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SN74LVC2G06QDCKRQ1TIN/a3000avaiDual Inverter Buffer/Driver with Open-Drain Output


SN74LVC2G06QDCKRQ1 ,Dual Inverter Buffer/Driver with Open-Drain OutputFEATURES• Qualified for Automotive Applications • ESD Protection Exceeds JESD 22• Supports 5-V V Op ..
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SN74LVC2G06QDCKRQ1
Automotive Catalog Dual Inverter Buffer/Driver with Open-Drain Output
1FEATURES
DBV OR DCK PACKAGE
(TOP VIEW)

DESCRIPTION/ORDERING INFORMATION
SN74LVC2G06-Q1
www.ti.com....................................................................................................................................................
SCES617A–OCTOBER 2004–REVISED APRIL 2008
DUAL INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
Qualified for Automotive Applications Exceeds JESD22 Supports 5-V VCC Operation Human-Body Model (A114-A) Max tpdof 3.4 nsat 3.3V – 200-V Machine Model (A115-A) Low Power Consumption, 10-μA Max ICC – 1000-V Charged-Device Model (C101) ±24-mA Output Driveat 3.3V Typical VOLP (Output Ground Bounce)
<0.8Vat VCC= 3.3V,TA= 25°C
Typical VOHV (Output VOH Undershoot) Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, ClassII

This dual inverter buffer/driveris designedfor 1.65-Vto 5.5-V VCC operation.
The outputof the SN74LVC2G06-Q1 deviceis open drain and can be connectedto other open-drain outputsto
implement active-low wired-ORor active-high wired-AND functions. The maximum sink currentis32 mA.
This deviceis fully specified for partial-power-down applications using Ioff. TheIoff circuitry disables the outputs,
preventing damaging current backflow through the device whenitis powered down.
ORDERING INFORMATION(1) PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)

SOT (SOT-23)– DBV Tape and reel SN74LVC2G06QDBVRQ1 C06_–40°Cto 125°C SOT (SC-70)– DCK Tape and reel SN74LVC2G06QDCKRQ1 CT_
(1) Forthe most current package and ordering information, seethe Package Option Addendumatthe endof this document,or seetheTI
web siteat www.ti.com.
(2) Package drawings, thermal data, and symbolizationare availableat www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designatesthe wafer fab/assembly site.Pin1 identifier
indicates solder-bump composition(1= SnPb,•= Pb-free).
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