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SSTV16859FAIN/a87avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859PHIN/a196avaiDual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset


SSTV16859 ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetFeaturesThe SSTV16859 is a dual output 13-bit register designed  Compliant with DDR-I registered m ..
SSTV16859 ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859DGG ,SSTV16859; 2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM
SSTV16859G ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetSSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetMarch 2001Revised January ..
SSTV16859G ,Dual Output 13-Bit Register with SSTL-2 Compatible I/O and ResetFeaturesThe SSTV16859 is a dual output 13-bit register designed

SSTV16859
Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset
SSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset March 2001 Revised July 2002 SSTV16859 Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset General Description Features The SSTV16859 is a dual output 13-bit register designed � Compliant with DDR-I registered module specifications for use with 184 and 232 pin DDR-1 memory modules. The � Operates at 2.5V ± 0.2V V DD device has a differential input clock, SSTL-2 compatible � SSTL-2 compatible input structure data inputs and a LVCMOS compatible RESET input. The � SSTL-2 compliant output structure device has been designed to meet the JEDEC DDR mod- ule register specifications. � Differential SSTL-2 compatible clock inputs The device has been fabricated on an advanced sub- � Low power mode when device is reset micron CMOS process and is designed to operate at power � Industry standard 64 pin TSSOP package supplies of less than 3.6V’s. � Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description SSTV16859G BGA96A 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) SSTV16859MTD MTD64 64-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. © 2002 DS500414
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