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Partno	Mfg	Dc	Qty	Available	Descript
STPS20L25CT	ST	N/a	14200	avai	LOW DROP POWER SCHOTTKY RECTIFIER

STPS20L25CT ,LOW DROP POWER SCHOTTKY RECTIFIERAPPLICATIONS2TO-220AB D PAKSTPS20L25CT STPS20L25CGDESCRIPTIONDual center tap Schottky rectifier sui ..
STPS20L40CF ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 40 VRRMRepet ..
STPS20L40CFP ,LOW DROP POWER SCHOTTKY RECTIFIERFEATURES AND BENEFITSA2Kn Low forward voltage drop meaning very smallA2 A1Kconduction lossesA1TO-22 ..
STPS20L45CFP ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 45 VRRMRepet ..
STPS20L45CG-TR ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 45 VRRMRepet ..
STPS20L45CT ,LOW DROP POWER SCHOTTKY RECTIFIERFEATURES AND BENEFITSA2n Low forward voltage drop meaning very smallKA1conduction lossesA2Kn Low sw ..
T1121NL , TELECOMMUNICATIONS PRODUCTS
T1122 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500Vrms, Extended and Standard Temperature Range
T1124NL , TELECOMMUNICATIONS PRODUCTS
T1129NL , TELECOMMUNICATIONS PRODUCTS
T1133 , TRIANGULAR TYPE
T1136 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500 Vrms, Extended and Standard Temperature Range

STPS20L25CT
LOW DROP POWER SCHOTTKY RECTIFIER
STPS20L25CT/CG
June 1999 - Ed : 3A
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
FEATURES AND BENEFITS
Dual center tap Schottky rectifier suited to
Switched Mode Power Supplies and high
frequency DC to DC converters.
Packaged in TO-220AB and D2 PAK, this device is
especially intended for use as a rectifier at the
secondary of 3.3V SMPS units.
DESCRIPTION
ABSOLUTE RATINGS (limiting values, per diode)
* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/5
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Pulse test : * tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.22 x IF(AV) + 0.013 IF2 (RMS) 23456789 10 110
PF(av)(W)
Fig.1 : Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500 IF(av)(A)
Fig.2 : Average forward current versus ambient
temperature ( δ = 0.5).
When the diodes 1 and 2 are used simultaneously : Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STPS20L25CT/CG
2/5
1E-3 1E-2 1E-1 1E+00
200 IM(A)
Fig.3 : Non repetitive surge peak forward current
versus overload duration (maximum values). 5 10 15 20 251E-2
1E-1
1E+0
1E+1
1E+2
5E+2 IR(mA)
Fig.5 : Reverse leakage current versus reverse
voltage applied (typical values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig.4 : Relative variation of thermal impedance
junction to case versus pulse duration. 5 10 20 500.1
C(nF)
Fig.6 : Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)
0.0 0.1 0.2 0.3 0.40.5 0.6 0.7 0.8 0.9 1.00.1
Fig.7 : Forward voltage drop versus forward
current (maximum values). 4 8 12 16 20 24 28 32 36 400
Rth(j-a) (°C/W)
Fig.8 : Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 μm).
(STPS20L25G only)
STPS20L25CT/CG
3/5
PACKAGE MECHANICAL DATA2 PAK
FOOTPRINT DIMENSIONS (in millimeters) Cooling method: by conduction (method C)
STPS20L25CT/CG
4/5
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATA
TO-220AB
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
Epoxy meets UL94,V0
STPS20L25CT/CG
5/5
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