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STP6NC80Z |STP6NC80ZST N/a40avaiN-CHANNEL 800V 1.5OHM 5.4A TO-220/TO-220FP/D2PAK/I2PAK/ ZENER-PROTECTED POWERMESH III MOSFET
STP6NC80ZFPSTN/a71avaiN-CHANNEL 800V 1.5OHM 5.4A TO-220/TO-220FP/D2PAK/I2PAK/ ZENER-PROTECTED POWERMESH III MOSFET


STP6NC80ZFP ,N-CHANNEL 800V 1.5OHM 5.4A TO-220/TO-220FP/D2PAK/I2PAK/ ZENER-PROTECTED POWERMESH III MOSFETABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitSTP(B)6NC80Z(-1) STP6NC80ZFPV Drain-source Volta ..
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STP6NC80Z -STP6NC80ZFP
N-CHANNEL 800V 1.5OHM 5.4A TO-220/TO-220FP/D2PAK/I2PAK/ ZENER-PROTECTED POWERMESH III MOSFET
1/13December 2002
STP6NC80Z- STP6NC80ZFP
STB6NC80Z- STB6NC80Z-1

N-CHANNEL 800V- 1.5Ω - 5.4A TO-220/FP/D²PAK/I²PAK
Zener-Protected PowerMESH™III MOSFET TYPICAL RDS(on)= 1.5Ω EXTREMELY HIGH dv/dt AND CAPABILITY
GATE-TO- SOURCE ZENER DIODES 100% AVALANCHE TESTED VERY LOW GATE INPUT RESISTANCE GATE CHARGE MINIMIZED
DESCRIPTION

The third generationof MESH OVERLAY™ Power
MOSFETs for very high voltage exhibits unsurpassed
on-resistance per unit area while integrating back-to-
back Zener diodes between gate and source. Such ar-
rangement gives extra ESD capability with higher rug-
gedness performanceas requestedbya large variety single-switch applications.
APPLICATIONS
SINGLE-ENDED SMPSIN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION WELDING EQUIPMENT
ABSOLUTE MAXIMUM RATINGS

(•)Pulse width limitedby safe operating area
(1)ISD ≤5.4A, di/dt ≤100A/μs, VDD≤ V(BR)DSS,Tj≤ TJMAX
.(*)Pulse width Limitedby maximum temperature allowed
STP6NC80Z/FP/STP6NC80Z-1
2/13
THERMAL DATA
AVALANCHE CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
(TCASE=25°C UNLESS OTHERWISE SPECIFIED)
OFF (1)
DYNAMIC
3/13
STP6NC80Z/FP/STP6NC80Z-1
ELECTRICAL CHARACTERISTICS
(CONTINUED)
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
GATE-SOURCE ZENER DIODE
Note:1. Pulsed: Pulse duration=300μs, duty cycle1.5%. Pulse width limitedby safe operating area. ΔVBV= αT(25°-T) BVGSO(25°)
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES

The built-in back-to-back Zener diodes have specifically been designedto enhance not only the device’s
ESD capability, but alsoto make them safely absorb possible voltage transients that may occasionally applied from gateto source.In this respect the Zener voltageis appropriateto achievean efficient
and cost-effective interventionto protect the device’s integrity. These integrated Zener diodes thus avoid
the usageof external components.
STP6NC80Z/FP/STP6NC80Z-1
4/13
Safe Operating Area For TO-220FPSafe Operating Area For TO-220 /D²PAK/I²PAK
Thermal Impedance For TO-220 /D²PAK/I²PAK
Output Characteristics
5/13
STP6NC80Z/FP/STP6NC80Z-1
Capacitance Variations
Normalized On Resistancevs TemperatureNormalized
Gate Chargevs Gate-source Voltage
Static Drain-source On ResistanceTransconductance
6/13
STP6NC80Z/FP/STP6NC80Z-1
Source-drain Diode Forward Characteristics
7/13
STP6NC80Z/FP/STP6NC80Z-1
Fig.5:
Test For Inductive
Fig.4:
Gate Charge test Circuit
Fig.3:
Switching
Resistive Load
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