STPS140A ,POWER SCHOTTKY RECTIFIERFEATURES AND BENEFITSVERY SMALL CONDUCTION LOSSESNEGLIGIBLE SWITCHING LOSSESLOW FORWARD VOLTAGE DRO ..
STPS140A ,POWER SCHOTTKY RECTIFIERapplications.(*) in accordance with DO214AAand DO21AC JEDECABSOLUTE RATINGS (limiting values)Symbo ..
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T1075NL , TELECOMMUNICATIONS PRODUCTS
T1077 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500 Vrms, Extended and Standard Temperature Range
T1077NL , TELECOMMUNICATIONS PRODUCTS
T1078 , TELECOMMUNICATIONS PRODUCTS
T1080 , TELECOMMUNICATIONS PRODUCTS
T1090 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500 Vrms, Extended and Standard Temperature Range
STPS140A-STPS140U
POWER SCHOTTKY RECTIFIER
STPS140A/UJuly 1998 - Ed: 6B
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICSVERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNTED DEVICE
FEATURES AND BENEFITSSingle chip Schottky rectifier suited for Switch-
mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB(*), this device is in-
tended for surface mounting and used in low volt-
age, high frequency inverters, free wheeling and
polarity protection applications.
(*) in accordance with DO214AAand DO21AC JEDEC
DESCRIPTION
ABSOLUTE RATINGS (limiting values)1/6
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICSPulse test : * tp = 5 ms, δ < 2 %
** tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.4 x IF(AV) + 0.10 x IF2 (RMS)
0.0 0.2 0.4 0.6 0.8 1.0 1.20.0
PF(av)(W)
Fig. 1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500.0
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
STPS140A/U2/6
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3-1: Non repetivesurge peak forward current
versus overload duration (maximum values) (SMB).
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3-2: Non repetivesurge peak forward current
versus overload duration (maximum values) (SMA).
1E-2 1E-1 1E+0 1E+1 1E+2 1E+30.0
Zth(j-a)/Rth(j-a)
Fig. 4-1: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB).
1E-2 1E-1 1E+0 1E+1 1E+20.0
Zth(j-a)/Rth(j-a)
Fig. 4-2: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMA). 5 10 15 20 25 30 35 401E-2
1E-1
1E+0
1E+1
1E+2
1E+3
IR(μA)
Fig. 5: Reverse leakage current versus reversevoltage applied (typical values). 5 10 20 5010
C(pF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values)
STPS140A/U3/6
0.0 0.1 0.2 0.30.4 0.5 0.6 0.7 0.8 0.9 1.01E-2
1E-1
1E+0
1E+1
IFM(A)
Fig. 7: Forward voltage drop versus forward
current (maximum values).
012 3450
Rth(j-a) (°C/W)
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35μm)(SMB). 2 3 4 50
Rth(j-a) (°C/W)
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35μm)(SMA).
STPS140A/U4/6
PACKAGE MECHANICAL DATASMA
Marking: S140
FOOT PRINT (in millimeters)
STPS140A/U5/6
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATASMB Plastic
FOOT PRINT (in millimeters) Marking: G14
STPS140A/U6/6
