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SSM5H90TUTOSHIBAN/a230000avaiMulti-chip discrete device (N-ch + switching diode)


SSM5H90TU ,Multi-chip discrete device (N-ch + switching diode)Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitV I = ..
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STB6NB50T4 ,N-CHANNEL ENHANCEMENT MODE POWERMESH MOSFETSTB6NB50®N - CHANNEL 500V - 1.35Ω - 5.8A - D2PAK/I2PAKPowerMESH™ MOSFETTYPE V R IDSS DS(on) DSTB6NB ..
STB6NC60 ,N-CHANNEL 600V 1.0 OHMABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitSTP(B)6NC60(-1) STP6NC60FPV Drain-source Voltage ..
STB6NC60-1 ,N-CHANNEL 600V 1.0 OHMELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)OFFSymbol Parameter Test Condi ..
STB6NC60T4 ,N-CHANNEL 600V 1.0 OHMELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)OFFSymbol Parameter Test Condi ..
STB6NK60Z ,N-CHANNEL 600V 1 OHM 6A TO-220/TO-220FP/D2PAK ZENER-PROTECTED SUPERMESH POWER MOSFETSTP6NK60Z - STP6NK60ZFPSTB6NK60Z - STB6NK60Z-12 2N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/D PAK/I P ..
STB6NK60Z-1 ,N-CHANNEL 600V 1 OHM 6A TO-220/TO-220FP/D2PAK/I2PAK ZENER-PROTECTED SUPERMESH POWER MOSFETFEATURES OF GATE-TO-SOURCE ZENER DIODESThe built-in back-to-back Zener diodes have specifically bee ..


SSM5H90TU
Multi-chip discrete device (N-ch + switching diode)
SSM5H90TU
Silicon N Channel MOS Type / Silicon Epitaxial Planer Diode
SSM5H90TU

High-Speed Switching Applications • Integrates an N-ch MOSFET and planer diodes into one package.
• Low RDS (ON) and low VF
Absolute Maximum Ratings (Ta = 25°C) for the MOSFET

Absolute Maximum Ratings (Ta = 25°C) for the Diodes

Absolute Maximum Ratings (Ta = 25°C) for the MOSFET and Diodes
Unit °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on a FR4 board. (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2 ) Note 2: Puls width limited by max channel temperature
Unit: mm
Weight: 7 mg (typ.)
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