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MAX2644EXT-T |MAX2644EXTTMAXIMN/a10000avai2.4GHz SiGe / High IP3 Low-Noise Amplifier


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MAX6002EUR-T ,Low-Cost / Low-Power / Low-Dropout / SOT23-3 Voltage ReferencesELECTRICAL CHARACTERISTICS—MAX6001(V = +5V, I = 0, T = T to T , unless otherwise noted. Typical val ..
MAX6003EUR ,Low-Cost, Low-Power, Low-Dropout, SOT23-3 Voltage ReferencesFeaturesThe MAX6001–MAX6005 family of SOT23, low-cost♦ 1% max Initial Accuracyseries voltage refere ..
MAX6003EUR+T ,Low-Cost, Low-Power, Low-Dropout, SOT23-3 Voltage ReferencesMAX6001–MAX600513-1395; Rev 1; 4/99Low -Cost, Low -Pow er, Low -Dropout, SOT23-3 Voltage References
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MAX6004EUR+T ,Low-Cost, Low-Power, Low-Dropout, SOT23-3 Voltage ReferencesELECTRICAL CHARACTERISTICS—MAX6001(V = +5V, I = 0, T = T to T , unless otherwise noted. Typical val ..


MAX2644EXT-T
2.4GHz SiGe / High IP3 Low-Noise Amplifier
MAX2644
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Pin Configuration
Typical Operating Circuit
General Description

The MAX2644 low-cost, high third-order intercept point
(IP3) low-noise amplifier (LNA) is designed for applica-
tions in 2.4GHz WLAN, ISM, and Bluetooth radio sys-
tems. It features a programmable bias, allowing the
input IP3 and supply current to be optimized for specif-
ic applications. The LNA provides up to +1dBm input
IP3 while maintaining a low noise figure of 2.0dB and a
typical gain of 16dB.
The MAX2644 is designed on a low-noise, advanced
silicon-germanium (SiGe) technology. It operates with a
+2.7V to +5.5V single supply and is available in an
ultra-small 6-pin SC70 package.
________________________Applications

Bluetooth
802.11 WLAN
Home RF
Satellite CD Radio
2.4GHz ISM Band Radios
2.4GHz Cordless Phones
Wireless Local Loop (WLL)
Features
Low Noise Figure (2.0dB at 2450MHz)High Gain: 16dBAdjustable IP3 and Bias CurrentLow-Power Standby ModeOn-Chip Output Matching+2.7V to +5.5V Single-Supply OperationUltra-Small 6-Pin SC70 Package
Ordering Information
MAX2644
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS

(VCC= +2.7V to +5.5V, RBIAS= 1.2kΩ, no RF signal applied, RFINand RFOUT are AC-coupled and terminated to 50Ω, TA= -40°C to
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:
Devices are production tested at TA= +25°C. Minimum and maximum values are guaranteed by design and characterization
over temperature and supply voltages.
Note 2:
Min/Max limits are guaranteed by design and characterization.
Note 3:
The part has been characterized at the specified frequency range. Operation outside this range is possible but not guaranteed.
Note 4:
Excluding PC board losses (0.3dB at the input and 0.3dB at the output of the MAX2644 EV kit).
Note 5:
Measured with two input tones (f1= 2445MHz, f2= 2455MHz) both at -30dBm per tone. Input IP3 can be improved to
+1dBm with circuit shown in Figure 2.
Note 6:
Excluding PC board losses (0.3dB typical at the input of the MAX2644 EV kit).
VCC to GND..............................................................-0.3V to +6V
RFIN, RFOUT to GND…......................................................±0.3V
RFIN Power (50Ωsource)................................................+5dBm
BIAS to GND................................................................0 to +0.3V
Operating Temperature Range...........................-40°C to +85°C
Maximum Junction Temperature.....................................+150°C
Continuous Power Dissipation (TA= +70°C)
6-Pin SC70 (derate 3.1mW/°C above +70°C)..............245mW
Storage Temperature.........................................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
AC ELECTRICAL CHARACTERISTICS

(MAX2644 EV kit, VCC= +3.0V, fRFIN= 2450MHz, PRFIN= -30dBm, input and output are terminated to 50Ω, RBIAS= 1.2kΩ,
MAX2644
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Typical Operating Characteristics

(PRFIN= -30dBm, ZS= ZL= 50Ω, VCC= +3.0V, fRFIN = 2450MHz, RBIAS= 1.2kΩ, TA= +25°C, unless otherwise noted.)
MAX2644
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Typical Operating Characteristics (continued)

(PRFIN= -30dBm, ZS= ZL= 50Ω, VCC= +3.0V, fRFIN = 2450MHz, RBIAS= 1.2kΩ, TA= +25°C, unless otherwise noted.)
MAX2644
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Applications Information
Input Matching

Input matching is required for optimum performance.
The MAX2644 requires a simple LC matching network,
as shown in the Typical Operating Circuit. To further
reduce cost and external component count, replace the
external inductor with a microstrip transmission line.
The Typical Operating Circuitshows the recommended
input matching network for the MAX2644 at 2450MHz.
These values are optimized for best simultaneous gain,
noise figure, and return loss performance.
VCCLine Bypassing

Bypassing the VCCline is necessary for optimum
gain/linearity performance. A transmission line and two
capacitors are required, as shown in the schematics in
Figures 1 and 2. The optimum dimensions and posi-
tions of the components are as follows: the output
transmission line dimension is 0.532in (length) ✕0.012in
(width); the distance from C2 to the IC is 0.352in; and
the distance from C3 to the IC is 0.041in. Please refer
to Figures 1 and 2 for component values.
MAX2644
Standby

Standby mode is achieved by disconnecting BIAS as
shown in Figure 1. Avoid capacitance at the BIAS pin
by connecting the bias resistor from BIAS to the switch.
Layout Issues

A properly designed PC board is essential to any
RF/microwave circuit. Use controlled impedance lines
on all high-frequency inputs and outputs. Bypass with
decoupling capacitors located close to the device VCC
pin. For long VCClines, it may be necessary to add
additional decoupling capacitors. These additional
capacitors can be located farther away from the device
package. Proper grounding of the GND pins is essen-
tial. If the PC board uses a topside RF ground, connect
it directly to all GND pins. For a board where the
ground plane is not on the component layer, the best
technique is to connect the GND pins to the board with
a plated through-hole located close to the package.
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
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