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STDD15-07S |STDD1507S ST N/a106avaiLOW CAPACTITANCE DETECTION DIODE


STDD15-07S ,LOW CAPACTITANCE DETECTION DIODEFEATURES AND BENEFITSSTDD15-xxSSTDD15-xxWn Low diode capacitancen Device designed for RF applicatio ..
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STDD15-07S
LOW CAPACTITANCE DETECTION DIODE
STDD15 series
August 2002- Ed:3A
LOW CAPACITANCE DETECTION DIODE
The STDD15isa dual diode series for the
detectionofa RF signal and the compensationof
the voltage drift with the temperature. The SOT323
package makes the device idealin application
where the space savingis critical like mobile
phones.
The low junction capacitance will reduce the
disturbanceon the RF signal
DESCRIPTION
Low diode capacitance Device designedfor RF application Low profile package Availablein3 configurations Very low parasitic inductor& resistor
FEATURES AND BENEFITS
ABSOLUTE RATINGS
(limiting values)
MAIN PRODUCT CHARACTERISTICS
SCHEMATIC DIAGRAM
STDD15 series Pulse test: tp≤250μs, Delta≤2%
STATIC ELECTRICAL CHARACTERISTICS
Mounted withminimum recommendedpad size,PC board FR4.
THERMAL PARAMETERS
ELECTRICAL CHARACTERISTICS
STDD15 series
1.E-01
1.E+00
1.E+01
1.E+02
0.0 0.2 0.4 0.6 0.8 1.0 1.2
IFM(mA)
Fig.1:
Forward voltage drop versus forward
current (typical values).
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0.0 2.5 5.0 7.5 10.0 12.5 15.0
IR(μA)
Fig.2:
Reverse leakage current versus reverse
voltage applied (typical values).
1.0 10.0 100.0
RF()
Ω
Fig. 3:
Differential forward resistance versus
forward current (typical values).
0.0 2.5 5.0 7.5 10.0 12.5 15.0
C(pF)
Fig. 4:
Junction capacitance versus reverse
voltage applied (typical values).
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Zth(j-a)(°C/W)
Fig.5:
Variationof thermal impedance junctionto
ambient versus pulse duration (printed circuit
board, epoxy FR4).
600 5 10 15 20 25 30 35 40 45 50
Rth(j-a)
Fig.6:
Thermal resistance junctionto ambient
versus copper surface under each lead (printed
circuit board, epoxy FR4)..
STDD15 series
PACKAGE MECHANICAL DATA

SOT323-3L
FOOTPRINT
(in millimeters)
Electrical Model (PSPICE)
STDD15 series
PACKAGE MECHANICAL DATA

SOT323-6L
FOOTPRINT
(in millimeters)
Note:
The device fulfills the MSL level1 after
leadfree soldering profile.
STDD15 series
Information furnishedis believedtobe accurateandreliable. However,STMicroelectronicsassumesno responsibilityforthe consequencesof
useof suchinformation norfor anyinfringementof patents orother rights ofthird parties whichmay result fromitsuse.Nolicenseisgrantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedesand replacesall information previously supplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express writtenap-
provalof STMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2002 STMicroelectronics- Printedin Italy-All rights reserved.
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