IC Phoenix
 
Home ›  M > M129 > MF-MSMF010-2,mfg:BOURNS, Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF010-2 from IC-PHOENIX Fast Delivery,Good Price
Part Number:
If you need More Quantity or Better Price,Welcom Any inquiry.
We available via phone +865332716050 Email
Partno Mfg Dc Qty AvailableDescript
MF-MSMF010-2 BOURNS N/a 814 Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications



MF-MSMF014-2 BOURNS
MF-MSMF020/60 BOURNS
MF-MSMF020-2 BOURNS, MF-MSMF Series - PTC Resettable Fuses
MF-MSMF020-2-M7
MF-MSMF030-2 MUTIFUSE
MF-MSMF050-2 BOURNS
MF-MSMF050-2 MULTIFUSE
MF-MSMF050-2/0.5A/1812 BOURNS
MF-MSMF075-2 BOURNS
MF-MSMF075-2 BOURNS Pb-free
MF-MSMF075-2
MF-MSMF110 SEMITEH, Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF110/16 SEMITEH
MF-MSMF110/16-2 BOURNS
MF-MSMF110/24X SEMITEH
MF-MSMF110-2
MF-MSMF110-2 BOURNS
MF-MSMF010-2 , Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF125 , Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF125 , Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF125 , Compliant with AEC-Q200 Rev-C- Stress Test Qualifi cation for Passive Components in Automotive Applications
MF-MSMF150-2 , Surface mount packaging for automated assembly
MIC5302-4.6YMT , 150mA ULDO in Ultra-Small 1.2mm x 1.6mm Thin MLF
MIC5303-3.0YMT , Single 300mA CMOS Ultra Small ULDO
MIC5303-3.3YMT , Single 300mA CMOS Ultra Small ULDO
ic,good price


TEL:86-533-2716050      FAX:86-533-2716790
   

©2024 IC PHOENIX CO.,LIMITED