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STPS16H100CG
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
STPS16H100CT/CG/CFP/CRApril 2002- Ed:1A
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS Negligible switching losses High junction temperature capability Low leakage current Good tradeoff between leakage current and for-
ward voltage drop
FEATURES AND BENEFITSDual center tap Schottky rectifier designed for
high frequency miniature Switch Mode Power
Supplies such as adaptators and on board
DC/DC converters.
DESCRIPTION
ABSOLUTE RATINGS (limiting values, per diode)
* : dPtot
dTj Rthj a< − thermal runaway condition for a diode on its own heatsink
STPS16H100CT/CG/CFP/CR
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Pulse test:* tp=5ms,δ <2%tp= 380μs,δ <2% evaluate the conduction losses use the following equation:
P=0.55xIF(AV)+ 0.011xIF2 (RMS)
012 34567 89 10 (W)F(AV)
Fig.1: Conduction losses versus averagecurrent.
25 50 75 100 125 150 175 (A)F(AV)
Fig.2: Average forward current versus ambient
temperature (δ=0.5).
When the diodes 1 and 2 are used simultaneously :Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STPS16H100CT/CG/CFP/CR
1.E-03 1.E-02 1.E-01 1.E+00(A)M
Fig. 3-1: Non repetitive surge peak forward current
versus overload duration (maximum values)
(TO-220AB, D²PAK, I²PAK).
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01 102030405060708090 100 (mA)R
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
1.E-03 1.E-02 1.E-01 1.E+00
Zth(j-c) / Rth(j-c)
Fig. 4-1: Relative variationof thermal impedance
junctionto case versus pulse duration (TO-220AB,
D²PAK & I²PAK).
1.E-03 1.E-02 1.E-01 1.E+00(A)M
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values)
(TO-220FPAB).
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Zth(j-c) / Rth(j-c)
Fig. 4-2: Relative variationof thermal impedance
junction tocase versus pulse duration (TO-220FPAB).
1.00 10 100
C(nF)
Fig.6: Junction capacitance versus reverse volt-
age applied (typical values).
STPS16H100CT/CG/CFP/CR
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 (A)FM
Fig.7: Forward voltage drop versus forward cur-
rent.
5 10 15 20 25 30 35 40
Rth(j-a)(°C/W)
Fig.8: Thermal resistance junctionto ambient
versus copper surface under tab (epoxy printed
board FR4, Cu= 35μm).
PACKAGE MECHANICAL DATATO-220AB
STPS16H100CT/CG/CFP/CR
PACKAGE MECHANICAL DATATO-220FPAB
STPS16H100CT/CG/CFP/CR
PACKAGE MECHANICAL DATA2 PAK
FOOTPRINT
