MAX4007EUT ,PLASTIC ENCAPSULATED DEVICES MAX4007EUT Rev. A RELIABILITY REPORT FOR MAX4007EUT PLASTIC ENCA ..
MAX4007EUT+T ,High-Accuracy, 76V, High-Side Current Monitors in SOT23ELECTRICAL CHARACTERISTICS(V = 40V, GND = 0V, REF = open, V = 0V (MAX4007), CLAMP = open, T = -40°C ..
MAX400CPA ,Ultra Low Offset Voltage Operational AmplifierFeatures
The MAX400 guaranteed maximum IthN offset error . Ultra Low Offset Voltage: 1WAf (max.)
..
MAX400CSA ,Ultra Low Offset Voltage Operational AmplifierFeatures
The MAX400 guaranteed maximum IthN offset error . Ultra Low Offset Voltage: 1WAf (max.)
..
MAX400CSA ,Ultra Low Offset Voltage Operational AmplifierELECTRICAL CHARACTERISTICS (contlnued) 3
(VS = i15V, TA = +25°C, unless otherwise noted.) ts
MAX4 ..
MAX400CSA ,Ultra Low Offset Voltage Operational AmplifierELECTRICAL CHARACTERISTICS (contlnued) 3
(VS = i15V, TA = +25°C, unless otherwise noted.) ts
MAX4 ..
MAX751ESA ,+5V-Output, Step-Up, Current-Mode PWM DC-DC Converteramoral Description
The MAX751 is a +5V-output, CMOS, step-up, switch-
mode DC-DC converter. Min ..
MAX7528JCWP ,CMOS Dual 8-Bit Buffered Multiplying DACsGeneral Description
The MX7528/MX7628 contains two 8-bit multiplying
digital-to-analog converte ..
MAX7528JCWP ,CMOS Dual 8-Bit Buffered Multiplying DACsApplications
Programmable Attenuators
Digitally Controlled Filters
X-Y Graphics
Motion Cont ..
MAX7528JN ,CMOS Dual 8-Bit Buffered Multiplying DACs19-0170 Rev 3, 11/95
CMOS Dual 8-Bit Buffered Multiplying DACs
MAX7528KCWP ,CMOS Dual 8-Bit Buffered Multiplying DACs19-0170 Rev 3, 11/95
CMOS Dual 8-Bit Buffered Multiplying DACs
MAX7528KN ,CMOS Dual 8-Bit Buffered Multiplying DACsFeatures
. Data Latches For Both DACs
MX7528-+5V to +15V Single Supply Operation
.
t MX7628 ..
MAX4007EUT
PLASTIC ENCAPSULATED DEVICES
MAX4007EUT Rev. A RELIABILITY REPORT
FOR
MAX4007EUT PLASTIC ENCAPSULATED DEVICES
April 28, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion The MAX4007 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information .....Attachments
I. Device Description A. General
The MAX4007 precision, high-side, current monitor is specifically designed for monitoring photodiode current in fiber
applications. It offers a connection point for the reference current and a monitor output that produces a signal
proportional to the reference current. The monitor output of the MAX4007 is a current proportional to the reference
current. The current monitor has six decades of dynamic range and monitor reference current of 250nA to 2.5mA
with better than 5% accuracy. The photodiode current can be monitored from 10nA to 10mA with reduced accuracy.
The MAX4007 accepta a supply voltage of +2.7V to +76V, suitable for APD or PIN photodiode applications. Internal
current limiting (20mA, typ) protects the device against short circuit to ground. A clamp diode protects the monitor
output from overvoltage. Additionally, thia devices feature thermal shutdown if the die temperature reaches +150°C.
The MAX4007 is available in tiny, space-saving 6-pin SOT23 packages, and operates over the extended temperature
range of -40°C to +85°C.
B. Absolute Maximum Ratings
CLAMP to GND -0.3V to +80V
BIAS, REF to GND -0.3V to +80V
OUT to GND -0.3V to (VCLAMP + 0.6V)
Short-Circuit, REF to GND Continuous
Current into any Pin ±30mA
Operating Temperature Range -40°C to +85°C
Junction Temperature +150°C
Storage Temperature Range -65°C to +150°C
Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +70C)
6-PIN SOT23 696mW
Derates above +70°C
6-PIN SOT23 8.7mW/°C
II. Manufacturing Information A. Description/Function: High-Accuracy, 76V, High-Side=Current Monitors in SOT23 B. Process: BCD80 C. Number of Device Transistors: 195 D. Fabrication Location: Oregon, USA
E. Assembly Location: Thailand, Malaysia, USA F. Date of Initial Production: January, 2003
III. Packaging Information A. Package Type:
6-Pin SOT B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Non-Conductive Epoxy E. Bondwire: Gold (1 mil dia.) F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: # 05-9000-0357
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1
IV. Die Information A. Dimensions: 60 X 41 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 3 microns (as drawn) F. Minimum Metal Spacing: 3 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (l) is calculated as follows:
l = 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 48 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV l = 22.62 x 10-9 l = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6107) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing The OY13 die type has been found to have all pins able to withstand a transient pulse of ±2500V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1 Reliability Evaluation Test Results
MAX4007EUT
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION PACKAGE SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 45 0 Biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters SOT 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles & functionality Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kW
C = 100pf
SHORT
R2
S2 R1
