode Power Supplies and high fre-
quency DCto DC converters.
This deviceis especially intended for usein low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
DESCRIPTION
ABSOLUTE RATINGS (limiting values, per diode)
* : dPtot
dTj Rthj a< − thermal runaway condition for a diode on its own heatsink
STPS2545CT/CG/CFP
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Pulse test:*tp= 380μs,δ <2% evaluate the conduction losses use the following equation:
P=0.42xIF(AV)+ 0.012xIF2 (RMS)
0.0 2.5 5.0 7.5 10.0 12.5 15.0 (W)F(AV)
Fig.1: Conduction losses versus averagecurrent.
25 50 75 100 125 150 175 (A)F(AV)
Fig.2: Average forward current versus ambient
temperature (δ=0.5).
When the diodes 1 and 2 are used simultaneously :Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STPS2545CT/CG/CFP
1.E-03 1.E-02 1.E-01 1.E+00(A)M
Fig. 3-1: Non repetitive surge peak forward current
versus overload duration (maximum values)
(TO-220AB, D²PAK).
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02 5 10 15 20 25 30 35 40 45 (mA)R
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
1.E-03 1.E-02 1.E-01 1.E+00
Zth(j-c) / Rth(j-c)
Fig. 4-1: Relative variationof thermal impedance
junctionto case versus pulse duration (TO-220AB,2 PAK).
1.E-03 1.E-02 1.E-01 1.E+00(A)M
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values)
(TO-220FPAB).
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Zth(j-c) / Rth(j-c)
Fig. 4-2: Relative variationof thermal impedance
junction tocase versus pulse duration (TO-220FPAB).
10.0 10 100
C(nF)
Fig.6: Junction capacitance versus reverse volt-
age applied (typical values).
STPS2545CT/CG/CFP
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 (A)FM
Fig.7: Forward voltage drop versus forward cur-
rent.
5 10 15 20 25 30 35 40
Rth(j-a)(°C/W)
Fig.8: Thermal resistance junctionto ambient
versus copper surface under tab (epoxy printed
board FR4, Cu= 35μm).
PACKAGE MECHANICAL DATATO-220AB
STPS2545CT/CG/CFP
PACKAGE MECHANICAL DATATO-220FPAB
STPS2545CT/CG/CFP
PACKAGE MECHANICAL DATA2 PAK
FOOTPRINT
