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MAX8521ETP+T |MAX8521ETPTMAXIMN/a2avaiSmallest TEC Power Drivers for Optical Modules


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MAX8521ETP+T
Smallest TEC Power Drivers for Optical Modules
General Description
The MAX8520/MAX8521 are designed to drive thermo-
electric coolers (TECs) in space-constrained optical
modules. Both devices deliver ±1.5A output current
and control the TEC current to eliminate harmful current
surges. On-chip FETs minimize external components
and high switching frequency reduces the size of exter-
nal components.
The MAX8520/MAX8521 operate from a single supplyand
bias the TEC between the outputs of two synchronous
buck regulators. This operation allows for temperature
control without “dead zones” or other nonlinearities at
low current. This arrangement ensures that the control
system does not hunt when the set-point is very close
to the natural operating point, requiring a small amount
of heating or cooling. An analog control signal precisely
sets the TEC current.
Both devices feature accurate, individually-adjustable
heating current limit and cooling current limit along with
maximum TEC voltage limit to improve the reliability of
optical modules. An analog output signal monitors the
TEC current. A unique ripple cancellation scheme helps
reduce noise.
The MAX8520 is available in a 5mm x 5mm TQFN pack-
age and its switching frequency is adjustable up to
1MHz through an external resistor. The MAX8521 is
also available in a 5mm x 5mm TQFN as well as
space-saving 3mm x 3mm UCSP™ and 36-bump WLP
(3mm x 3mm) packages, with a pin-selectable switch-
ing frequency of 500kHz or 1MHz.
Applications

SFF/SFP Modules
Fiber Optic Laser Modules
Fiber Optic Network Equipment
ATE
Biotech Lab Equipment
Features
Circuit Footprint 0.31in2Low Profile DesignOn-Chip Power MOSFETsHigh-Efficiency Switch-Mode DesignRipple Cancellation for Low NoiseDirect Current Control Prevents TEC Current
Surges
5% Accurate Adjustable Heating/Cooling Current
Limits
2% Accurate TEC Voltage LimitNo Dead Zone or Hunting at Low Output CurrentITEC Monitors TEC Current 1% Accurate Voltage ReferenceSwitching Frequency up to 1MHz Synchronization (MAX8521)
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
Ordering Information

19-2586; Rev 2; 2/11
EVALUATION KIT
AVAILABLE
PARTTEMP RANGEPIN-PACKAGE
MAX8520ETP+
-40°C to +85°C20 TQFN - E P * 5m m x 5m m
MAX8521EBX
-40°C to +85°C6 x 6 U C S P 3m m x 3m m
MAX8521ETP+-40°C to +85°C20 TQFN - E P * 5m m x 5m m
MAX8521EWX+-40°C to +85°C36 WLP ** 3m m x 3m m
INPUT
3V TO 5.5V
VDD
PVDD_
COMP
GND
SHDN
ITEC
OFF
TEC CURRENT
MONITOR
CTLI
LX1
PGND1
OS1
OS2
LX2
PGND2
TECITEC = ± 1.5A
REF
CURRENT-
CONTROL
SIGNAL
FREQ
ANALOG /DIGITAL
TEMPERATURE CONTROL
OUTPUT
MAX8521
Typical Operating Circuit
Pin Configurations appear at end of data sheet

+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
**Four center bumps depopulated.
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
CTLI to GND.........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (VDD+ 0.3V)
PVDD1, PVDD2 to GND.............................-0.3V to (VDD+ 0.3V)
PVDD1, PVDD2 to VDD..........................................-0.3V to +0.3V
PGND1, PGND2 to GND.......................................-0.3V to +0.3V
COMP, REF, ITEC short to GND....................................Indefinite
LX Current (Note 1)........................................±2.25A LX Current
Continuous Power Dissipation (TA= +70°C)
6 x 6 UCSP (derate 22mW/°C above +70°C)...............1.75W
20-Pin 5mm x 5mm x 0.9mm TQFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
36-Bump WLP (derate 22mW/°C above +70°C)............1.75W
Operating Temperature Range...........................-40°C to +85°C
Maximum Junction Temperature.....................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow)
Lead(Pb)-Free (TQFN, WLP)........................................+260°C
Containing Lead (UCSP).............................................+240°C
ELECTRICAL CHARACTERISTICS

(VDD= VPVDD1= VPVDD2= VSHDN= 5V, 1MHz mode (Note 4). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,= 0°C to +85°C, unless otherwise noted. Typical values at TA= +25°C.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

Input Supply RangeVDD3.05.5V
Maximum TEC Current±1.5A
Reference VoltageVREFVDD = 3V to 5.5V, IREF = 150µA1.4851.5001.515V
Reference Load Regulation∆VREFVDD = 3V to 5V, IREF = 10µA to 1mA1.25.0mV
VMAXI_ = VREF140150160VDD = 5VVMAXI_ = VREF/3405060
VMAXI_ = VREF143150155
MAXIP/MAXIN Threshold
AccuracyVDD = 3VVMAXI_ = VREF/3455055
VDD = 5V, I = 0.2A0.090.14nFET On-ResistanceRDS(ON-N)VDD = 3V, I = 0.2A0.110.16Ω
VDD = 5V, I = 0.2A0.140.23pFET On-ResistanceRDS(ON-P)VDD = 3V, I = 0.2A0.170.30Ω
VLX = VDD = 5V, TA = +25°C0.034.00nFET LeakageILEAK(N)VLX = VDD = 5V TA = +85°C0.3µA
VLX = 0V, TA = +25°C0.034.00pFET LeakageILEAK(P)µA
Note 1:
LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to
exceed the IC’s package power dissipation limits.
Note 2:
Solders underside metal slug to PCB ground plane.
PACKAGE THERMAL CHARACTERISTICS (Note 3)

20 TQFN
Junction-to-Ambient Thermal Resistance (θJA)...............30°C/W
Junction-to-Case Thermal Resistance (θJC)......................2°C/W
6x6 UCSP
Junction-to-Ambient Thermal Resistance (θJA)................65.5°C/W
Junction-to-Case Thermal Resistance (θJC).......................0°C/W
36 WLP
Junction-to-Ambient Thermal Resistance (θJA)..................38°C/W
Junction-to-Case Thermal Resistance (θJC)......................4°C/W
Note 3:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial.
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
ELECTRICAL CHARACTERISTICS (continued)

(VDD= VPVDD1= VPVDD2= VSHDN= 5V, 1MHz mode (Note 4). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,= 0°C to +85°C, unless otherwise noted. Typical values at TA= +25°C.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

500kHz mode1114VCOMP = VREF =
1.500V, VDD = 5V1MHz mode1621
500kHz mode811No-Load Supply CurrentIDD(NO
LOAD)VCOMP = VREF =
1.500V, VDD = 3.3V1MHz mode1114
Shutdown Supply CurrentIDD-SDSHDN = GND, VDD = 5V, (Note 5)23mA
Thermal ShutdownTSHUTDOWNHysteresis = 15°C+165°C
VDD rising2.502.652.80UVLO ThresholdVUVLOVDD falling2.402.552.70V
MAX8521, FREQ = VDD, VDD = 3V to 5V0.81.01.2
MAX8521, FREQ = GND, VDD = 3V to 5V0.40.50.6
MAX8520, REXT = 60kΩ, VDD = 5V0.81.01.2
MAX8520, REXT = 60kΩ, VDD = 3V0.760.931.10
MAX8520, REXT = 150kΩ, VDD = 5V0.40.50.6
Internal Oscillator Switching
FrequencyfSW-INT
MAX8520, REXT = 150kΩ, VDD = 3V0.360.460.56
MHz
External Sync Frequency Range25% < duty cycle < 75% (MAX8521 only)0.71.2MHz
LX_ Duty Cycle(Note 6)0100%
OS1, OS2, CS Input CurrentIOS1, IOS2,
ICS0V or VDD-100+100µA
SHDN, FREQ Input CurrentISHDN,
IFREQ
0V or VDD, FREQ applicable for the
MAX8521 only-5+5µA
SHDN, FREQ Input Low VoltageVILVDD = 3V to 5.5V, FREQ applicable for the
MAX8521 only
VDD x
0.25V
SHDN, FREQ Input High VoltageVIHVDD = 3V to 5.5V, FREQ applicable for the
MAX8521 only
VDD x
0.75V
VMAXV = VREF x 0.67, VOS1 to VOS2 = ±4V,
VDD = 5V-2+2%
MAXV Threshold Accuracy
VMAXV = VREF x 0.33, VOS1 to VOS2 = ±2V,
VDD = 3V-3+3%
MAXV, MAXI_ Input Bias CurrentIMAXV-BIAS,
IMAXI_-BIASVMAXV = VMAXI_ = 0.1V or 1.5V-0.1+0.1µA
CTLI GainACTLIVCTLI = 0.5V to 2.5V (Note 7)9.510.010.5V/V
CTLI Input ResistanceRCTLI1MΩ terminated at REF0.51.02.0MΩ
Error-Amp Transconductancegm50100160µS
VITEC AccuracyVOS1 to VCS = ±100mV
VOS1 = VDD/2-10+10%
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
ELECTRICAL CHARACTERISTICS

(VDD= VPVDD1= VPVDD2= VSHDN= 5V, 1MHz mode (Note 4). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF, = -40°C to +85°C, unless otherwise noted.) (Note 8)
PARAMETERSYMBOLCONDITIONSMINMAXUNITS

Input Supply RangeVDD3.05.5V
Maximum TEC Current±1.5A
Reference VoltageVREFVDD = 3V to 5.5V, IREF = 150µA1.4801.515V
Reference Load Regulation∆VREFVDD = 3V to 5V, IREF = 10µA to 1mA5mV
VMAXI_ = VREF140160VDD = 5VVMAXI_ = VREF/34060
VMAXI_ = VREF143155
MAXIP/MAXIN Threshold
Accuracy
VDD = 3VVMAXI_ = VREF/34555
VDD = 5V, I = 0.2A0.14nFET On-ResistanceRDS(ON-N)VDD = 3V, I = 0.2A0.16Ω
VDD = 5V, I = 0.2A0.23pFET On-ResistanceRDS(ON-P)VDD = 3V, I = 0.2A0.30Ω
500kHz mode14VCOMP = VREF =
1.500V, VDD = 5V1MHz mode21
500kHz mode11No Load Supply CurrentIDD(NO
LOAD)VCOMP = VREF =
1.500V, VDD = 3.3V1MHz mode14
Shutdown Supply CurrentIDD-SDSHDN = GND, VDD = 5V (Note 5)3mA
VDD Rising2.502.80UVLO ThresholdVUVLOVDD Falling2.402.70V
MAX8521, FREQ = VDD, VDD = 3V to 5V0.81.2
MAX8521, FREQ = GND, VDD = 3V to 5V0.40.6
MAX8520, REXT = 60kΩ, VDD = 5V0.81.2
MAX8520, REXT = 60kΩ, VDD = 3V0.761.10
MAX8520, REXT = 150kΩ, VDD = 5V0.40.6
Internal Oscillator Switching
FrequencyfSW-INT
MAX8520, REXT = 150kΩ, VDD = 3V0.360.56
MHz
External Sync Frequency Range25% < duty cycle < 75% (MAX8521 only)0.71.2MHz
LX_ Duty CycleNote 60100%
OS1, OS2, CS Input CurrentIOS1, IOS2,
ICS0V or VDD-100+100µA
SHDN, FREQ Input CurrentISHDN,
IFREQ
0V or VDD, FREQ applicable for the
MAX8521 only-5+5µA
SHDN, FREQ Input Low VoltageVILVDD = 3V to 5.5V, FREQ applicable for the
MAX8521 only
VDD x
0.25V
SHDN, FREQ Input High VoltageVIHVDD = 3V to 5.5V, FREQ applicable for the
MAX8521 only
VDD x
0.75V
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
ELECTRICAL CHARACTERISTICS (continued)

(VDD= VPVDD1= VPVDD2= VSHDN= 5V, 1MHz mode (Note 4). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF, = -40°C to +85°C, unless otherwise noted.) (Note 8)
PARAMETERSYMBOLCONDITIONSMINMAXUNITS

VMAXV = VREF x 0.67, VOS1 to VOS2 = ±4V,
VDD = 5V-2+2%
MAXV Threshold Accuracy
VMAXV = VREF x 0.33, VOS1 to VOS2 = ±2V,
VDD = 3V-3+3%
MAXV, MAXI_ Input Bias Current
IMAXV-
BIAS,
IMAXI_-BIAS
VMAXV = VMAXI_ = 0.1V or 1.5V-0.1+0.1µA
CTLI GainACTLIVCTLI = 0.5V to 2.5V (Note 7)9.510.5V/V
CTLI Input ResistanceRCTLI1MΩ terminated at REF0.52.0MΩ
Error-Amp Transconductancegm50160µS
VITEC AccuracyVOS1 to VCS = ±100mV
VOS1 = VDD/2-10+10%
Note 4:
Enter 1MHz mode by connecting a 60kΩresistor from FREQ to ground for the MAX8520, and connecting FREQ to VDDfor
the MAX8521.
Note 5:
Includes power FET leakage.
Note 6:
Duty-cycle specification is guaranteed by design and not production tested.
Note 7:
CTLI Gain is defined as:
Note 8:
Specifications to -40°C are guaranteed by design and not production tested.VCTLICTLICS=−()1
Typical Operating Characteristics

(VDD= 5V, circuit of Figure 1, TA= +25°C unless otherwise noted.)
EFFICIENCY vs. TEC CURRENT
VDD = 5V, RTEC = 2Ω

MAX8520/21 toc01
TEC CURENT (A)
EFFICIENCY (%)
FREQ = 500kHz
FREQ = 1MHz
EFFICIENCY vs. TEC CURRENT
VDD = 3.3V, RTEC = 1.3Ω

MAX8520/21 toc02
TEC CURRENT (A)
EFFICIENCY (%)
FREQ = 500kHz
FREQ = 1MHz
COMMON-MODE
OUTPUT VOLTAGE RIPPLE

MAX8520/21 toc03
400ns/div
VOS2
20mV/div
AC-COUPLED
VOS1
20mV/div
AC-COUPLED
ITEC = 1A
C2 = C7 = 1μF
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
DIFFERENTIAL
OUTPUT VOLTAGE RIPPLE

MAX8520/21 toc04
400ns/div
VOS2 - VOS1
1mV/div
AC-COUPLED
C2 = C7 = 1μF
ITEC = 1A
VDD RIPPLE

MAX8520/21 toc05
400ns/div
VDD
20mV/div
AC-COUPLED
ITEC = 1A
TEC CURRENT RIPPLE

MAX8520/21 toc06
400ns/div
10mA/div
AC-COUPLED
1.5A
TEC CURRENT vs. CTLI VOLTAGE

MAX8520/21 toc07
20ms/div
VCTLI
1V/div
ITEC
1A/div
ZERO-CROSSING TEC CURRENT

MAX8520/21 toc08
1ms/div
VCTLI
I00mV/div
ITEC
100mA/div
1.5V
VITEC vs. TEC CURRENT

MAX8520/21 toc09
TEC CURRENT (A)
ITEC
(V)
Typical Operating Characteristics (continued)
(VDD= 5V, circuit of Figure 1, TA= +25°C unless otherwise noted.)
ITEC vs. AMBIENT TEMPERATURE

MAX8520/21 toc10
TEC CURRENT (A)
+60+40+200-20
-40+80
FREQ = 1MHz
VCTLI = 2V
RTEC = 1Ω
SWITCHING FREQUENCY
vs. TEMPERATURE

MAX8520/21 toc11
SWITCHING FREQUENCY (kHz)
+80+60+40+200-20
FREQ = 1MHz
VCTLI = 1.5V
RTEC = 1Ω
FREQ = 500KHz
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
SWITCHING FREQUENCY CHANGE vs. VDD

MAX8520/21 toc12
VDD (V)
SWITCHING FREQUENCY CHANGE (kHz)
FREQ = 500kHz
FREQ = 1MHz
SWITCHING FREQUENCY vs. REXT

MAX8520/21 toc13
REXT (kΩ)
SWITCHING FREQUENCY (kHz)
VDD = 3.3V
VDD = 5V
VDD STEP RESPONSE

MAX8520/21 toc19
10ms/div
VDD
2V/div
ITEC
10mA/div
REFERENCE VOLTAGE CHANGE vs. VDD

VDD (V)
REFERENCE VOLTAGE CHANGE (mV)
REF SOURCING 150μA
REFERENCE VOLTAGE CHANGE
vs. TEMPERATURE

MAX8520/21 toc15
TEMPERATURE (°C)
REFERENCE VOLTAGE CHANGE (mV)
+80+40+600+20-20
REF SOURCING 150μA
REFERENCE VOLTAGE CHANGE
vs. LOAD CURRENT

MAX8520/21 toc16
LOAD CURRENT (mA)
REFERENCE VOLTAGE CHANGE (mV)
STARTUP AND SHUTDOWN WAVEFORMS
MAX8520/21 toc17
200μs/div
VSHDN
5V/div
ITEC
500mA/div
IDD
200mA/div
0mA
0mA
CTLI STEP RESPONSE

MAX8520/21 toc18
1ms
VCTLI
1V/div
ITEC
1A/div
1.5V
Typical Operating Characteristics (continued)

(VDD= 5V, circuit of Figure 1, TA= +25°C unless otherwise noted.)
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
Typical Operating Characteristics (continued)

(VDD= 5V, circuit of Figure 1, TA= +25°C unless otherwise noted.)
THERMAL STABILITY,
COOLING MODE

MAX8520/21 toc20
4s/div
TEMPERATURE
0.001°C/div
TTEC = +25°C
TA = +45°C
THERMAL STABILITY,
ROOM TEMPERATURE

MAX8520/21 toc21
4s/div
TEMPERATURE
0.001°C/div
TTEC = +25°C
TA = +25°C
THERMAL STABILITY,
HEATING MODE

MAX8520/21 toc22
4s/div
TEMPERATURE
0.001°C/div
TTEC = +25°C
TA = +5°C
Pin Description
PIN
TQFNUCSP/WLP
NAMEFUNCTION
E1, E2LX1Inductor Connection. LX1 is high-impedance in shutdown.D1, D2, D3PGND1Power Ground 1. Internal synchronous-rectifier ground connection. Connect all PGND
pins together at power ground plane.
3C1SHDNShutdown Control Input. Pull SHDN low to turn off PWM control and ITEC output.C2COMPCurrent-Control Loop Compensation. See the Compensation Capacitor section.B1ITEC
TEC Current-Monitor Output. The ITEC output voltage is a function of the voltage across
the TEC current-sense resistor. VITEC = VREF + 8 (VOS - VCS). Keep capacitance on ITEC
< 150pF.A1MAXIN
Maximum Negative TEC Current. Connect MAXIN to REF to set default negative current
limit to - 150mV/RSENSE. To lower this current limit, connect MAXIN to a resistor-divider
network from REF to GND. The current limit will then be equal to -(VMAXIN/VREF) x
(150mV/RSENSE).A2MAXIP
Maximum Positive TEC Current. Connect MAXIP to REF to set default positive current limit
to 150mV/RSENSE. To lower this current limit, connect MAXIP to a resistor-divider network
from REF to GND. The current limit will then be equal to (VMAXIP/VREF) x (150mV/RSENSE).A3MAXV
Maximum Bipolar TEC Voltage. Connect MAXV to REF to set default maximum TEC
voltage to VDD. To lower this limit, connect MAXV to a resistor-divider network from REF to
GND. The maximum TEC voltage is equal to 4 x VMAXV or VDD, whichever is lower.A4REF1.50V Reference Output. Bypass REF to GND with a 0.1µF ceramic capacitor.
MAX8520/MAX8521
Smallest TEC Power Drivers for Optical
Modules
PIN
TQFNUCSP/WLP
NAMEFUNCTION
A5CTLI
TEC Current-Control Input. Sets TEC current. Center point is 1.50V (no TEC current). The
current is given by:
ITEC = (VOS1 - VCS) / RSENSE = (VCTLI - 1.50) / (10 x RSENSE). When (VCTLI - VREF) > 0V
then VOS2 > VOS1 > VCS.A6GNDAnalog Ground. Star connect to PGND at underside exposed pad for TQFN package.B6VDDAnalog Supply Voltage Input. Bypass VDD to GND with a 1µF ceramic capacitor.
For MAX8520: Analog FREQ Set Pin (see the Switching Frequency section).C5FREQFor MAX8521: Digital FREQ Selection Pin. Connect to VDD for 1MHz operation, connect to
GND for 500kHz operation. The PWM oscillator can synchronize to FREQ by switching at
FREQ between 700kHz and 1.2MHz.D6, D5, D4PGND2Power Ground 2. Internal synchronous rectifier ground connection. Connect all PGND
pins together at the power ground plane.E5, E6LX2Inductor Connection. LX2 is high-impedance in shutdown.F5, F6PVDD2Power Input 2. Connect all PVDD inputs together at the VDD power plane.F4CSCurrent-Sense Input. The current through the TEC is monitored between CS and OS1. The
maximum TEC current is given by 150mV/RSENSE and is bipolar.C6OS2Output Sense 2. OS2 senses one side of the differential TEC voltage. OS2 is a sense
point, not a power output. OS2 discharges to ground in shutdown.F3OS1Output Sense 1. OS1 senses one side of the differential TEC voltage. OS1 is a sense
point, not a power output. OS1 discharges to ground in shutdown.F1, F2PVDD1Power Input 1. Connect all PVDD inputs together at the VDD power plane.
B2, B5, C3,GND2Ground. Additional ground pads aid in heat dissipation. Short to either GND or PGND
plane.
B3, B4
E3, E4N.C.No Connect. Connect N.C. pads to GND2 to aid in heat dissipation.EPExposed Paddle (TQFN Only). Internally connected to GND. Connect to a large ground
plane to maximize thermal performance. Not intended as an electrical connection point.
Pin Description (continued)
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