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MBRM140ONN/a35000avaiSurface Mount Schottky Power Rectifier
MBRM140T1ON安森美N/a85600avaiSurface Mount Schottky Power Rectifier
MBRM140T1ONN/a41400avaiSurface Mount Schottky Power Rectifier
MBRM140T3ONN/a30050avaiSurface Mount Schottky Power Rectifier


MBRM140T1 ,Surface Mount Schottky Power RectifierThe Schottky Powermite employs the Schottky Barrier principlewith a barrier metal and epitaxial con ..
MBRM140T1 ,Surface Mount Schottky Power RectifierFeatures:POWERMITECASE 457• Low Profile - Maximum Height of 1.1 mmPLASTIC• Small Footprint - Footpr ..
MBRM140T3 ,Surface Mount Schottky Power RectifierMAXIMUM RATINGSRating Symbol Value UnitPeak Repetitive Reverse Voltage V 40 VRRMWorking Peak Revers ..
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MBRM140-MBRM140T1-MBRM140T3
Surface Mount Schottky Power Rectifier
MBRM140
Surface Mount
Schottky Power Rectifier
POWERMITE

Power Surface Mount Package

The Schottky Powermite employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop- reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles, < 1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are ac/dc and dc-dc
converters, reverse battery protection, and “Oring” of multiple supply
voltages and any other application where performance and size are
critical.
Features:
Low Profile - Maximum Height of 1.1 mm Small Footprint - Footprint Area of 8.45 mm2 Low VF Provides Higher Efficiency and Extends Battery Life Supplied in 12 mm Tape and Reel Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
Mechanical Characteristics:
Powermite is JEDEC Registered as DO-216AA Case: Molded Epoxy Epoxy Meets UL94V-0 at 1/8″ Weight: 62 mg (approximately) Device Marking: BCJ Lead and Mounting Surface Temperature for Soldering Purposes.
260°C Maximum for 10 Seconds
MAXIMUM RATINGS
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