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MAX8625AETD+TN/AN/a2500avaiHigh-Efficiency, Seamless Transition, Step-Up/Down DC-DC Converter


MAX8625AETD+T ,High-Efficiency, Seamless Transition, Step-Up/Down DC-DC ConverterELECTRICAL CHARACTERISTICS(V = 3.6V, ON = SKIP = IN, FB = GND, V = 3.3V, LX_ unconnected, C = C5 = ..
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MAX8625AETD+T
High-Efficiency, Seamless Transition, Step-Up/Down DC-DC Converter
General Description
The MAX8625A PWM step-up/down regulator is intend-
ed to power digital logic, hard disk drives, motors, and
other loads in portable, battery-powered devices such
as PDAs, cell phones, digital still cameras (DSCs), and
MP3 players. The MAX8625A provides either a fixed
3.3V or adjustable output voltage (1.25V to 4V) at up to
0.8A from a 2.5V to 5.5V input. The MAX8625A utilizes
a 2A peak current limit.
Maxim’s proprietary H-bridge topology provides a
seamless transition through all operating modes without
the glitches commonly seen with other devices. Four
internal MOSFETs (two switches and two synchronous
rectifiers) with internal compensation minimize external
components. A SKIPinput selects a low-noise, fixed-
frequency PWM mode, or a high-efficiency skip mode
where the converter automatically switches to PFM
mode under light loads for best light-load efficiency.
The internal oscillator operates at 1MHz to allow for a
small external inductor and capacitors.
The MAX8625A features current-limit circuitry that shuts
down the IC in the event of an output overload. In addi-
tion, soft-start circuitry reduces inrush current during
startup. The IC also features True ShutdownTM, which
disconnects the output from the input when the IC is
disabled. The MAX8625A is available in a 3mm x 3mm,
14-pin TDFN package.
Applications

PDAs and Smartphones
DSCs and Camcorders
MP3 Players and Cellular Phones
Battery-Powered Hard Disk Drive (HDD)
Features
Four Internal MOSFET True H-Bridge Buck/BoostGlitch-Free, Buck-Boost TransitionsMinimal Output Ripple Variation on TransitionsUp to 92% Efficiency37µA (typ) Quiescent Current in Skip Mode2.5V to 5.5V Input RangeFixed 3.3V or Adjustable Output1µA (max) Logic-Controlled ShutdownTrue ShutdownOutput Overload ProtectionInternal CompensationInternal Soft-Start1MHz Switching FrequencyThermal-Overload ProtectionSmall 3mm x 3mm, 14-Pin TDFN Package
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
Ordering Information

MAX8625A
SKIP
GND
OUT
LX1LX2
INPUT
2.7V TO 5.5V
OUTPUT
3.3V
OFF
PWM
SKIP
REF
Typical Operating Circuit

19-1006; Rev 4; 4/09
True Shutdown is a trademark of Maxim Integrated Products, Inc.
EVALUATION KIT
AVAILABLE
Note:
The device is specified over the -40°C to +85°C extended
temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
**EP = Exposed pad.
PARTPIN-
PACKAGETOP MARK

MAX8625AETD+14 TDFN-EP**ABQ
MAX8625A
TDFN-EP

TOP VIEW51110GNDOUT
LX1LX2
LX1
GND
LX2
OUT
SKIP
REF
EP = EXPOSED PAD.
Pin Configuration
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS

(VIN= 3.6V, ON = SKIP= IN, FB = GND, VOUT= 3.3V, LX_ unconnected, CREF= C5 = 0.1µF to GND, Figure 4. TA= -40°C to +85°C.
Typical values are at TA= +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, OUT, SKIP, ON to GND......................................-0.3V to +6V
REF, FB to GND.............................................-0.3V to (IN + 0.3V)
LX2, LX1 (Note 1).........................................................±1.5ARMS
Continuous Power Dissipation (TA= +70°C)
Single-Layer Board (derate 18.5mW/°C
above TA= +70°C)...................................................1482mW
Operating Temperature Range...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

Supply RangeVIN2.55.5V
UVLO ThresholdUVLOVIN rising, 60mV hysteresis2.202.49V
Quiescent Supply Current, FPWM
Mode, SwitchingIINNo load, VOUT = 3.2V1522mA
Quiescent Supply Current, Skip
Mode, SwitchingIINSKIP = GND, no load37µA
Quiescent Supply Current, No
Switching, Skip ModeIINSKIP = GND, FB = 1.3V3545µA
ON = GND, TA = +25°C0.11Shutdown Supply CurrentIINTA = +85°C0.2µA
PWM mode, VIN = 2.5V to 5.5V3.30V
IOUT = 0 to 0.5A, VIN = 2.5V to 5.5V,
TA = -40°C to +85°C (Note 3)-1+1%
SKIP mode, valley regulation value3.28V
Average skip voltage3.285
Output Voltage Accuracy
(Fixed Output)
Load step +0.5A-3%
Output Voltage Range
(Adjustable Output)1.254.00V
Maximum Output CurrentVIN = 3.6V0.80A
Soft-StartL = 3.3µH; COUT = C3 + C4 = 44µF250mA/ms
Load RegulationIOUT = 0 to 500mA0.1%/A
Line RegulationVIN = 2.5V to 5.5V0.03%/V
OUT Bias CurrentIOUTVOUT = 3.3V3µA
REF Output VoltageVREFVIN = 2.5V to 5.5V1.2441.251.256V
REF Load RegulationIREF = 10µA1mV
FB Feedback ThresholdVFBIOUT = 0 to full load, PWM mode; VIN = 2.5V
to 5.5V1.2441.251.258V
Note 1:
LX1 and LX2 have internal clamp diodes to IN, GND and OUT, GND, respectively. Applications that forward bias these
diodes should take care not to exceed the device's power-dissipation limits.
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
Note 2:
The device is production tested at TA= +25°C. Specifications over the operating temperature range are guaranteed by
design and characterization.
Note 3:
Limits are guaranteed by design and not production tested.
Note 4:
The idle-mode current threshold is the transition point between fixed-frequency PWM operation and idle-mode operation.
The specification is given in terms of output load current for an inductor value of 3.3µH. For the step-up mode, the idle-mode
transition varies with input to the output-voltage ratios.
ELECTRICAL CHARACTERISTICS (continued)

(VIN= 3.6V, ON = SKIP= IN, FB = GND, VOUT= 3.3V, LX_ unconnected, CREF= C5 = 0.1µF to GND, Figure 4. TA= -40°C to +85°C.
Typical values are at TA= +25°C, unless otherwise noted.) (Note 2)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

FB Dual-Mode ThresholdVFBDM75100125mV
VFB = 1.3V, TA = +25°C0.0010.1FB Leakage CurrentIFBVFB = 1.3V, TA = +85°C0.01µA
ON, SKIP Input High VoltageVIH2.5V < VIN < 5.5V1.6V
ON, SKIP Input Low VoltageVIL2.5V < VIN < 5.5V0.45V
2.5V < VIN < 5.5V, TA = +25°C0.0011ON Input Leakage CurrentIIHLTA = +85°C0.01µA
ISKIPHVSKIP = 3.6V312SKIP Input Leakage CurrentISKIPLVSKIP = 0V-2-0.2µA
Peak Current LimitILIMPLX1 PMOS170020002300mA
Fault Latch-Off Delay100ms
Each MOSFET, TA = +25°C0.050.1
MOSFET On-ResistanceRONEach MOSFET, VIN = 2.5V to 5.5V,
TA = -40°C to +85°C0.2Ω
Rectifier-Off Current ThresholdILX1OFFSKIP = GND125mA
SKIP = GND, load decreasing100Idle-Mode Current Threshold
(Note 4)ISKIPLoad increasing300mA
VIN = VOUT = 5.5V, VLX1 = 0V to VIN,
VLX2 = 0V to VOUT, TA = +25°C0.011LX1, LX2 Leakage CurrentILXLKG
TA = +85°C0.2
VIN = VLX1 = VLX2 = 0V, VOUT = 5.5V,
measure I (LX2), TA = +25°C0.011Out Reverse CurrentILXLKGR
TA = +85°C0.5
Minimum TONTONMIN25%
OSC FrequencyFOSCPWM85010001150kHz
Thermal Shutdown15°C hysteresis+165°C
Typical Operating Characteristics
(VIN= 3.6V, SKIP= GND, TA= +25°C, Figure 4, unless otherwise noted.)
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
EFFICIENCY vs. LOAD CURRENT
SKIP AND FPWM MODES

MAX8625A toc01
LOAD CURRENT (mA)
EFFICIENCY (%)
VOUT = 3.3V
VIN = 2.7V,
3.0V,
3.3V,
3.6V,
4.2V,
5.0V60
SKIP-MODE EFFICIENCY
vs. INPUT VOLTAGE
MAX8625A toc02
INPUT VOLTAGE (V)
EFFICIENCY (%)
100mA
300mA
500mA
VOUT = 3.3V
LOAD CURRENT = 100mA,
300mA, 500mA
EFFICIENCY vs. LOAD CURRENT
FPWM MODE (FIGURE 3)

MAX8625A toc03
LOAD CURRENT (mA)
EFFICIENCY (%)
VOUT = 2.8V
VIN = 2.7V,
3.0V,
3.3V,
3.6V,
4.2V,
5.0V
EFFICIENCY vs. LOAD CURRENT
FPWM MODE (FIGURE 3)

MAX8625A toc04
LOAD CURRENT (mA)
EFFICIENCY (%)
VOUT = 3.45V
VIN = 2.7V,
3.0V,
3.3V,
3.6V,
4.2V,
5.0V
OUTPUT VOLTAGE (3.3V INTERNAL FB)
vs. LOAD CURRENT

MAX8625A toc05
LOAD CURRENT (mA)
DEVIATION (%)
VOUT = 3.3V
TA = +25°C, TA = -40°C, TA = +85°C
OUTPUT VOLTAGE (2.8V EXTERNAL FB)
vs. LOAD CURRENT (FIGURE 3)

MAX8625A toc06
LOAD CURRENT (mA)
DEVIATION (%)
VOUT = 2.8V
TA = +25°C, TA = -40°C, TA = +85°C
OUTPUT VOLTAGE vs. INPUT VOLTAGE
WITH INTERNAL FB RESISTORS
MAX8625A toc07
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
LOAD: 500mA, VOUT = 3.3V
TA = +25°C, TA = -40°C, TA = +85°C
OUTPUT VOLTAGE vs. INPUT VOLTAGE
WITH EXTERNAL FB RESISTORS
MAX8625A toc08
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
LOAD: 500mA, VOUT = 2.8V
TA = +25°C, TA = -40°C, TA = +85°C (FIGURE 3)
SUPPLY CURRENT vs. INPUT VOLTAGE
WITH NO LOAD

MAX8625A toc09
INPUT VOLTAGE (V)
SUPPLY CURRENT (mA)
NO LOAD VOUT = 3.3V
FPWM MODE
Typical Operating Characteristics (continued)
(VIN= 3.6V, SKIP= GND, TA= +25°C, Figure 4, unless otherwise noted.)
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter

MAXIMUM LOAD CURRENT
vs. INPUT VOLTAGE
MAX8625A toc10
INPUT VOLTAGE (V)
MAXIMUM LOAD CURRENT (mA)
VOUT = 3.3V
1μs/div
SWITCHING WAVEFORMS
VIN = 3V, LOAD = 500mA, VOUT = 3.3V

MAX8625A toc11
VLX1
2V/div
VOUT
50mV/div
(AC-COUPLED)
VLX2
2V/div
ILX
500mA/div
1μs/div
SWITCHING WAVEFORMS
VIN = 3.3V, LOAD = 500mA, VOUT = 3.3V

MAX8625A toc12
VLX1
2V/div
VOUT
50mV/div
(AC-COUPLED)
VLX2
2V/div
ILX
500mA/div
1μs/div
SWITCHING WAVEFORMS
VIN = 3.6V, LOAD = 500mA, VOUT = 3.3V

MAX8625A toc13
VLX1
2V/div
VOUT
50mV/div
(AC-COUPLED)
VLX2
2V/div
ILX
500mA/div
10μs/div
SKIP MODE
VIN = 3V, LOAD = 20mA,
VOUT = 3.288V

MAX8625A toc14
CH1 = VLX1
2V/div
VOUT
20mV/div
(AC-COUPLED)
CH2 = VLX2
2V/div
ILX
500mA/div
1μs/div
FPWM MODE
VIN = 3V, LOAD = 20mA,
VOUT = 3.308V

MAX8625A toc15
VLX1
2V/div
VOUT
20mV/div
(AC-COUPLED)
VLX2
2V/div
ILX
500mA/div
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter

2ms/div
STARTUP WAVEFORMS
VIN = 3.6V, LOAD = 5Ω, VOUT = 3.288V

MAX8625A toc16
2V/div
VOUT
20mV/div
IBATT
500mA/div
ILX
500mA/div
2ms/div
STARTUP WAVEFORMS (FIGURE 3)
VIN = 3.6V, LOAD = 30Ω, VOUT = 1.5V

MAX8625A toc17
2V/div
IBATT
100mA/div
VOUT
1V/div
ILX
500mA/div
400μs/div
LOAD TRANSIENT
VOUT = 3.3V

MAX8625A toc18
VOUT
100mV/div
(DC OFFSET = 3.3V)
ILX
500mA/div
IBATT
250mA/div
Typical Operating Characteristics (continued)

(VIN= 3.6V, SKIP= GND, TA= +25°C, Figure 4, unless otherwise noted.)
1ms/div
LINE TRANSIENT
VOUT = 3.3V, LOAD = 5.5Ω,
VIN RAMP 3V TO 4V

MAX8625A toc19
CH1 = VIN
500mV/div
3V OFFSET
CH2 = VOUT
50mV/div
(AC-COUPLED)
BODE PLOT
GAIN AND PHASE vs. FREQUENCY

MAX8625A toc20
FREQUENCY (kHz)
GAIN (dB)
VIN = 3.6V
VOUT = 3.3V
LOAD = 200mA
PHASE (DEG)
GAIN
PHASE
OSCILLATOR FREQUENCY
vs. TEMPERATURE
MAX8625A toc21
TEMPERATURE (°C)
OSCILLATOR FREQUENCY (MHz)
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
Typical Operating Characteristics (continued)

(VIN= 3.6V, SKIP= GND, TA= +25°C, Figure 4, unless otherwise noted.)
MINIMUM STARTUP VOLTAGE
vs. TEMPERATURE
MAX8625A toc22
TEMPERATURE (°C)
MINIMUM STARTUP VOLTAGE (V)
VOUT = 3.3V, NO LOAD
REFERENCE vs. TEMPERATURE
NO LOAD
MAX8625A toc23
TEMPERATURE (°C)
REFERENCE (V)
VOUT = 3.3V
VIN = 3.0V,
3.6V,
4.2V,
5.0V
REFERENCE vs. TEMPERATURE
WITH 300mA LOAD
MAX8625A toc24
TEMPERATURE (°C)
REFERENCE (V)
VOUT = 3.3V
VIN = 3.0V,
3.6V,
4.2V,
5.0V
100μs/div
SHUTDOWN DUE TO OVERLOAD
VIN = 3.6V, VOUT = 3.288V

MAX8625A toc25
VLX1
2V/div
VLX2
2V/div
VOUT
500mV/div
ILX
500mA/div
2μs/div
BOOST-TO-BUCK TRANSITION
FPWM MODE VIN = 3.6V, VOUT = 3.288V

MAX8625A toc26
VIN
1V/div
DC OFFSET = 3V
VOUT
100mV/div
AC-COUPLED
ILX
200mA/div
MAX8625A
High-Efficiency, Seamless Transition,
Step-Up/Down DC-DC Converter
Detailed Description

The MAX8625A step-up/down architecture employs a
true H-bridge topology that combines a boost converter
and a buck converter topology using a single inductor
and output capacitor (Figure 1). The MAX8625A utilizes
a pulse-width modulated (PWM), current-mode control
scheme and operates at a 1MHz fixed frequency to
minimize external component size. A proprietary
H-bridge design eliminates mode changes when transi-
tioning from buck to boost operation. This control
scheme provides very low output ripple using a much
smaller inductor than a conventional H-bridge, while
avoiding glitches that are commonly seen during mode
transitions with competing devices.
The MAX8625A switches at an internally set frequency
of 1MHz, allowing for tiny external components. Internal
compensation further reduces the external component
count in cost- and space-sensitive applications. The
MAX8625A is optimized for use in HDDs, DSCs, and
other devices requiring low-quiescent current for opti-
mal light-load efficiency and maximum battery life.
Control Scheme

The MAX8625A basic noninverting step-up/down con-
verter operates with four internal switches. The control
logic determines which two internal MOSFETs operate
to maintain the regulated output voltage. Unlike a tradi-
tional H-bridge, the MAX8625A utilizes smaller peak-
inductor currents, thus improving efficiency and
lowering input/output ripple.
The MAX8625A uses three operating phases during
each switching cycle. In phase 1 (fast-charge), the
inductor current ramps up with a di/dt of VIN/L. In phase
2 (slow charge/discharge), the current either ramps up
or down depending on the difference between the input
voltage and the output voltage (VIN- VOUT)/L. In phase 3
(discharge), the inductor current discharges at a rate of
VOUT/L through MOSFETs P2 and N1 (see Figure 1). An
additional fourth phase (phase 4: hold) is entered when
the inductor current falls tozero during phase 3. This
fourth phase is only used during skip operation.
The state machine (Figure 2) decides which phase to
use and when to switch phases. The converter goes
Pin Description
PINNAMEFUNCTION

1, 2LX1Inductor Connection 1. Connect the inductor between LX1 and LX2. Both LX1 pins must be connected
together externally. LX1 is internally connected to GND during shutdown.
3, 4LX2Inductor Connection 2. Connect the inductor between LX1 and LX2. Both LX2 pins must be connected
together externally. LX2 is internally connected to GND during shutdown.ONEnable Input. Connect ON to the input or drive high to enable the IC. Drive ON low to disable the IC.SKIP
Mode Select Input. Connect SKIP to GND to enable skip mode. This mode provides the best overall
efficiency curve.
Connect SKIP to IN to enable forced-PWM mode. This mode provides the lowest noise, but reduces light-
load efficiency compared to skip mode.
7FB
Feedback Input. Connect to ground to set the fixed 3.3V output. Connect FB to the center tap of an
external resistor-divider from the output to GND to set the output voltage to a different value. VFB regulates
to 1.25V.REFReference Output. Bypass REF to GND with a 0.1µF ceramic capacitor. VREF is 1.25V and is internally
pulled to GND during shutdown.
9, 10OUTPower Output. Bypass OUT to GND with two 22µF ceramic capacitors. Both OUT pins must be connected
together externally.
11, 12GNDGround. Connect the exposed pad and GND directly under the IC.
13, 14INPower-Supply Input. Bypass IN to GND with two 22µF ceramic capacitors. Connect IN to a 2.5V to 5.5V
supply. Both IN pins must be connected together externally.
—EPExposed Pad. Connect to GND directly under the IC. Connect to a large ground plane for increased
thermal performance.
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