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STG3220QTR
Low Voltage High Bandwidth Dual SPDT Switch
May 2009 Doc ID 15647 Rev 1 1/23
STG3220Low voltage high bandwidth dual SPDT switch
Features Ultra low power dissipation:
–ICC = 1 μA (max.) at TA = 85°C Low "ON" resistance:
–RON = 4.8 Ω (TA = 25 ºC) at VCC = 4.3V
–RON = 5.9 Ω (TA = 25 ºC) at VCC = 3.0V Wide operating voltage range:
–VCC (opr) = 1.65 V to 4.3V 4.3 V tolerant and 1.8 V compatible threshold
on digital control input at VCC = 2.3 V to 3.0V Typical bandwidth (-3 dB) at 800 MHz on all
channels USB (2.0) high speed (480 Mbps) signal
switching compliant Integrated fail safe function Interrupt function to indicate to the processor
that the device is in dedicated port charging
mode Latch-up performance exceeds 500 mA per
JESD 78, Class II ESD performance exceeds JESD22: Dn pins: 4000-V human body model
(A114-A) All other pins: 2000-V human body model
(A114-A)
Applications Mobile phones
DescriptionThe STG3220 is a high-speed CMOS low voltage
dual analog SPDT (single pole dual throw) switch
or 2:1 multiplexer/de-multiplexer switch fabricated
in silicon gate C2 MOS technology. It is designed
to operate from 1.65 V to 4.3 V, making this
device ideal for portable applications.
The SEL input is provided to control the switch.
The switch nS1 is ON (connected to common
ports Dn) when the SEL input is held high and
OFF (high impedance state exists between the
two ports) when SEL is held low; the switch nS2 is
ON (it is connected to common port Dn) when the
SEL input is held low and OFF (high impedance
state exists between the two ports) when SEL is
held high. STG3220 has an integrated fail safe
function to withstand over-voltage condition when
the device is powered off.
The STG3220 also has an interrupt pin which
sends a signal to the processor when the device
is in dedicated port charging mode. Additional key
features are fast switching speed, break-before-
make-delay time and ultra low power
consumption. All inputs and outputs are equipped
with protection circuits against static discharge,
giving them ESD immunity and transient excess
voltage.
Table 1. Device summary
Contents STG32202/23 Doc ID 15647 Rev 1
Contents Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Dedicated port charging detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
STG3220 Pin settings
Doc ID 15647 Rev 1 3/23
1 Pin settings
Figure 1. Pin connection (top through view)
Table 2. Pin description
Logic diagram STG3220
4/23 Doc ID 15647 Rev 1
2 Logic diagram
Figure 2. Logic block diagram
Figure 3. Logic equivalent circuit
Table 3. Truth table High impedance.
STG3220 Dedicated port charging detection
Doc ID 15647 Rev 1 5/23
Dedicated port charging detection
The STG3220 has a built-in dedicated port charging detection circuit to detect the condition
when the USB D+/D- lines are both in high state. When this occurs, the device sends an
interrupt signal to the processor to indicate that the connected USB device is in dedicated
port charging mode.
Figure 4. Interrupt function logic representation
Maximum rating STG3220
6/23 Doc ID 15647 Rev 1
4 Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
1. Derate above 70 °C by 18.5 mW/°C.
4.1 Recommended operating conditions
Table 4. Absolute maximum ratings
Table 5. Recommended operating conditions
STG3220 Electrical characteristics
Doc ID 15647 Rev 1 7/23
5 Electrical characteristics
Table 6. DC specifications
Electrical characteristics STG3220
8/23 Doc ID 15647 Rev 1 ΔRON = max |mSN-nSN|, where m = 1, 2 and n = 1, 2, N = 1, 2 Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog signal ranges.
Table 6. DC specifications (continued)
STG3220 Electrical characteristics
Doc ID 15647 Rev 1 9/23
Table 7. AC characteristics (CL = 35 pf, RL: 50 Ω , TR = Tf ≤ 5 ns)
Electrical characteristics STG3220
10/23 Doc ID 15647 Rev 1
Table 8. AC electrical characteristics (CL = 5 pF, RL = 50Ω , TA = 25 °C) Off isolation = 20 Log10 (VD/VS), VD = output, VS = input to off switch.
STG3220 Electrical characteristics
Doc ID 15647 Rev 1 11/23
Table 9. USB related AC electrical characteristics
Test circuit STG3220
12/23 Doc ID 15647 Rev 1
6 Test circuit
Figure 5. ON resistance
