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STPS1L40A-STPS1L40U
LOW DROP POWER SCHOTTKY RECTIFIER
STPS1L40A/UJuly 1999 - Ed: 3A
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICSVERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNT MINIATURE PACKAGE
FEATURES AND BENEFITSSingle chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB, this device is
especially intended for surface mounting and used
in low voltage, high frequency inverters, free
wheeling and polarity protection applications.
DESCRIPTION
ABSOLUTE RATINGS (limiting values)* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/5
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICSPulse test : * tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.23 x IF(AV) + 0.19 IF2 (RMS)
0.0 0.2 0.4 0.6 0.8 1.0 1.20.00
PF(av)(W)
Fig. 1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500.0
1.2
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3-1: Non repetitive surge peak forward cur-rent versus overload duration (maximum values)
(SMB).
1E-3 1E-2 1E-1 1E+00.0
6.0
IM(A)
Fig. 3-2: Non repetitive surge peak forward cur-rent versus overload duration (maximum values)
(SMA).
STPS1L40A/U2/5
5 10 15 20 25 30 35 401E-31E-2
1E-1
1E+0
1E+1
2E+1
IR(mA)
Fig. 5: Reverse leakage current versus reversevoltage applied (typical values). 5 10 20 5010
C(pF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values). 100 200 300 400 500 600 700 800 900 10000.01
IFM(A)
Fig. 7-1: Forward voltage drop versus forward cur-
rent (typical values, high level).
1E-2 1E-1 1E+0 1E+1 1E+2 5E+20.0
Zth(j-a)/Rth(j-a)
Fig. 4-1: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35μm, recommended
pad layout) (SMB).
1E-2 1E-1 1E+0 1E+1 1E+2 5E+20.0
Zth(j-a)/Rth(j-a)
Fig. 4-2: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35μm, recommended
pad layout) (SMA). 100 200 300 400 500 600 700 8000.0
3.0
IFM(A)
Fig. 7-2: Forward voltage drop versus forward cur-rent (typical values, low level).
STPS1L40A/U3/5
PACKAGE MECHANICAL DATASMA
FOOT PRINT DIMENSIONS (in millimeters)0123 450
Rth(j-a) (°C/W)
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness e(Cu)=
35μm) (SMA).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.00
Rth(j-a) (°C/W)
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness
e(Cu)= 35μm) (SMB).
STPS1L40A/U4/5
PACKAGE MECHANICAL DATASMB
FOOT PRINT DIMENSIONS (in millimeters). consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://Band indicates cathode
Epoxy meets UL94,V0
STPS1L40A/U5/5
:
www.ic-phoenix.com
.
