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STPS1H100MF
High Voltage Power Schottky Rectifier
May 2008 Rev 1 1/7
STPS1H100MFHigh voltage power Schottky rectifier
Features Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and
forward voltage drop Avalanche capability specified
DescriptionSchottky rectifier designed for high frequency
miniature switch mode power supplies such as
adaptors and on-board DC/DC convertors. This
device is packaged in STmite flat.
Table 1. Device summary
Characteristics STPS1H100MF
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1 Characteristics
o evaluate the conduction losses use the following equation: P = 0.54 x IF(AV) + 0.08 IF2
(RMS)
Table 2. Absolute ratings (limiting values) condition to avoid thermal runaway for a diode on its own heatsink
Table 3. Thermal resistance
Table 4. Static electrical characteristics Pulse test: = 5 ms, δ < 2% Pulse test: = 380 µs, δ < 2%
dPtot
dTj--------------- 1
Rthja–()--------------------------<
STPS1H100MF Characteristics
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Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Forward voltage drop versus
forward current
Characteristics STPS1H100MF
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Figure 7. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (epoxy
printed circuit board, copper
thickness = 35 µm, recommended
pad layout)
Figure 8. Thermal resistance, junction to
ambient, versus copper surface
under each lead (epoxy
printed board FR4,
copper thickness = 35 µm)
Figure 9. Reverse leakage current versus
voltage applied (typical values)
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
STPS1H100MF Package information
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2 Package information Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at .
Figure 11. STmite flat recommended footprint (all dimensions in mm)
Table 5. STmite flat dimensions
Ordering information STPS1H100MF
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3 Ordering information
4 Revision history
Table 6. Ordering information
Table 7. Document revision history
