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Partno Mfg Dc Qty AvailableDescript
MUN2113T1MOTOROLAN/a1680avaiBias Resistor Transistor
MUN2130T1MOTN/a10avaiBias Resistor Transistor
MUN2133T1MOTON/a16840avaiPNP SILICON BIAS RESISTOR TRANSISTOR


MUN2133T1 ,PNP SILICON BIAS RESISTOR TRANSISTORELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristic Symbol Min Typ Max Unit ..
MUN2134 ,Bias Resistor TransistorMUN2111T1 SeriesPreferred DevicesBias Resistor TransistorsPNP Silicon Surface Mount Transistorswith ..
MUN2137T1 ,Bias Resistor TransistorMaximum ratings applied to the device are individual stress limit values (notnormal operating condi ..
MUN2211T1 ,NPN SILICON BIAS RESISTOR TRANSISTORTHERMAL CHARACTERISTICSCharacteristic Symbol Max UnitTotal Device Dissipation P 230 (Note 1) mW ORD ..
MUN2212 ,Bias Resistor TransistorMaximum ratings applied to the device are individual stress limit values (notnormal operating condi ..
MUN2212T1 ,NPN SILICON BIAS RESISTOR TRANSISTORELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristic Symbol Min Typ Max Unit ..
NC ,Series Single Value Chip and Wire Capacitors Revision 28-Mar-03 101NC SeriesVishay Electro-FilmsDC WORKING VOLTAGES VALUES AND TOLERANCESNCA 0.0 ..
NC2D-JP-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JPL2-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-P-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT


MUN2113T1-MUN2130T1-MUN2133T1
PNP SILICON BIAS RESISTOR TRANSISTOR
PIN3
COLLECTOR
(OUTPUT)
PIN1
EMITTER
(GROUND)
PIN2
BASE
(INPUT) -
PNP Silicon Surface Mount Transistor with
Monolithic Bias Resistor Network

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base–emitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SC–59 package which is designed
for low power surface mount applications. Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC–59 package can be soldered using wave or reflow.
The modified gull–winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die. Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
THERMAL CHARACTERISTICS
DEVICE MARKING AND RESISTOR VALUES
Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint. New devices. Updated curves to follow in subsequent data sheets.
Thermal Clad is a trademark of the Bergquist Company
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