STM961-15B ,RF POWER MODULE DIGITAL CELLULAR APPLICATIONSapplications in the915-960 MHz frequency range operating at 26V.ORDER CODE BRAND ..
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STM961-15B
RF POWER MODULE DIGITAL CELLULAR APPLICATIONS
STM961-15BRF POWER MODULE
DIGITAL CELLULAR APPLICATIONS LINEAR POWER AMPLIFIER 915-960 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS POUT = 42 dBm CW or PEP GAIN = 30 dB
DESCRIPTION The STM961-15B module is designed for digital
cellular radio base station applications in the
915-960 MHz frequency range operating at 26V.
The STM961-15B is designed to meet the low
distortion, high linearity requirements of modern
digital cellular base station equipment.
June 1999
ABSOLUTE MAXIMUM RATINGS (Tcase = 85 oC)
1/7
ELECTRICAL SPECIFICATION (Tcase = -10 o C to +85o C, VS1 = 26 V, VB = 26 V to 27 V)
DYNAMICMODULE DC AND TEST FIXTURE CONFIGURATION
REF. 1017332I
REF. 1014532D
STM961-15B2/7
Power Gain vs Output Power
OUTPUT POWER [dBm]
IN[ 20 30 343638404229
Power Gain vs Frequency & Temperature
3rd Order IMD vs Output Power & Temperature
PEP [dBm]2224262830323436384042
Power Gain vs Output Power
OUTPUTPOWER [dBm]
IN[ 20 30 343638404229.5
3rd Order IMD vs Output Power & Temperature
PEP [dBm]2224262830323436384042
5th Order IMD vs Output Power & Temperature
PEP [dBm]2224262830323436384042
FREQUENCY [MHz]
IN[
900 910 920 930 940 950 960 970 98029
TYPICAL PERFORMANCE
see note 1
see note 1see note 1
STM961-15B3/7
OUTPUT POWER [dBm]
ICI 34 36 38 40 427
5th Order IMD vs Output Power & Temperature
PEP [dBm]2224262830323436384042
Efficiency vs Frequency
FREQUENCY [MHz]
IEN
[%]
900 910 920 930 940 950 960 970 98034.5
CW Efficiency vs Output Power & Temperature CW Efficiency vs Output Power & Temperature
OUTPUT POWER [dBm]
ICI 34 36 38 40 427
VSWR vs Frequency & Temperature
FREQUENCY[MHz]
VSW
900 910 920 930 940 950 960 970 9801
Note (1) :
Two-tone test; 20KHz separation;
IMD (in dBT) is referenced to the individual tone level.
TYPICAL PERFORMANCE
see note 1
STM961-15B4/7
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITSThe STM961-15B power module should never
be operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
subjected to one or more of the maximum rating
conditions, care must be taken to monitor other
parameters which may be affected.
DECOUPLINGFailure to properly decouple any of the voltage
supply pins will result in oscillations at certain
operating frequencies. Therefore, it is
recommended that these pins be bypassed as
indicated in the Module DC and Test Fixture
Configuration drawing of this data sheet.
MODULE MOUNTINGTo insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the
module should be flat to within ± 0.05mm (±
0.002 inch). The module should be mounted to
the heatsink using 3.5 mm (or 6-32) or
equivalent screws torqued to 5-6 kg-cm (4-6
in-lb).
The module leads should be attached to
equipment PC board using 180°C solder
applied to the leads with a properly grounded
soldering iron tip, not to exceed 195°C, applied
a minimum of 2 mm (0.080 inch) from the body
of the module for a duration not to exceed 15
seconds per lead. It is imperative that no other
portion of the module, other than the leads, be
subjected to temperatures in excess of 100°C
(maximum storage temperature), for any period
of time, as the plastic moulded cover, internal
components and sealing adhesives may be
adversely affected by such conditions.
Due to the construction techniques and
materials used within the module, reflow
soldering of the flange heatsink or leads, is not
recommended.
THERMAL CONSIDERATIONSIt will be necessary to provide a suitable
heatsink in order to maintain the module flange
temperature at or below to maximum case
operating temperature. In a case where the
module output power limited to +42 dBm CW
and designing for the worst case efficiency of
32%, the power dissipated by the module will
be 33.6 Watts. The heatsink must be designed
such that the thermal rise will be less than the
difference between the maximum operating
case temperature of the module while
dissipating 33.6 W.
At Tcase = +85 o C, V = 26V, ZL = 50 Ω and POUT 42 dBm, maximum junction temperatures for
the individual transistors should be below the
following values:
Q1 = 140 o C, Q2 = 145 o C, Q3 = 130 oC.
STM961-15B5/7
STM961-15B6/7
