MAX17007AGTI+T ,Dual and Combinable QPWM Graphics Core Controllers for Notebook ComputersELECTRICAL CHARACTERISTICS(V = 12V, V = V = V = V = 5V, V = 2V, SKIP = GND, T = 0 to +85°C, unless ..
MAX17007GTI+ ,Dual and Combinable QPWM Graphics Core Controllers for Notebook ComputersFeatures♦ Dual Quick-PWM with Fast Transient ResponseThe MAX17007/MAX17008 are dual Quick-PWM™ step ..
MAX17008GTI+ ,Dual and Combinable QPWM Graphics Core Controllers for Notebook ComputersMAX17007A/MAX17007B/MAX1700819-3200; Rev 3; 9/10Dual and Combinable QPWM GraphicsCore Controllers f ..
MAX17009GTL+ ,AMD Mobile Serial VID Dual-Phase Fixed-Frequency ControllerApplications ♦ Power Sequencing and TimingMobile AMD SVI Core Supply♦ Soft-Startup and Soft-Shutdow ..
MAX17009GTL+T ,AMD Mobile Serial VID Dual-Phase Fixed-Frequency ControllerFeaturesThe MAX17009 is a 2-phase, step-down interleaved, ♦ Dual-Output, Fixed-Frequency, Core Supp ..
MAX1700EEE ,1-Cell to 3-Cell / High-Power 1A / Low-Noise / Step-Up DC-DC ConvertersMAX1700/MAX170119-4759; Rev 1; 1/991-Cell to 3-Cell, High-Power (1A), Low-Noise, Step-Up DC-DC Conv ..
MAX4514CSA ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesELECTRICAL CHARACTERISTICS—+5V Supply (continued)(V+ = +4.5V to +5.5V, V = 2.4V, V = 0.8V, T = T to ..
MAX4514CSA+ ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesELECTRICAL CHARACTERISTICS—+5V Supply (continued)(V+ = +4.5V to +5.5V, V = 2.4V, V = 0.8V, T = T to ..
MAX4514CUK ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesGeneral Description ________
MAX4514CUK+T ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesGeneral Description ________
MAX4514CUK-T ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesELECTRICAL CHARACTERISTICS—+5V Supply (continued)(V+ = +4.5V to +5.5V, V = 2.4V, V = 0.8V, T = T to ..
MAX4514ESA ,Low-Voltage, Low-On-Resistance, SPST, CMOS Analog SwitchesApplications' TTL/CMOS-Logic Compatible with +5V SupplyBattery-Operated EquipmentAudio and Video Si ..
MAX17007AGTI+-MAX17007AGTI+T-MAX17008GTI+
Dual and Combinable QPWM Graphics Core Controllers for Notebook Computers
General DescriptionThe MAX17007A/MAX17007B/MAX17008 are dual Quick-
PWM™ step-down controllers intended for general power
generation in battery-powered systems. The two
switched-mode power supplies (SMPSs) can also be
combined to operate in a two-phase single-output mode.
Constant on-time Quick-PWM operation provides fast
response to load transients and handles wide input/out-
put (I/O) voltage ratios with ease, while maintaining a rela-
tively constant switching frequency. The switching
frequency can be individually adjusted between 200kHz
and 600kHz with external resistors. Differential output cur-
rent sensing allows output sense-resistor sensing for an
accurate current limit, or lossless inductor direct-current
resistance (DCR) current sensing for lower power dissipa-
tion while maintaining 0.7% output accuracy. Overvoltage
(MAX17007A/MAX17007B only), undervoltage protection,
and accurate user-selectable current limits (15mV, 30mV,
45mV, and 60mV) ensure robust operations.
The SMPS outputs can operate in skip mode or in ultra-
sonic mode for improved light-load efficiency. The ultra-
sonic mode eliminates audible noises by maintaining a
minimum switching frequency of 25kHz in pulse-
skipping mode.
The output voltage of SMPS1 can be dynamically
adjusted by changing the voltage at the REFIN1 pin.
The device includes a 0.5% accurate reference output
that can be used to set the REFIN1 voltage. An external
5V bias supply is required to power the internal circuitry
and its gate drivers.
Independent on/off controls with well-defined logic thresh-
olds and independent open-drain power-good outputs
provide flexible system configurations. To prevent current
surges at startup, the internal voltage target is slowly
ramped up from zero to the final target with a slew rate of
1.3mV/µs for SMPS1 at CSL1 and 0.65mV/µs for SMPS2
at FB2. To prevent the output from ringing off below
ground in shutdown, the internal voltage target is ramped
down from its previous value to zero with the same
respective slew rates. Integrated bootstrap switches
eliminate the need for external bootstrap diodes.
The MAX17007A/MAX17007B/MAX17008are available
in a space-saving, 28-pin, 4mm x 4mm, TQFN package
with an exposed backside pad. The MAX17007B
improves crosstalk performance over the MAX17007A.
Applications
FeaturesDual Quick-PWM with Fast Transient ResponseAutomatic Dynamic REFIN1 Detection andPGOOD1/Fault BlankingFixed and Adjustable Output Voltages±0.7% Output Accuracy Over Line and LoadOUT1: 0 to 2V Dynamic Output or Preset 1.05VOUT2: 0.7V to 2V Range or Preset 1.5VResistor-Programmable Switching FrequencyIntegrated BST SwitchesDifferential Current-Sense InputsLow-Cost DCR Sensing or Accurate Current-Sense ResistorsInternally Coupled Current-Sense CompensationCombinable Mode Supports High-CurrentDynamic Output VoltagesSelectable Forced-PWM, Pulse Skip, or UltrasonicMode Operation26V Maximum Input Voltage RatingIndependent Enable InputsIndependent Power-Good OutputsOvervoltage Protection (MAX17007A/MAX17007BOnly)Undervoltage/Thermal ProtectionVoltage Soft-Start and Soft-Shutdown
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook ComputersMAX17007A
MAX17007B
MAX1700822232425262728
LX1
DH1
PGOOD1
EN1
CSH1
TOP VIEW
CSL1
REFIN1
LX2
DH2
PGOOD2
EN2
CSH2
CSL2
FB2
BST2PGNDDL2V
DL1GNDBST1
REF
ILIM1
(CCI) ILIM2
VCC
SKIP
TON1TON2
Pin Configuration
Ordering Information19-3200; Rev 3; 9/10
EVALUATION KIT
AVAILABLE+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
PARTTEMP RANGEPIN-PACKAGE
MAX17007AGTI+-40°C to +105°C28 TQFN-EP*
MAX17007BGTI+-40°C to +105°C28 TQFN-EP*
MAX17008GTI+-40°C to +105°C28 TQFN-EP*
Notebook Computers
Low-Power I/O Supplies
GPU Core Supplies
2 to 4 Li+ Cells Battery-Powered Devices
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= 0 to +85°C,unless otherwise noted. Typical values are
at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
BST1, BST2 to GND...............................................-0.3V to +34V
BST1, BST2 to VDD.................................................-0.3V to +28V
TON1, TON2 to GND..............................................-0.3V to +28V
VDDto GND..............................................................-0.3V to +6V
VDDto VCC............................................................-0.3V to +0.3V
LX1 to BST1..............................................................-6V to +0.3V
LX2 to BST2..............................................................-6V to +0.3V
DH1 to LX1..............................................-0.3V to (VBST1+ 0.3V)
DH2 to LX2..............................................-0.3V to (VBST2+ 0.3V)
ILIM1, ILIM2, REF to GND..........................-0.3V to (VCC + 0.3V)
CSH1, CSH2, CSL1, CSL2, FB2, REFIN1 to GND....-0.3V to +6V
EN1, EN2, SKIP, PGOOD1, PGOOD2 to GND.........-0.3V to +6V
DL1 to GND................................................-0.3V to (VDD + 0.3V)
DL2 to PGND..............................................-0.3V to (VDD+ 0.3V)
PGND to GND......................................................-0.3V to + 0.3V
REF Short Circuit to GND...........................................Continuous
Continuous Power Dissipation (TA= +70°C)
28-Pin TQFN T2844-1
(derate 20.8mW/°C above +70°C)............................1667mW
Extended Operating Temperature Range.........-40°C to +105°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature....................................................+260°C
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
PWM CONTROLLERInput Voltage Range VIN 4.5 26 V
Quiescent Supply Current
(VDD, VCC)IDD + ICCOutput forced above regulation voltage,
VEN1 = VEN2 = 5V 1.7 2.5 mA
Shutdown Supply Current
(VDD, VCC)ISHDN EN1 = EN2 = GND, TA = +25°C 0.1 5 µA
RTON1 = RTON2 =
97.5k (600kHz)
142
(-15%) 174 194
(+15%)
RTON1 = RTON2 =
200k (300kHz)
305
(-10%) 336 368
(+10%) On-Time (Note 1) tON1, tON2
VIN = 12V,
VCSL1 = VCSL2 =
VCCI = 1.2V,
separate or
combined mode RTON1 = RTON2 =
302.5k (200kHz)
425
(-15%) 500 575
(+15%)
ns
Minimum Off-Time tOFF(MIN) (Note 1) 250 400 ns
TON1, TON2, Shutdown Supply
Current
ITON1,
ITON2
EN1 = EN2 = GND, VTON1 = VTON2 = 26V,
VDD = 0 or 5V, TA = +25°C 0.01 1 µA
REFIN1 Voltage Range VREFIN1 (Note 2) 0 VREF V
FB2 Regulation Voltage VFB2 Adjustable mode 0.7 V
FB2 Input Voltage Range Preset mode 1.7 2.3 V
FB2 Combined-Mode Threshold Combined mode 3.8 VCC -
1V
VCC -
0.4 V
REFIN1 Dual Mode™
Switchover Threshold 3.8 VCC -
1V
VCC -
0.4 V
REFIN1, FB2 Bias Current IREFIN1,
IFB2
REFIN1 = 0.5V to 2V;
VFB2 = 0.7V, TA = +25°C -0.1 +0.1 µA
VCSL1 Measured at CSL1, REFIN1 = VCC,
VIN = 2V to 26V, SKIP = VCC (Note 2) 1.043 1.05 1.057 V
TA = +25°C -12 +12 REFIN1 = 500mV,
SKIP = VCCTA = 0°C to +85°C -20 +20
SMPS1 Voltage Accuracy VCSL1 -
VREFIN1
mV
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SMPS2 Voltage Accuracy VCSL2 Measured at CSL2, FB2 = REF,
VIN = 2V to 26V, SKIP = VCC1.489 1.5 1.511 V
Load Regulation Error ILOAD = 0 to full load, SKIP = VCC (Note 3) 0.1 %
Line Regulation Error VDD = 4.5V to 5.5V, VIN = 4.5V to 26V (Note 3) 0.25 %
CSL1 Soft-Start/-Stop Slew Rate SRSS1 Rising/falling edge on EN1 1.25 mV/µs
FB2 Soft-Start/-Stop Slew Rate SRSS2 Rising/falling edge on EN2 0.63 mV/µs
Dynamic REFIN1 Slew Rate SRDYN Rising edge on REFIN1 11.4 mV/µs
INTERNAL REFERENCEReference Voltage VREF VDD = 4.5V to 5.5V 1.990 2.000 2.010 V
Reference Lockout Voltage VREF(UVLO) Rising edge, hysteresis = 230mV 1.8 V
Reference Load Regulation IREF = -10µA to +100µA 1.980 2.015 mV
FAULT DETECTIONWith respect to the internal target voltage
(error comparator threshold); rising edge;
hysteresis = 50mV
260 300 340 mV
Dynamic transition VREF + 0.30 V
SMPS1 Overvoltage Trip
Threshold and PGOOD1 Upper
Threshold
(MAX17007A Only)
VOVP1,
VPG1_H
Minimum OVP threshold 0.7 V
SMPS2 Adjustable Mode
Overvoltage Trip Threshold and
PGOOD2 Upper Threshold
(MAX17007A Only)
VOVP2,
VPG2_H
With respect to the internal target voltage
0.7V (error comparator threshold);
hysteresis = 50mV
120 150 180 mV
Output Overvoltage Fault
Propagation Delay
(MAX17007A Only)
tOVP CSL1/FB2 forced 25mV above trip threshold 5 µs
SMPS1 Undervoltage Protection
Trip Threshold and Lower
PGOOD1 Threshold
VUVP1,
VPG1_L
With respect to the internal target voltage
(error comparator threshold); falling edge;
hysteresis = 50mV
-240 -200 -160 mV
SMPS2 Undervoltage Protection
Trip Threshold and Lower
PGOOD2 Threshold
VUVP2,
VPG2_L
With respect to the internal target voltage
0.7V (error comparator threshold);
falling edge; hysteresis = 50mV
-130 -100 -70 mV
Output Undervoltage Fault
Propagation Delay tUVP CSL1/FB2 forced 25mV below trip threshold 90 205 360 µs
UVP falling edge, 25mV overdrive 5
OVP rising edge, 25mV overdrive 5 PGOOD_ Propagation Delay tPGOOD
Startup delay from regulation 90 205 360
µs
PGOOD_ Output Low Voltage ISINK = 3mA 0.4 V
PGOOD_ Leakage Current IPGOOD CSL1 = REFIN1, FB2 = 0.7V (PGOOD_ high
impedance), PGOOD_ forced to 5V, TA = +25°C 1 µA
Dynamic REFIN1 Transition
Fault-Blanking Threshold
Fault blanking initiated; REFIN1 deviation
from the internal target voltage (error
comparator threshold); hysteresis = 10mV
±50 mV
Thermal-Shutdown Threshold TSHDN Hysteresis = 15°C (Note 3) 160 °C
ELECTRICAL CHARACTERISTICS (continued)(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= 0 to +85°C,unless otherwise noted. Typical values are
at TA= +25°C.)
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
ELECTRICAL CHARACTERISTICS (continued)(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= 0 to +85°C,unless otherwise noted. Typical values are
at TA= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CURRENT LIMITCSH1, CSH2 0 2.3 Current-Sense Input Range CSL1, CSL2 0 2.3 V
Current-Sense Input (CSH_)
Leakage Current CSH_ = GND or VCC, TA = +25°C -0.2 +0.2 µA
Current-Sense Input (CSL_)
Leakage Current CSL_= CSL_ = 2V, TA = +25°C 1 µA
TA = +25°C 28 30 32 VCSH_ - VCSL_
ILIM1 = ILIM2 = REF TA = 0°C to +85°C 27 30 33
VCSH_ - VCSL_, ILIM1 = ILIM2 = VCC 56 60 64
VCSH_ - VCSL_, ILIM1 = ILIM2 = OPEN 42 45 48
Current-Limit Threshold (Fixed) VCSLIMIT
VCSH_ - VCSL_, ILIM1 = ILIM2 = GND 13 15 17
Current-Limit Threshold
(Negative) VNEG VCSH_ - VCSL_,SKIP = VCC-1.2 x
VCSLIMIT mV
Current-Limit Threshold
(Zero Crossing) VZX VCSH_ - VCSL_,SKIP = GND or OPEN;
ILIM1 = ILIM2 = REF 1 mV
Ultrasonic Frequency SKIP = open (3.3V); VCSL1 = VREFIN1 + 50mV;
VCSL2 = VFB2 + 50mV 20 kHz
VCSL1 = VREF1 + 50mV 22 33 46 Ultrasonic Current-Limit
Threshold SKIP = open (3.3V)
VCSL2 = VFB2+ 50mV 18 30 46
mV
Current-Balance Amplifier (GMI)
Offset [V(CSH1,CSL1) - V(CSH2,CSL2)] at ICCI = 0 -3 +3 mV
Current-Balance Amplifier (GMI)
Transconductance
ICCI/[V(CSH1,CSL1) - V(CSH2,CSL2)];
VCCI = VCSL1 = VCSL2 = 0.5V to 2V, and
V(CSH_,CSL_) = -60.0mV to +60.0mV,
ILIM1 = GND
180 µS
GATE DRIVERSLow state (pulldown) 1.7 4.0 DH1, DH2 Gate-Driver
On-Resistance RON(DH) BST_ - LX_ forced
to 5V High state (pullup) 1.7 4.0
High state (pullup) 1.3 3.0 DL1, DL2 Gate-Driver
On-Resistance RON(DL) Low state (pulldown) 0.6 2.5
DH1, DH2 Gate-Driver
Source/Sink Current IDH DH_ forced to 2.5V, BST_ - LX_ forced to
5V 1.2 A
DL1, DL2 Gate-Driver
Source Current IDL(SOURCE) DL_ forced to 2.5V 1 A
DL1, DL2 Gate-Driver
Sink Current IDL(SINK) DL_ forced to 2.5V 2.4 A
DH_ low to DL high 10 25 40 Driver Propagation Delay ns
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
ELECTRICAL CHARACTERISTICS (continued)(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= 0 to +85°C,unless otherwise noted. Typical values are
at TA= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DL_ falling, CDL = 3nF 10 20 DL_ Transition Time DL_ rising, CDL = 3nF 10 20 ns
DH_ falling, CDH = 3nF 10 20 DH_ Transition Time DH_ rising, CDH = 3nF 10 20 ns
Internal BST_ Switch
On-Resistance RBST_ IBST_ = 10mA, VDD = 5V 6.5 11.0
INPUTS AND OUTPUTSEN1, EN2 Logic-Input Threshold EN1, EN2 rising edge,
hysteresis = 300mV/600mV (min/max) 1.20 1.70 2.20 V
Logic-Input Current EN1, EN2, TA = +25°C -0.5 +0.5 µA
High (5V) VCC -
0.3
Open (3.3V) 3.0 3.6
Ref (2.0V) 1.7 2.3
Quad-Level Input-Logic Levels SKIP, ILIM1, ILIM2
Low (GND) 0.4
Quad-Level Logic-Input Current SKIP, ILIM1, ILIM2 forced to GND or VCC,
TA = +25°C -2 +2 µA
ELECTRICAL CHARACTERISTICS(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= -40°C to +105°C, unless otherwise noted.) (Note 4)
PARAMETERSYMBOLCONDITIONSMINMAXUNITS
PWM CONTROLLERInput Voltage Range VIN 4.5 26 V
Quiescent Supply Current
(VDD, VCC)IDD + ICCOutput forced above regulation voltage,
VEN1 = VEN2 = 5V 2.5 mA
RTON1 = RTON2 =
97.5k (600kHz) 142 194
RTON1 = RTON2 =
200k (300kHz) 305 368 On-Time (Note 1) tON1,
tON2
VIN = 12V,
VCSL1 = VCSL2 =
VCCI = 1.2V,
separate or
combined modeRTON1 = RTON2 =
302.5k (200kHz) 425 575
ns
Minimum Off-Time tOFF(MIN) (Note 1) 400 ns
REFIN1 Voltage Range VREFIN1 0 VREF V
FB2 Input Voltage Range Preset mode 1.7 2.3 V
FB2 Combined-Mode Threshold Combined mode 3.75 VCC -
0.4 VIREFIN1,
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
ELECTRICAL CHARACTERISTICS (continued)(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= -40°C to +105°C, unless otherwise noted.) (Note 4)
PARAMETERSYMBOLCONDITIONSMINMAXUNITSREFIN1 Dual-Mode
Switchover Threshold 3.75 VCC -
0.4 V
SMPS1 Voltage Accuracy VCSL1 Measured at CSL1, REFIN1 = VCC;
VIN = 2V to 26V, SKIP = VCC (Note 2) 1.039 1.061 V
SMPS2 Voltage Accuracy VCSL2 Measured at CSL2, FB2 = REF;
VIN = 2V to 26V, SKIP = VCC (Note 2) 1.485 1.515 V
INTERNAL REFERENCE Reference Voltage VREF VDD = 4.5V to 5.5V 1.985 2.015 V
FAULT DETECTIONSMPS1 Overvoltage Trip
Threshold and PGOOD1
Upper Threshold
(MAX17007A Only)
VOVP1,
VPG1_H
With respect to the internal target voltage
(error comparator threshold); rising edge;
hysteresis = 50mV
260 340 mV
SMPS2 Overvoltage Trip
Threshold and PGOOD2
Upper Threshold
(MAX17007A Only)
VOVP2,
VPG2_H
With respect to the internal target voltage
0.7V (error comparator threshold);
hysteresis = 50mV
120 180 mV
SMPS1 Undervoltage Protection
Trip Threshold and Lower
PGOOD1 Threshold
VUVP1,
VPG1_L
With respect to the internal target voltage
(error comparator threshold) falling edge;
hysteresis = 50mV
-240 -160 mV
SMPS2 Undervoltage Protection
Trip Threshold and Lower
PGOOD2 Threshold
VUVP2,
VPG2_L
With respect to the internal target voltage
0.7V (error comparator threshold)
falling edge; hysteresis = 50mV
-130 -70 mV
Output Undervoltage Fault
Propagation Delay tUVP REFIN1/FB2 forced 25mV below trip
threshold 90 360 µs
PGOOD_ Propagation Delay tPGOOD Startup delay from regulation 90 360 µs
PGOOD_ Output Low Voltage ISINK = 3mA 0.4 V
VCC Undervoltage Lockout
Threshold VUVLO(VCC) Rising edge, PWM disabled below this level;
hysteresis = 100mV 3.8 4.45 V
CURRENT LIMITCSH1, CSH2 0 2.3 Current-Sense Input Range CSL1, CSL2 0 2.3 V
Current-Limit Threshold (Fixed) VCSLIMIT VCSH_ - VCSL_, ILIM1 = ILIM2 = REF 27 33 mV
Ultrasonic Frequency
SKIP = OPEN (3.3V);
VCSL1 = VREFIN1 + 50mV;
VCSL2 = VFB2 + 50mV
18 kHz
VCSL1 = VREF1 + 50mV 22 46 Ultrasonic Current-Limit
Threshold SKIP = OPEN (3.3V) VCSL2 = VFB2 + 50mV 18 46 mV
Current-Balance Amplifier (GMI)
Offset [V(CSH1,CSL1) - V(CSH2,CSL2)] at ICCI = 0 -3 +3 mV
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
Note 1:On-time and off-time specifications are measured from 50% point to 50% point at the DH pin with LX = GND, VBST= 5V, and
a 250pF capacitor connected from DH to LX. Actual in-circuit times might differ due to MOSFET switching speeds.
Note 2: The 0 to 0.5V range is guaranteed by design, not production tested.
Note 3:Not production tested.
Note 4: Specifications at TA= -40°C to +105°C are guaranteed by design, not production tested.
ELECTRICAL CHARACTERISTICS (continued)(VIN= 12V, VDD= VCC= VEN1= VEN2= 5V, VREFIN1= 2V, SKIP= GND, TA
= -40°C to +105°C, unless otherwise noted.) (Note 4)
PARAMETERSYMBOLCONDITIONSMINMAXUNITS
GATE DRIVERSLow state (pulldown) 4.5 DH1, DH2 Gate-Driver
On-Resistance RON(DH) BST_ - LX_ forced to
5V High state (pullup) 4.0
High state (pullup) 3 DL1, DL2 Gate-Driver
On-Resistance RON(DL) Low state (pulldown) 2.5
DH_ low to DL high 8 42 Driver Propagation Delay DL_ low to DH high 12 48 ns
Internal BST_ Switch
On-Resistance RBST_ IBST_ = 10mA, VDD = 5V 12
INPUTS AND OUTPUTSEN1, EN2 Logic-Input Threshold EN1, EN2 rising edge;
hysteresis = 300mV/600mV (min/max) 1.20 2.20 V
High (5V) VCC -
0.3
Open (3.3V) 3.0 3.6
Ref (2.0V) 1.7 2.3
Quad-Level Input Logic Levels SKIP, ILIM1, ILIM2
Low (GND) 0.4
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
Typical Operating Characteristics(Circuit of Figure 1, VIN= 12V, VDD= 5V, SKIP= GND, TA= +25°C, unless otherwise noted.)
SMPS2 1.5V EFFICIENCY
vs. LOAD CURRENTMAX17007A toc01
LOAD CURRENT (A)
EFFICIENCY (%)10.1
12V20V
SKIP MODE
PWM MODE
SMPS2 1.5V EFFICIENCY
vs. LOAD CURRENTMAX17007A toc02
LOAD CURRENT (A)
EFFICIENCY (%)10.1
SKIP MODE
PWM MODE
VIN = 12V
ULTRASONIC
MODE
SMPS2 1.5V OUTPUT VOLTAGE
vs. LOAD CURRENTMAX17007A toc03
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)5
SKIP MODE
ULTRASONIC MODE
PWM
VIN = 12V
COMBINED 1.2V EFFICIENCY
vs. LOAD CURRENTMAX17007A toc04
LOAD CURRENT (A)
EFFICIENCY (%)10.1
SKIP MODE
PWM MODE
12V20V
COMBINED 1.2V OUTPUT VOLTAGE
vs. LOAD CURRENTMAX17007A toc05
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)20842412
SKIP MODE
PWM
VIN = 12V
SMPS2 SWITCHING FREQUENCY
vs. LOAD CURRENTMAX17007A toc06
LOAD CURRENT (A)
SWITCHING FREQUENCY (kHz)10.1
SKIP MODE
PWM MODE
VIN = 12V
ULTRASONIC
MODE
SMPS2 SWITCHING FREQUENCY
vs. INPUT VOLTAGEMAX17007A toc07
SWITCHING FREQUENCY (kHz)424
VIN = 12V
SKIP = 5V
IOUT2 = 5A
IOUT2 = 0A
SMPS2 SWITCHING FREQUENCY
vs. TEMPERATUREMAX17007A toc08
SWITCHING FREQUENCY (kHz)
VIN = 12V
SKIP = 5V
IOUT2 = 5A
IOUT2 = 0A
SMPS2 MAXIMUM OUTPUT CURRENT
vs. INPUT VOLTAGEMAX17007A toc09
MAXIMUM OUTPUT CURRENT (A)424
02881216
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
SMPS2 MAXIMUM OUTPUT CURRENT
vs. TEMPERATUREMAX17007A toc10
TEMPERATURE (°C)
MAXIMUM OUTPUT CURRENT (A)400
VIN = 12V
NO-LOAD SUPPLY CURRENT
vs. INPUT VOLTAGEMAX17007A toc11
INPUT VOLTAGE (V)
SUPPLY CURRERT (I
BIAS
) (mA)16
SKIP MODE
PWM MODE
ULTRASONIC MODE
EN1 = HIGH
EN2 = LOW
NO-LOAD INPUT CURRENT
vs. INPUT VOLTAGEINPUT VOLTAGE (V)
INPUT CURRENT (mA)16
SKIP MODE
PWM MODE
ULTRASONIC MODE
EN1 = HIGH
EN2 = LOW
REFERENCE VOLTAGE
vs. REFERENCE LOAD CURRENTMAX17007A toc13
REFERENCE LOAD CURRENT (μA)
REFERENCE VOLTAGE (V)60
REFIN1 TO CSL1 OFFSET VOLTAGE
DISTRIBUTION
MAX17007A toc14
OFFSET VOLTAGE (mV)
SAMPLE PERCENTAGE (%)
SAMPLE SIZE = 100TA = +85°C
TA = +25°C
SMPS1 PRESET 1.05V
VOLTAGE DISTRIBUTIONMAX17007A toc15
SMPS1 VOLTAGE (mV)
SAMPLE PERCENTAGE (%)
SAMPLE SIZE = 100TA = +85°C
TA = +25°C
SMPS2 PRESET 1.5V
VOLTAGE DISTRIBUTIONMAX17007A toc16
SMPS2 VOLTAGE (mV)
SAMPLE PERCENTAGE (%)
SAMPLE SIZE = 100TA = +85°C
TA = +25°C
COMBINED-MODE CURRENT BALANCE
vs. LOAD CURRENTMAX17007A toc17
LOAD CURRENT (A)
CSH -
CSL
(mV)1552510
SMPS1
SMPS2
SOFT-START WAVEFORMMAX17007A toc18
400μs/div
A. EN1, EN2, 5V/div
D. VOUT2, 1V/div
1.05V
1.5V
Typical Operating Characteristics (continued)(Circuit of Figure 1, VIN= 12V, VDD= 5V, SKIP= GND, TA= +25°C, unless otherwise noted.)
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
Typical Operating Characteristics (continued)(Circuit of Figure 1, VIN= 12V, VDD= 5V, SKIP= GND, TA= +25°C, unless otherwise noted.)
SMPS1 STARTUP WAVEFORM
(HEAVY LOAD)MAX17007A toc19
200μs/div
A. EN1, 5V/div
B. REF, 2V/div
C. VOUT1, 500mV/div
D. ILX1, 10A/div
E. PGOOD1, 10V/div
F. LX1, 10V/div
G. DL1, 10V/div
12V
1.05V
IOUT1 = 8A
SMPS1 STARTUP WAVEFORM
(LIGHT LOAD)MAX17007A toc20
200μs/div
A. EN1, 5V/div
B. REF, 2V/div
C. VOUT1, 500mV/div
D. ILX1, 5A/div
SKIP = 5V
IOUT1 = 2A
E. PGOOD1, 10V/div
F. LX1, 10V/div
G. DL1, 10V/div
1.05V
12V
SMPS1 SHUTDOWN WAVEFORMMAX17007A toc21
200μs/div
A. EN1, 5V/div
B. REF, 5V/div
C. VOUT1, 500mV/div
D. ILX1, 5A/div
E. PGOOD1, 10V/div
F. LX1, 10V/div
G. DL1, 10V/div
IOUT1 = 0.5A
SKIP = GND
1.05V
12V
SMPS2 LOAD-TRANSIENT RESPONSE
(PWM MODE)MAX17007A toc22
20μs/div
A. VOUT2, 50mV/div
B. ILX2, 10A/div
C. LX2, 10V/div
1.5V
10A
12V
IOUT2 = 2A TO 10A TO 2A
SKIP = 5V
SMPS2 LOAD-TRANSIENT RESPONSE
(SKIP MODE)MAX17007A toc23
20μs/div
A. VOUT2, 50mV/div
B. ILX2, 10A/div
C. LX2, 10V/div
1.5V
12V
IOUT2 = 0.5A TO 8.5A TO 0.5A
SKIP = GND
SMPS1 OUTPUT OVERLOAD WAVEFORMMAX17007A toc24
200μs/div
IOUT1 = 2A TO 15A
A. VOUT1, 500mV/div
B. ILX1, 10A/div
C. LX1, 10V/div
1.05V
10A
12V
D. PGOOD1, 5V/div
E. DL1, 5V/div
SMPS1 OUTPUT OVERVOLTAGE
WAVEFORMMAX17007A toc25
1.05V
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
DYNAMIC OUTPUT VOLTAGE
TRANSITION (PWM MODE)MAX17007A toc26
20μs/div
IOUT1 = 2A
REFIN1 = 1V
TO 1.2V TO 1V
1.2V
12V
A. VOUT1, 100mV/div
B. ILX1, 10A/div
C. LX1, 10V/div
D. DL1, 5V/div
SKIP = 5V
DYNAMIC OUTPUT VOLTAGE
TRANSITION (SKIP MODE)MAX17007A toc27
40μs/div
IOUT1 = 1A
1.2V
12V
A. VOUT1, 100mV/div
B. ILX1, 10A/div
C. LX1, 10V/div
D. DL1, 5V/div
REFIN1 = 1V
TO 1.2V TO 1V
SKIP = GND
DYNAMIC OUTPUT-VOLTAGE TRANSITION
(SKIP MODE-FORCED TRANSITION)MAX17007A toc28
20μs/div
1.2V
12V
A. VOUT1, 100mV/div
B. ILX2, 10A/div
IOUT1 = 1A
REFIN1 = 1V TO 1.2V TO 1V
SKIP = REF
C. LX1, 10V/div
D. DL1, 5V/div
IOUT1 = 3A
Pin Description
Typical Operating Characteristics (continued)(Circuit of Figure 1, VIN= 12V, VDD= 5V, SKIP= GND, TA= +25°C, unless otherwise noted.)
PINNAMEFUNCTION1 REF
2V Reference Voltage Output. Bypass REF to GND with a 2.2nF ceramic capacitor. The reference
can source up to 100µA. Loading REF degrades output-voltage accuracy according to the REF
load regulation error (see theTypical Operating Characteristics). The reference shuts down when
both EN1 and EN2 are low.
2 ILIM1
This four-level input determines the CSH1 to CSL1 current limit for SMPS1:
VCC (5V) = 60mV current limit
Open (3.3V) = 45mV current limit
REF (2V) = 30mV current limit
GND = 15mV current limit
In combined mode, ILIM1 sets the current-limit threshold for both sides.
This four-level input determines the CSH2 to CSL2 current limit for SMPS2:
VCC (5V) = 60mV current limit
Open (3.3V) = 45mV current limit
REF (2V) = 30mV current limit
GND = 15mV current limit
In combined mode, ILIM2 is the current balance integrator (CCI) output pin. Connect a capacitor
(CCCI) between CCI and the output. The CCI capacitor value depends on the ILIM1 setting based
on the following table:
ILIM1CCCI at ILIM2 (pF)VCC (5V)120
Open (3.3V) 180
REF (2V) 220 ILIM2
(CCI)
GND 470 5V Analog Supply Input. Bypass VCC from VDD using a 10 resistor, and to analog ground using a
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
Pin Description (continued)
PINNAMEFUNCTIONSKIP
Pulse-Skipping Control Input. This four-level input determines the mode of operation under normal
steady-state conditions and dynamic output-voltage transitions:
VDD (5V) = Forced-PWM operation
Open (3.3V) = Ultrasonic mode (without forced-PWM during transitions)
REF (2V) = Pulse-skipping mode (with forced-PWM during transitions)
GND = Pulse-skipping mode (without forced-PWM during transitions)
There are no dynamic transitions for SMPS2, so SKIP = 2V and SKIP = GND have the same pulse-
skipping behavior for SMPS2 without any forced-PWM transitions.
In combined mode, the ultrasonic mode is disabled, and the SKIP = open (3.3V) setting is identical
to the SKIP = GND setting.
6 TON1
Frequency-Setting Input for SMPS1. An external resistor between the input power source and TON1
sets the switching period (TSW1) of SMPS1:
TSW1 = CTON (RTON1 + 6.5k)
where CTON = 16.26pF.
TON1 is high impedance in shutdown.
In combined mode, TON1 sets the switching period for both SMPS1 and SMPS2.
7 TON2
Frequency-Setting Input for SMPS2. An external resistor between the input power source and TON2
sets the switching period (TSW2) of SMPS2:
TSW2 = CTON (RTON2 + 6.5k)
where CTON = 16.26pF.
Set TON2 to a switching frequency different from TON1. A 10% to 30% difference in switching
frequency between SMPS1 and SMPS2 is recommended.
TON2 is high impedance in shutdown.
In combined mode, TON2 may be left open.
8 REFIN1
External Reference Input for SMPS1. REFIN1 sets the feedback regulation voltage of CSL1. SMPS1
includes an internal window comparator to detect REFIN1 voltage changes that are greater than
±50mV (typ), allowing the controller to blank PGOOD1 and the fault protection, and force the output
transition, if enabled. When REFIN1 is tied to VCC, SMPS1 regulates the output to 1.05V.
In combined mode, REFIN1 sets the feedback regulation voltage of the combined output.
9 CSL1
Output-Sense and Negative Current-Sense Input for SMPS1. When using the internal preset 1.05V
feedback divider (REFIN1 = VCC), the controller uses CSL1 to sense the output voltage. Connect to
the negative terminal of the current-sense element. Figure 14 describes two different current-
sensing options—using accurate sense resistors or lossless inductor DCR sensing.
10 CSH1
Positive Current-Sense Input for SMPS1. Connect to the positive terminal of the current-sense
element. Figure 14 describes two different current-sensing options—using accurate sense
resistors or lossless inductor DCR sensing.
11 EN1
Enable Control Input for SMPS1. Connect to VCC for normal operation. Pull EN1 low to disable
SMPS1. The controller slowly ramps down the output voltage to ground and after the target voltage
reaches 0.1V, the controller forces DL1 low. When both EN1 and EN2 are low, the device enters the
low-power shutdown state.
In combined mode, EN1 controls the combined SMPS output. EN2 is unused and must be grounded.
12 PGOOD1
Open-Drain Power-Good Output for SMPS1. PGOOD1 is low when the SMPS1 voltage is more than 200mV
below or 300mV above the target voltage, during soft-start, and in shutdown. After the SMPS1 soft-start
circuit has terminated, PGOOD1 becomes high impedance 200µs after the output is in regulation.
PGOOD1 is blanked (forced high-impedance state) when a dynamic REFIN1 transition is detected.
13 DH1 High-Side Gate-Driver Output for SMPS1. DH1 swings from LX1 to BST1. DH1 is low in shutdown.
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
Pin Description (continued)
PINNAMEFUNCTION14 LX1 Inductor Connection for SMPS1. Connect LX1 to the switched side of the inductor. LX1 serves as the
lower supply rail for the DH1 high-side gate driver.
15 BST1
Bootstrap Capacitor Connection for SMPS1. The MAX17007A/MAX17007B/MAX17008 include an
internal boost switch/diode connected between VDD and BST1. Connect to an external capacitor as
shown in Figure 1.
16 GND Ground. Analog and power ground connection for the low-side gate driver of SMPS1.
17 DL1
Low-Side Gate Driver Output for SMPS1. DL1 swings from GND to VDD. DL1 is forced low after the
shutdown sequence has completed. DL1 is also forced high when an output overvoltage fault is
detected, overriding any negative current-limit condition that may be present. DL1 is forced low in VCC
UVLO.
18 VDD
5V Driver Supply Input. Connect VDD to VCC through a 10 resistor. Bypass to ground through a 2.2µF
or greater ceramic capacitor. VDD is internally connected to the BST diodes and the low-side gate
drivers.
19 DL2
Low-Side Gate-Driver Output for SMPS2. DL2 swings from PGND to VDD. DL2 is forced low after the
shutdown sequence has completed. DL2 is also forced high when an output overvoltage fault is
detected, overriding any negative current-limit condition that may be present. DL2 is forced low in VCC
UVLO.
20 PGND Power Ground for the Low-Side Gate Driver of SMPS2
21 BST2
Bootstrap Capacitor Connection for SMPS2. The MAX17007A/MAX17007B/MAX17008 include an
internal boost switch/diode connected between VDD and BST2. Connect to an external capacitor as
shown in Figure 1.
22 LX2 Inductor Connection for SMPS2. Connect LX2 to the switched side of the inductor. LX2 serves as the
lower supply rail for the DH2 high-side gate driver.
23 DH2 High-Side Gate-Driver Output for SMPS2. DH2 swings from LX2 to BST2. DH2 is low in shutdown.
24 PGOOD2
Open-Drain Power-Good Output for SMPS2. PGOOD2 is low when the FB2 voltage is more than 100mV
below or 150mV above the target voltage, during soft-start, and in shutdown. After the SMPS2 soft-start
circuit has terminated, PGOOD2 becomes high impedance 200µs after the output is in regulation.
In combined mode, PGOOD2 is not used and can be left open.
25 EN2
SMPS2 Enable Input. Connect to VCC for normal operation. Pull EN2 low to disable SMPS2. The
controller slowly ramps down the output voltage to ground, and after the target voltage reaches 0.1V,
the controller forces DL2 low. When both EN1 and EN2 are low, the device enters the low-power
shutdown state.
In combined mode, EN2 is not used and should be connected to GND.
26 CSH2
Positive Current-Sense Input for SMPS2. Connect to the positive terminal of the current-sense element.
Figure 14 describes two different current-sensing options—using accurate sense resistors or lossless
inductor DCR sensing.
27 CSL2
Output-Sense and Negative Current-Sense Input for SMPS2. When using the internal preset 1.5V
feedback divider (FB2 = REF), the controller uses CSL2 to sense the output voltage. Connect to the
negative terminal of the current-sense element. Figure 14 describes two different current-sensing
options—using accurate sense resistors or lossless inductor DCR sensing.
28 FB2
SMPS2 Feedback Input. Adjust the SMPS2 voltage with a resistive voltage-divider between SMPS2
output and GND. Connect FB2 to REF for preset 1.5V output. Tie FB2 to VCC to configure the
MAX17007A/MAX17007B/MAX17008 for combined-mode operation. EP Exposed Backside Pad. Connect to analog ground.
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook ComputersMAX17007A
MAX17007B
MAX17008TON1
AGND
RREFIN1
RREFIN2
CVCC
1μF
100kΩ
TO SYSTEM
POWER-GOOD
10Ω
RTON1
220kΩ
RNTC1
10kΩ
3.01kΩ
RTON2
180kΩ
CREF
2.2nF
RREFIN3
GND
PWR
PWR
PWR
AGND
PWR
AGNDILIM1ILIM2
(CCI)SKIPEN1EN2REF
RREFIN1 = 80.6kΩ
RREFIN2 = 121kΩ
RREFIN3 = 249kΩ8REFIN1PGOOD1PGOOD2TON2BST1DH1LX1DL1
NH1
NL120PGNDCSH1CSL1FB2
VCC
VDD
REF
REF
+3.3V
H = 1.0V
L = 1.2V
4-LEVEL SKIP PIN
REF
+5V
CONNECT TO REF FOR
FIXED 1.5V OUTPUT
*LOWER INPUT VOLTAGES REQUIRE
ADDITIONAL INPUT CAPACITANCE.
VIN
7V TO 20V
POWER GROUND
ANALOG GROUND
100kΩ
CVDD
2.2μF
0.22μF
CBST1
0.1μF
PWR
DL1
CIN1
1.5kΩ
COUT1
2 x 330μF
12mΩ
1μH, 16A, 3mΩVOUT1
1.2V/1.0V, 12A
ILIM1
ILIM2
VCC
OPEN
REF
GND
10Ω
1nF
PWR
COUT1-CER
5 x 10μF
CERAMIC
VOUT2
1.5V, 12A
RNTC2
10kΩ
3.01kΩ
PWR
AGND
PWRBST2DH2LX2DL2
NH2
NL2CSH2CSL2
VIN
7V TO 20V
0.22μF
CBST2
0.1μF
PWR
DL2
CIN2
1.5kΩ
COUT2
2 x 330μF
12mΩ
1μH, 16A, 3mΩ
10Ω
1nF
PWR
COUT2-CER
5 x 10μF
CERAMIC
CURRENT
LIMIT
60mV
45mV
30mV
15mV
Figure 1. MAX17007A/MAX17007B/MAX17008 Separate-Mode Standard Application Circuit
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
VOUT1 = 1.0V/1.2V AT 12A
(FIGURE 1)
VOUT = 1.5V AT 12A
(FIGURE 1)COMPONENTVIN = 7V to 20V
TON1 = 220k (270kHz)
VIN = 7V to 20V
TON2 = 180k (330kHz)
Input Capacitor
(per Phase)
(2x) 10µF, 25V
Taiyo Yuden TMK432BJ106KM
(2x) 10µF, 25V
Taiyo Yuden TMK432BJ106KM
Output Capacitor (2x) 330µF, 2.5V, 12m, C case
SANYO 2R5TPE330MCC2
(2x) 330µF, 2.5V, 12m, C case
SANYO 2R5TPE330MCC2
Inductor 1µH, 3.25m, 16A
Würth Electronics 7443552100
1µH, 3.25m, 16A
Würth Electronics 7443552100
Schottky Diode
2A, 30V Schottky diode (SMA)
Nihon EC21QS03L
Central Semiconductor
CMSH2-40M
2A, 30V Schottky diode (SMA)
Nihon EC21QS03L
Central Semiconductor
CMSH2-40M
High-Side MOSFET
Fairchild Semiconductor
(1x) FDS8690
8.6m/11.4m (typ/max)
Fairchild Semiconductor
(1x) FDS8690
8.6m/11.4m (typ/max)
Low-Side MOSFET
Fairchild Semiconductor
(1x) FDS8670
4.2m/5m (typ/max)
Fairchild Semiconductor
(1x) FDS8670
4.2m/5m (typ/max)
Table 1. Component Selection for Standard Applications
MANUFACTURERWEBSITEMANUFACTURERWEBSITEAVX Corp. www.avxcorp.com Pulse Engineering www.pulseeng.com
BI Technologies www.bitechnologies.com Renesas Technology Corp. www.renesas.com
Central Semiconductor Corp. www.centralsemi.com SANYO Electric Company, Ltd. www.sanyodevice.com
Fairchild Semiconductor www.fairchildsemi.com Siliconix (Vishay) www.vishay.com
International Rectifier www.irf.com Sumida Corp. www.sumida.com
KEMET Corp. www.kemet.com Taiyo Yuden www.t-yuden.com
NEC TOKIN America, Inc. www.nec-tokinamerica.com TDK Corp. www.component.tdk.com
Panasonic Corp. www.panasonic.com TOKO America, Inc. www.tokoam.com
Table 2. Component Suppliers
Detailed DescriptionThe MAX17007A/MAX17007B/MAX17008 standard appli-
cation circuit (Figure 1) generates the 1V to 1.2V/12A and
1.5V/12A chipset voltages in a notebook computer. The
input supply range is 7V to 20V for the specific applica-
tion. Table 1lists component selections, while Table 2
lists the component manufacturers. Figure 2 shows the
combined-mode standard application circuit and Figure
3 is the MAX17007A/MAX17007B/MAX17008 functional
diagram.
The MAX17007A/MAX17007B/MAX17008B contain two
constant on-time step-down controllers designed for low-
voltage power supplies. The two SMPSs can also be
combined to operate as a two-phase high-current single-
provides fast response to load transients and handles
wide I/O voltage ratios with ease, while maintaining a rel-
atively constant switching frequency. The switching fre-
quency can be adjusted between 200kHz and 600kHz
with external resistors. Differential output current sensing
allows output sense-resistor sensing for an accurate cur-
rent-limit, lossless inductor DCR current sensing for lower
power dissipation while maintaining 0.7% output accura-
cy. Overvoltage (MAX17007A/MAX17007B) and under-
voltage protection and accurate user-selectable current
limits (four different levels) ensure robust operations.
The MAX17007A/MAX17007B/MAX17008 feature a
special combined-mode configuration that allows high-
er current outputs to be supported. A current-balance
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook ComputersMAX17007A
MAX17007B
MAX17008
TON1
AGND
RREFIN1
RREFIN2
CVCC
1μF
PGOOD2 NOT USED
IIN COMBINED MODE
ILIM2 FUNCTIONS AS
CCI OUTPUT IN
COMBINED MODE
EN2 MUST BE
GROUNDED
10Ω
RTON1
220kΩ
RNTC1
10kΩ
3.01kΩ
CREF
2.2nF
CCCI
220pF
RREFIN3
GND
PWR
PWR
PWR
AGND
PWR
AGNDILIM1ILIM2
(CCI)SKIPEN1EN2REF
RREFIN1 = 80.6kΩ
RREFIN2 = 121kΩ
RREFIN3 = 249kΩ8REFIN1PGOOD1PGOOD2TON2BST1DH1LX1DL1
NH1
NL120PGNDCSH1CSL1FB2
VCC
VDD
REF
VOUT
+3.3V
H = 1.0V
L = 1.2V
+5V
+5V
CONNECT TO 5V FOR
COMBINED MODE OPERATION
*LOWER INPUT VOLTAGES REQUIRE
ADDITIONAL INPUT CAPACITANCE.
VIN
7V TO 20V
POWER GROUND
ANALOG GROUND
100kΩ
CVDD
2.2μF
0.22μF
CBST1
0.1μF
PWR
DL1
CIN1
1.5kΩ
COUT1
4 x 330μF
12mΩ
1μH, 16A, 3mΩ
VOUT1
1.2V/1.0V, 24A
ILIM
PIN
VCC
OPEN
REF
GND
10Ω
1nF
PWR
COUT1-CER
10 x 10μF
CERAMIC
RNTC2
10kΩ
3.01kΩ
PWR
AGNDBST2DH2LX2DL2
NH2
NL2CSH2CSL2
VIN
7V TO 20V
0.22μF
CBST2
0.1μF
PWR
DL2
CIN2
1.5kΩ
1μH, 16A, 3mΩ
10Ω
1nF
CURRENT
LIMIT
CCCI
(pF)
60mV
45mV
30mV
15mV
Figure 2. MAX17007A/MAX17007B/MAX17008 Combined-Mode Standard Application Circuit
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook ComputersMAX17007A
MAX17007B
MAX17008POWER-GOOD AND
FAULT PROTECTION 2
(FIGURE 13)
PWM CONTROLLER 2
(FIGURE 4)
CURRENT LIMIT 2
(FIGURE 8)
SMPS2 TARGET
DECODE
(FIGURE 9B)
MUX
2.0V
REF
PGOOD2
COMBINE
(FB2 = VCC)
FB2
CSH2
CSL2
ILIM2
EN2
LX2
CURRENT-
SENSE GAIN
VALLEY
CURRENT
LIMIT
DH2
BST2
PGND
DL2
VDD
CSL2
TARGET2
POWER-GOOD AND
FAULT PROTECTION 1
(FIGURE 13)
PWM CONTROLLER 1
(FIGURE 4)
CURRENT LIMIT 1
(FIGURE 8)
SMPS1 TARGET
DECODE
(FIGURE 9A)
MUX
PGOOD1
REF
VCC
REFIN1
CSH1
CSL1
ILIM1
SKIP
TON1
TON2
EN1
LX1
CURRENT-
SENSE GAIN
VALLEY
CURRENT
LIMIT
DH1
BST1
GND
DL1
CSL1
TARGET1
FAULT1FAULT2
VDD
CURRENT
BALANCE
COMBINE
(FB2 = VCC)
COMBINE
(FB2 = VCC)
COMBINE
(FB2 = VCC)
Figure 3. MAX17007A/MAX17007B/MAX17008 Functional Diagram
+5V Bias Supply (VCC, VDD)The MAX17007A/MAX17007B/MAX17008 require an
external 5V bias supply in addition to the battery.
Typically, this 5V bias supply is the notebook’s 95%-
efficient 5V system supply. Keeping the bias supply
external to the IC improves efficiency and eliminates
the cost associated with the 5V linear regulator that
would otherwise be needed to supply the PWM circuit
and gate drivers. If stand-alone capability is needed,
the 5V supply can be generated with an external linear
regulator such as the MAX1615.
The 5V bias supply powers both the PWM controllers
and internal gate-drive power, so the maximum current
drawn depends on the external MOSFET’s gate capaci-
tance, and the selected switching frequency:
IBIAS= IQ+ fSW1QG(SMPS1)+ fSW2QG(SMPS2)
= 4mA to 40mA (typ)
Bypass VCCwith a 1µF or greater ceramic capacitor to
the analog ground. Bypass VDDwith a 2.2µF or greater
ceramic capacitor to the power ground. VCCand VDD
should be separated with a 10Ωresistor (Figure 1).
2V ReferenceThe 2V reference is accurate to ±1% over temperature
and load, making REF useful as a precision system ref-
erence. Bypass REF to GND with a 2.2nF. The refer-
ence sources up to 100µA and sinks 10µA to support
external loads.
Combined-Mode Operation (FB2 = VCC)Combined-mode operation allows the MAX17007A/
MAX17007B/MAX17008 to support even higher output
currents by sharing the load current between two phas-
es, distributing the power dissipation over several
power components to improve the efficiency. The
MAX17007A/MAX17007B/MAX17008 are configured in
combined mode by connecting FB2 to VCC. See
Figure2 for the combined-mode standard application
circuit.
Table 3 lists the pin function differences between com-
bined mode and separate mode. See the Pin Description
for additional details.
MAX17007A/MAX17007B/MAX17008
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
PINCOMBINED MODESEPARATE MODEFB2
Connect to VCC to configure
MAX17007A/MAX17007B/MAX17008 for combined-mode
operation
Connect to REF for preset 1.5V, or use a resistor-
divider to set the SMPS2 output voltage
REFIN1 Sets the combined output voltage—dynamic, fixed, and
preset voltages supported
Sets the SMPS1 output voltage—dynamic, fixed,
and preset voltages supported
EN1 Enables/disables combined output Enables/disables SMPS1
EN2 Not used; connect to GND Enables/disables SMPS2
PGOOD1 Power-good indicator for combined output voltage Power-good indicator for SMPS1
PGOOD2 Not used; can be left open Power-good indicator for SMPS2
TON1 Sets the per-phase switching frequency for both SMPSs Sets the switching frequency for SMPS1
TON2 Not used; leave open Sets the switching frequency for SMPS2
ILIM1 Sets the per-phase current limit for both SMPSs Sets SMPS1 current limit
ILIM2 (CCI) Current-balance integrator output; connect a capacitor from
CCI to the output Sets SMPS2 current limit
SKIPOnly three distinct modes of operation; ultrasonic mode not
supported Supports all four modes of operation
Table 3. Pin Function in Combined and Separate Modes
