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STD6N62K3STN/a30000avaiN-channel 620 V, 0.95 Ohm, 5.5 A SuperMESH3(TM) Power MOSFET in DPAK


STD6N62K3 ,N-channel 620 V, 0.95 Ohm, 5.5 A SuperMESH3(TM) Power MOSFET in DPAKElectrical characteristics(T = 25 °C unless otherwise specified)CTable 4. On /off statesSymbol Para ..
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STD6N62K3
N-channel 620 V, 0.95 Ohm typ., 5.5 A SuperMESH3(TM) Power MOSFET in D2PAK package
December 2011 Doc ID 022605 Rev 1 1/19
STB6N62K3
STD6N62K3

N-channel 620 V , 0.95 Ω , 5.5 A SuperMESH3™ Power MOSFET
in D²P AK, DPAK
Features
100% avalanche tested Extremely high dv/dt capability Gate charge minimized Very low intrinsic capacitance Improved diode reverse recovery
characteristics Zener-protected
Applications
Switching applications
Description

These SuperMESH3™ Power MOSFETs are the
result of improvements applied to
STMicroelectronics’ SuperMESH™ technology,
combined with a new optimized vertical structure.
These devices boast an extremely low on-
resistance, superior dynamic performance and
high avalanche capability, rendering them suitable
for the most demanding applications.

Table 1. Device summary
Contents STB6N62K3, STD6N62K3
2/19 Doc ID 022605 Rev 1
Contents Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
STB6N62K3, STD6N62K3 Electrical ratings
Doc ID 022605 Rev 1 3/19
1 Electrical ratings



Table 2. Absolute maximum ratings
Pulse width limited by safe operating area. Pulse width limited by Tj max. Starting Tj = 25 °C, ID = IAR, VDD = 50 V. ISD ≤ 5.5 A, di/dt ≤ 400 A/µs, VDD = 80% V(BR)DSS.
Table 3. Thermal data
When mounted on 1inch² FR-4 board, 2 oz Cu.
Electrical characteristics STB6N62K3, STD6N62K3
4/19 Doc ID 022605 Rev 1
2 Electrical characteristics

(TC = 25 °C unless otherwise specified)
Table 4. On /off states
Table 5. Dynamic
Is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDSS Is defined as a constant equivalent capacitance giving the same storage energy as Coss when VDS
increases from 0 to 80% VDSS
STB6N62K3, STD6N62K3 Electrical characteristics
Doc ID 022605 Rev 1 5/19
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve an efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
Table 6. Switching times
Table 7. Source drain diode
Pulse width limited by safe operating area Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 8. Gate-source Zener diode
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