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SSTV16859G-SSTV16859GX-SSTV16859MTD-SSTV16859MTDX Fast Delivery,Good Price
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SSTV16859GFAIN/a5avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859GFAIRCHILDN/a30avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859GXFAIN/a4avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859MTDFAIN/a8400avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859MTDXFAIN/a806avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset


SSTV16859MTD ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetSSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetMarch 2001Revised January ..
SSTV16859MTDX ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetSSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetMarch 2001Revised January ..
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SSTV16859G-SSTV16859GX-SSTV16859MTD-SSTV16859MTDX
Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset March 2001 Revised January 2005 SSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset General Description Features The SSTV16859 is a dual output 13-bit register designedCompliant with DDR-I registered module specifications for use with 184 and 232 pin DDR-1 memory modules. TheOperates at 2.5V ± 0.2V V DD device has a differential input clock, SSTL-2 compatible SSTL-2 compatible input structure data inputs and a LVCMOS compatible RESET input. The SSTL-2 compliant output structure device has been designed to meet the JEDEC DDR mod- ule register specifications.Differential SSTL-2 compatible clock inputs The device has been fabricated on an advanced sub-Low power mode when device is reset micron CMOS process and is designed to operate at power Industry standard 64 pin TSSOP package supplies of less than 3.6V’s. Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description SSTV16859G BGA96A 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) SSTV16859MTD MTD64 64-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. © 2005 DS500414
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