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STPAC01F1STMN/a1180avaiRF DETECTOR FOR POWER AMPLIFIER CONTROL


STPAC01F1 ,RF DETECTOR FOR POWER AMPLIFIER CONTROLapplications are cellular phones and PDADC Vusing GSM, DCS, PCS, AMPS, TDMA , CDMAATempoutand 800MH ..
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STPAC01F1
RF DETECTOR FOR POWER AMPLIFIER CONTROL
STPAC01F1
January 2003 - Ed: 1
PIN CONFIGURATION (ball side)
The useof IPAD technology allows the RF
front-end designerto save PCB area andto
drastically suppress parasitic inductances.
BENEFITS

RF DETECTOR FOR
POWER AMPLIFIER CONTROLIPADTM
The STPAC01F1 has two outputs, one for thesignal detection and another one for the
temperature compensation: VDCout= 0.88Vat 0.85 GHzat10 dBm VDCout= 1.07Vat 1.85 GHzat10 dBm Vsupply=5V max.
MAIN PRODUCT CHARACTERISTICS

The STPAC01isan integrated RF detectorfor the
power control stage.It converts RF signal coming
from the coupler intoa DC signal usableby the
digital stage.Itis basedon the useof two similar
diodes, one providing the signal detection while
the second oneis usedto providea temperature
information to thermal compensation stage.A
biasing stage suppresses the detection diode drop
voltage effect.
Target applications are cellular phones and PDA
using GSM, DCS, PCS, AMPS, TDMA, CDMA
and 800MHzto 1900MHz frequency ranges
DESCRIPTION
: IPADisa trademarkof STMicroelectronics.
FUNCTIONAL DIAGRAM
STPAC01F1
ABSOLUTE RATINGS
(Tamb= 25°C)
ELECTRICAL CHARACTERISTICS
(Tamb= 25°C)
PARAMETERS RELATED TO BIAS VOLTAGE
PARAMETERS RELATED TO TEMPERATURE FUNCTION
PARAMETERS RELATED TO DETECTION FUNCTION (VBIAS
= 2.7V, DC output load= 100 kΩ)
STPAC01F1
APPLICATION DIAGRAM

The STPAC01is the first partof the power amplifier stage and provides both RF power and dietemperature measurements. The above figure gives the basic circuitof RF detector. coupler locatedon the line between RF amplifier output and the antenna takesa partof the availablepower and appliesitto STPAC01 RF input.
The RF detector and the low pass filter providea DC voltage depending on the input power. Thermalcompensation providesa DC voltage dependingon the ambient temperature.As the detection system andthe thermal compensation are based on the same topology, VDCout will have the same temperature
variationas Vtemp. Connectedtoa differential amplifier, the output willbea voltage directly linkedto theRF input power. VDCout and Vtemp mustbe bias with 50μA DC current.
This topology offers the most accurate output valueasitis 100% compensated.
Fig.1:
VDCout measurement circuit.
-20 -15 -10 -5 0 5 10
Pin (dBm)
VDCout
Fig.2:
VDCout versus RF input power.
STPAC01F1
800 825 850 875 900
Frequency in MHz
VDCout (Freq.) / VDCOut(850MHz)
Fig. 3:
Relative variation of VDCout versus
frequency (from 800to 900 MHz).
VDCout (Freq.) / VDCOut(850MHz)

1800 1825 1850 1875 1900
Frequency in MHz
Fig. 4:
Relative variation of VDCout versus
frequency (from 1800to 1900 MHz).
Fig.5:
Temperature effect measurement circuiton
VDCout.
Temp.
voltage
Fig.6:
Vtemp measurement circuit.
1.98 1020 30 40 50 6070
Tamb(°C)
Vtemp
Fig. 7:
Vtemp output voltage versus ambient
temperature.
STPAC01F1
MARKING
FOOT PRINT RECOMMENDATIONS
STPAC01F1
Information furnishedis believedtobeaccurateandreliable.However,STMicroelectronics assumesno responsibility fortheconsequencesof
useofsuchinformationnorfor anyinfringementof patentsorother rightsof third parties whichmayresultfromits use.Nolicenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedes and replacesall information previously supplied.
STMicroelectronics productsarenot authorizedfor useas critical componentsinlife support devicesor systems without express written
approval ofSTMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2003 STMicroelectronics- Printedin Italy-All rights reserved.
STMicroelectronics GROUPOF COMPANIES
Australia- Brazil- Canada- China- Finland- France- Germany
Hong Kong- India- Israel- Italy- Japan- Malaysia- Malta- Morocco- Singapore
Spain- Sweden- Switzerland- United Kingdom- United States.
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Note:
More packing informations are availablein the application note AN1235: ''Flip-Chip: Package description and
recommandationsfor use''
FLIP-CHIP TAPE AND REEL SPECIFICATION
OTHER INFORMATION
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