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STPS140Z
POWER SCHOTTKY RECTIFIER
STPS140ZJanuary 2002-Ed:1B
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING
FEATURES AND BENEFITSSingle Schottky rectifier suitedfor Switchmode
Power Suppliesand high frequencyDCtoDC con-
verters.
Packagedin SOD-123,this deviceis intendedfor
usein low voltage, high frequency inverters, free
wheeling and polarity protection applications. Duethe small sizeofthe packagethis devicefit GSM
and PCMCIA requirements.
DESCRIPTION
ABSOLUTE RATINGS (limiting values) dPtot
dTj Rthja< − thermal runaway conditionfora diodeonits own heatsink
STPS140Zwith50mm2 copperarea (e=35μm)
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICSPulsetest:* tp=5ms,δ <2%tp=380μs,δ <2% evaluatethe maximum conduction losses usethe following equation:
P=0.2xIF(AV) +0.3xIF2 (RMS)atTj= 150°C
0.00.1 0.20.30.40.5 0.60.70.80.9 1.01.10.0
PF(av)(W)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500.0
IF(av)(A)
Fig.2: Average forward current versus ambient
temperature (δ=1).
STPS140Z1E-3 1E-2 1E-1 1E+00
IM(A)
Fig.3: Non repetive surge peak forward current
versus overload duration (maximum values).
1E-2 1E-1 1E+0 1E+1 5E+11E-2
1E-1
1E+0
Zth(j-a)/Rth(j-a)
Fig.4: Relative variationof thermal impedance junction ambient versus pulse duration (epoxy printed circuit
board FR4with recommendedpad layout). 5 10 15 20 25 30 35 401E-4
1E-3
1E-2
1E-1
1E+0
1E+1
5E+1
IR(mA)
Fig.5: Reverse leakage current versus reverse
voltage applied (typical value). 25 50 75 100 125 1501E-1
1E+0
1E+1
1E+2
1E+3
5E+3
IR[Tj] / IR[Tj=25°C]
Fig.6: Reverse leakage current versus junction
temperature (typical value). 5 10 20 5010
C(pF)
Fig.7: Junction capacitance versus reverse
voltage applied (typical value).
0.00.10.20.30.40.50.60.70.80.91.01.11.21E-2
1E-1
1E+0
5E+0
IFM(A)
Fig. 8-1: Forward voltage drop versus forward
current (high level, maximum values).
STPS140Z 1020304050 60708090 100100
Rth(j-a) (°C/W)
Fig.9: Thermal resistance junctionto ambient
versus copper surface (epoxy printed circuit board
FR4, copper thickness: 35μm).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.00.0
IFM(A)
Fig. 8-2: Forward voltage drop versus forward
current (low level, maximum values).
STPS140ZInformation furnishedisbelieved tobeaccurateand reliable. However, STMicroelectronicsassumesno responsibilityforthe consequencesof
useofsuch informationnorforany infringementofpatentsor otherrightsofthirdpartieswhichmay result fromitsuse.Nolicenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice.This publication supersedesand replacesall information previously supplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express writtenap-
provalof STMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2002 STMicroelectronics- PrintedinItaly-All rights reserved.
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http://
PACKAGE MECHANICAL DATASOD-123 Plastic Epoxy meets UL94,V0 Band indicates cathode
MARKING
FOOTPRINT (in millimeters)
:
www.ic-phoenix.com
.
