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STPS1H100A
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
STPS1H100A/UJuly 1999 - Ed: 3A
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICSNEGLIGIBLE SWITCHING LOSSES
HIGH JUNCTION TEMPERATURE CAPABILITY
LOW LEAKAGE CURRENT
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
AVALANCHE RATED
FEATURES AND BENEFITSSchottky rectifier designed for high frequency
miniature Switched Mode Power Supplies such as
adaptators and on board DC/DC converters.
Packaged in SMA or SMB.
DESCRIPTION
ABSOLUTE RATINGS (limiting values)* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/6
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS Pulse test : * tp = 5 ms, δ < 2%
** tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.54 IF(AV) + 0.08 IF2 (RMS)
PF(av)(W)
Fig. 1: Average forward power dissipation versus
average forward current. 20 40 60 80 100 120 140 160 1800.0
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
STPS1H100A/U2/6
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3: Non repetitive surge peak forward currentversus overload duration (maximum values)
(SMB).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+20.01
Zth(j-a)/Rth(j-a)
Fig. 5: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB). 10 10010
C(pF)
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values). 102030405060708090 100
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
2E+2
IR(μA)
Fig. 7: Reverse leakage current versus reversevoltage applied (typical values).
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 4: Non repetitive surge peak forward currentversus overload duration (maximum values)
(SMA).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+20.01
Zth(j-a)/Rth(j-a)
Fig. 6: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMA).
STPS1H100A/U3/6
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.61E-2
1E-1
1E+0
1E+1
2E+1
IFM(A)
Fig. 11: Forward voltage drop versus forward
current (maximum values).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.020
Rth(j-a) (°C/W)
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness: 35μm)
(SMA).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.020
Rth(j-a) (°C/W)
Fig. 9: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness: 35μm)
(SMB).
STPS1H100A/U4/6
PACKAGE MECHANICAL DATASMA
FOOT PRINT (in millimeters)
STPS1H100A/U5/6
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATASMB
FOOT PRINT (in millimeters)Band indicates cathode
Epoxy meets UL94,V0
STPS1H100A/U6/6
