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MAX1211ETL+ |MAX1211ETLMAXIMN/a13avai12-Bit, 65Msps, IF Sampling ADC


MAX1211ETL+ ,12-Bit, 65Msps, IF Sampling ADCApplicationsIF and Baseband Communication ReceiversCellular, LMDS, Point-to-Point Microwave, REFP 1 ..
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MAX121CPE ,308Ksps ADC with DSP Interface and 78dB SINADELECTRICAL CHARACTERISTICS (an = 4.75V to S25V, vss = -10 EVto -1575V,MAX121C/EfcLN = 5.5MHz, MAX1 ..
MAX351CPE ,Precision, Quad, SPST Analog Switches
MAX351CPE+ ,Precision, Quad, SPST Analog Switches
MAX351CSE ,Precision, Quad, SPST Analog Switches
MAX351CSE ,Precision, Quad, SPST Analog Switches
MAX351CSE+ ,Precision, Quad, SPST Analog Switches
MAX351ESE ,Precision, Quad, SPST Analog Switches


MAX1211ETL+
12-Bit, 65Msps, IF Sampling ADC
neral DescriptionThe MAX1211 is a 3.3V, 12-bit analog-to-digital convert-
er (ADC) featuring a fully differential wideband track-
and-hold (T/H) input, driving the internal quantizer. The
MAX1211 is optimized for low power, small size, and
high dynamic performance in intermediate frequency
(IF) sampling applications. This ADC operates from a
single 3.0V to 3.6V supply, consuming only 340mW
while delivering a typical signal-to-noise ratio (SNR) per-
formance of 66.8dB at a 175MHz input frequency. The
T/H-driven input stage accepts single-ended or differen-
tial inputs. In addition to low operating power, the
MAX1211 features a 0.15mW power-down mode to con-
serve power during idle periods.
A flexible reference structure allows the MAX1211 to
use its internal precision bandgap reference or accept
an externally applied reference. A common-mode refer-
ence is provided to simplify design and reduce external
component count in differential analog input circuits.
The MAX1211 supports both a single-ended and differ-
ential input clock drive. Wide variations in the clock
duty cycle are compensated with the ADC’s internal
duty-cycle equalizer.
The MAX1211 features parallel, CMOS-compatible out-
puts. The digital output format is pin selectable to be
either two’s complement or Gray code. A data-valid indi-
cator eliminates external components that are normally
required for reliable digital interfacing. A separate power
input for the digital outputs accepts a voltage from 1.7V
to 3.6V for flexible interfacing with various logic levels.
The MAX1211 is available in a 6mm x 6mm x 0.8mm, 40-
pin thin QFN package with exposed paddle (EP), and is
specified for the extended industrial (-40°C to +85°C)
temperature range.
Applications

IF and Baseband Communication Receivers
Cellular, LMDS, Point-to-Point Microwave,
MMDS, HFC, WLAN
Ultrasound and Medical Imaging
Portable Instrumentation
Low-Power Data Acquisition
Features
Direct IF Sampling Up to 400MHz700MHz Input BandwidthExcellent Dynamic Performance
66.8dB SNR at fIN= 175MHz
79.7dBc SFDR at fIN= 175MHz
3.3V Low-Power Operation
314mW (Single-Ended Clock Mode)
340mW (Differential Clock Mode)
Differential or Single-Ended ClockAccepts 20% to 80% Clock Duty CycleFully Differential or Single-Ended Analog InputAdjustable Full-Scale Analog Input RangeCommon-Mode ReferencePower-Down ModeCMOS-Compatible Outputs in Two’s Complement
or Gray Code
Data-Valid Indicator Simplifies Digital InterfaceOut-of-Range IndicatorMiniature, 40-Pin Thin QFN Package with Exposed
Paddle
Evaluation Kit Available (Order MAX1211EVKIT)5Msps, 12-Bit, IF Sampling ADC
EXPOSED PADDLE (GND)COM
GND
INP
INN
GND
DCE
CLKN
CLKP
REFN
REFP1393837363534333231
I.C
I.C
THIN QFN
6mm × 6mm × 0.8mm

MAX1211
TOP VIEW
Pin Configuration
Ordering Information

19-2922; Rev 1; 5/04
EVALUATION KIT
AVAILABLE
PARTTEMP RANGEPIN-PACKAGE

MAX1211ETL-40°C to +85°C40 Thin QFN (6mm x 6mm)
5Msps, 12-Bit, IF Sampling ADCABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND...........................................................-0.3V to +3.6V
OVDDto GND........-0.3V to the lower of (VDD+ 0.3V) and +3.6V
INP, INN to GND...-0.3V to the lower of (VDD+ 0.3V) and +3.6V
REFIN, REFOUT, REFP, REFN,
COM to GND.....-0.3V to the lower of (VDD+ 0.3V) and +3.6V
CLKP, CLKN, CLKTYP, G/T, DCE,
PD to GND........-0.3V to the lower of (VDD+ 0.3V) and +3.6V
D11–D0, I.C., DAV, DOR to GND............-0.3V to (OVDD+ 0.3V)
Continuous Power Dissipation (TA= +70°C)
40-Pin Thin QFN 6mm x 6mm x 0.8mm
(derated 26.3mW/°C above +70°C)........................2105.3mW
Operating Temperature Range...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering 10s)..................................+300°C
ELECTRICAL CHARACTERISTICS

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T= low, fCLK= 65MHz (50% duty cycle), CREFP= CREFN= 0.1μF, 1μF in parallel with
10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at TA= +25°C.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
DC ACCURACY

Resolution12Bits
Integral NonlinearityINLfIN = 3MHz (Note 2)±0.30±0.75LSB
Differential NonlinearityDNLfIN = 3MHz, no missing codes over
temperature (Note 2)±0.30±0.75LSB
Offset ErrorVREFIN = 2.048V±0.20±0.91%FS
Gain ErrorVREFIN = 2.048V±0.3±4.1%FS
ANALOG INPUT (INP, INN)

Differential Input Voltage RangeVDIFFDifferential or single-ended inputs±1.024V
Common-Mode Input VoltageVDD / 2V
Input ResistanceRINSwitched capacitor load15kΩ
Input CapacitanceCIN4pF
CONVERSION RATE

Maximum Clock FrequencyfCLK65MHz
Minimum Clock Frequency5MHz
Data LatencyFigure 58.5Clock
cycles
DYNAMIC CHARACTERISTICS (Differential inputs, 4096-point FFT)

fIN = 3MHz at -0.5dBFS (Note 3)67.068.5
fIN = 70MHz at -0.5dBFS (Note 3)66.868.3Signal-to-Noise RatioSNR
fIN = 175MHz at -0.5dBFS64.866.8
fIN = 3MHz at -0.5dBFS (Note 3)67.068.4
fIN = 70MHz at -0.5dBFS (Note 3)66.568.1Signal-to-Noise and DistortionSINAD
fIN = 175MHz at -0.5dBFS64.666.5
fIN = 3MHz at -0.5dBFS (Note 3)81.590.4
fIN = 70MHz at -0.5dBFS (Note 3)74.082.4Spurious-Free Dynamic RangeSFDR
fIN = 175MHz at -0.5dBFS74.079.7
dBc
5Msps, 12-Bit, IF Sampling ADCELECTRICAL CHARACTERISTICS (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T= low, fCLK= 65MHz (50% duty cycle), CREFP= CREFN= 0.1μF, 1μF in parallel with
10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at TA= +25°C.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

fIN = 3MHz at -0.5dBFS (Note 3)-89.3-80.0
fIN = 70MHz at -0.5dBFS (Note 3)-81.3-73.6Total Harmonic DistortionTHD
fIN = 175MHz at -5dBFS-78.7-73.6
dBc
Second HarmonicHD2fIN1 = 70MHz at -5dBFS-82.4-74.0dBc
Third HarmonicHD3fIN = 70MHz at -0.5dBFS (Note 3)-90.9-84.6dBc
fIN1 = 68.5MHz at -7dBFS
fIN2 = 71.5MHz at -7dBFS-82.4
Third-Order IntermodulationIM3
fIN1 = 172.5MHz at -7dBFS
fIN2 = 177.5MHz at -7dBFS-81.2
dBc
Full-Power BandwidthFPBWInput at -0.5dBFS, -3dB rolloff700MHz
Aperture DelaytADFigure 140.9ns
Aperture JittertAJFigure 14<0.2psRMS
Output NoisenOUTINP = INN = COM0.5LSBRMS
Overdrive Recovery Time±10% beyond full scale1Clock
cycles
INTERNAL REFERENCE (REFIN = REFOUT; VREFP, VREFN, and VCOM are generated internally)

REFOUT Output VoltageVREFOUT1.9962.0482.071V
COM Output VoltageVCOMVDD / 21.65V
Differential Reference Output
VoltageVREFVREF = VREFP - VREFN1.024V
REFOUT Load Regulation35mV/mA
REFOUT Temperature CoefficientTCREF+100ppm/°C
Short to VDD0.24REFOUT Short-Circuit CurrentShort to GND2.1mAU F F ER ED EXT ER N A L R EF ER EN C E ( RE FIN d r i ven exter nal l y, V R E F IN = 2.048V , V R E F P , V R E F N , and V C OM ar e g ener ated i nter nal l y)
REFIN Input VoltageVREFIN2.048V
REFP Output VoltageVREFP(VDD / 2) + (VREFIN / 4)2.162V
REFN Output VoltageVREFN(VDD / 2) - (VREFIN / 4)1.138V
COM Output VoltageVCOMVDD / 21.601.651.70V
Differential Reference Output
VoltageVREFVREF = VREFP - VREFN0.9781.0241.059V
Differential Reference
Temperature Coefficient+12.5ppm/°C
Source0.4Maximum REFP CurrentIREFPSink1.4mA
Source1.0Maximum REFN CurrentIREFNSink1.0mA
5Msps, 12-Bit, IF Sampling ADCELECTRICAL CHARACTERISTICS (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T= low, fCLK= 65MHz (50% duty cycle), CREFP= CREFN= 0.1μF, 1μF in parallel with
10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at TA= +25°C.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS

Source1.0Maximum COM CurrentICOMSink0.4mA
REFIN Input Resistance>50MΩ
UNBUFFERED EXTERNAL REFERENCE (REFIN = GND, VREFP, VREFN, and VCOM are applied externally)

COM Input VoltageVCOMVDD / 21.65V
REFP Input VoltageVREFP - VCOM0.512V
REFN Input VoltageVREFN - VCOM-0.512V
Differential Reference Input
VoltageVREFVREF = VREFP - VREFN1.024V
REFP Sink CurrentIREFPVREFP = 2.162V1.1mA
REFN Source CurrentIREFNVREFN = 1.138V1.1mA
COM Sink CurrentICOM0.3mA
REFP, REFN Capacitance13pF
COM Capacitance6pF
CLOCK INPUTS (CLKP, CLKN)

Single-Ended Input High
ThresholdVIHCLKTYP = GND, CLKN = GND0.8 x
VDDV
Single-Ended Input Low
ThresholdVILCLKTYP = GND, CLKN = GND0.2 x
VDDV
Differential Input Voltage SwingCLKTYP = high1.4VP-P
Differential Input Common-Mode
VoltageCLKTYP = highVDD / 2V
DCE = OVDD20Minimum Clock Duty CycleDCE = GND45%
DCE = OVDD80Maximum Clock Duty CycleDCE = GND65%
Input ResistanceRCLKFigure 45kΩ
Input CapacitanceCCLK2pF
DIGITAL INPUTS (CLKTYP, G/T, PD)

Input High ThresholdVIH0.8 x
OVDDV
Input Low ThresholdVIL0.2 x
OVDDV
VIH = OVDD±5Input Leakage CurrentVIL = 0±5μA
Input CapacitanceCDIN5pF
5Msps, 12-Bit, IF Sampling ADCELECTRICAL CHARACTERISTICS (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T= low, fCLK= 65MHz (50% duty cycle), CREFP= CREFN= 0.1μF, 1μF in parallel with
10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at TA= +25°C.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
DIGITAL OUTPUTS (D0–D11, DAV, DOR)

D0–D11, DOR, ISINK = 200μA0.2Output-Voltage LowVOLDAV, ISINK = 600μA0.2V
D0–D11, DOR, ISOURCE = 200μAOVDD
- 0.2
Output-Voltage HighVOH
DAV, ISOURCE = 600μAOVDD
- 0.2
Tri-State Leakage CurrentILEAK(Note 4)±5μA
D11–D0, DOR Tri-State Output
CapacitanceCOUT(Note 4)3pF
DAV Tri-State Output
CapacitanceCDAV(Note 4)6pF
POWER REQUIREMENTS

Analog Supply VoltageVDD3.03.33.6V
Digital Output Supply VoltageOVDD1.72.0VDD
+ 0.3VV
Normal operating mode,
fIN = 175MHz at -0.5dBFS,
CLKTYP = GND, single-ended clock
Normal operating mode,
fIN = 175MHz at -0.5dBFS,
CLKTYP = OVDD, differential clock
103115Analog Supply CurrentIVDD
Power-down mode; clock idle,
PD = OVDD0.045
Normal operating mode,
fIN = 175MHz at -0.5dBFS,
CLKTYP = GND, single-ended clock
Normal operating mode,
fIN = 175MHz at -0.5dBFS,
CLKTYP = OVDD, differential clock
340379Analog Power DissipationPDISS
Power-down mode, clock idle,
PD = OVDD0.15
Normal operating mode,
fIN = 175MHz at -0.5dBFS,
OVDD = 2.0V, CL ≈ 5pF
9.2mA
Digital Output Supply CurrentIOVDD
Power-down mode; clock idle,
PD = OVDD6μA
5Msps, 12-Bit, IF Sampling ADCELECTRICAL CHARACTERISTICS (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, VIN= -
0.5dBFS, CLKTYP = high, DCE = high, PD = low, G/T= low, fCLK= 65MHz (50% duty cycle), CREFP= CREFN= 0.1μF, 1μF in parallel with
10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= -40°C to +85°C, unless otherwise noted. Typical values
are at TA= +25°C.) (Note 1)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
TIMING CHARACTERISTICS (Figure 5)

Clock Pulse-Width HightCH7.7ns
Clock Pulse-Width LowtCL7.7ns
Data Valid DelaytDAVCL = 5pF (Note 5)6.4ns
Data Setup Time Before Rising
Edge of DAVtSETUPCL = 5pF (Notes 3, 5)8.5ns
Data Hold Time After Rising Edge
of DAVtHOLDCL = 5pF (Notes 3, 5)6.3ns
Wake-Up Time from Power-DowntWAKEVREFIN = 2.048V10ms
Note 1:
Specifications ≥+25°C guaranteed by production test, <+25°C guaranteed by design and characterization.
Note 2:
Specifications guaranteed by design and characterization. Devices tested for performance during production test.
Note 3:
Guaranteed by design and characterization.
Note 4:
During power-down, D11–D0, DOR, and DAV are high impedance.
Note 5:
Digital outputs settle to VIHor VIL.
5Msps, 12-Bit, IF Sampling ADCTypical Operating Characteristics
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
SINGLE-TONE FFT PLOT
(8192-POINT DATA RECORD)
AX1211 toc01
FREQUENCY (MHz)
(d
HD32432
fCLK = 65.0002432MHz
fIN = 20.0031266MHz
AIN = -0.473dBFS
SNR = 68.481dBc
SINAD = 68.45dBc
THD = 89.888dBc
SFDR = 89.939dBc
HD2
SINGLE-TONE FFT PLOT
(8192-POINT DATA RECORD)
X1211 toc02
FREQUENCY (MHz)
(d
HD32432
HD2
fCLK = 65.0002432MHz
fIN = 32.1271954MHz
AIN = -0.529dBFS
SNR = 68.286dBc
SINAD = 68.218dBc
THD = -86.307dBc
SFDR = 89.518dBc
SINGLE-TONE FFT PLOT
(8192-POINT DATA RECORD)

AX1211 toc03
FREQUENCY (MHz)
(d
fCLK = 65.000HMz
fIN = 70.00671387MHz
AIN = -0.494dBFS
SNR = 68.33dBc
SINAD = 68.27dBc
THD = -86.91dBc
SFDR = 89.50dBc
HD2HD348122028162432
SINGLE-TONE FFT PLOT
(8192-POINT DATA RECORD)

AX1211 toc04
FREQUENCY (MHz)
(d
fCLK = 65.000HMz
fIN = 174.9969482MHz
AIN = -0.519BFS
SNR = 67.36dBc
SINAD = 67.01dBc
THD = -78.09dBc
SFDR = 79.15dBc
HD2HD3812202816243248122028162432
5Msps, 12-Bit, IF Sampling ADCTypical Operating Characteristics (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
DIFFERENTIAL NONLINEARITY
X1211 toc08
DIGITAL OUTPUT CODE
(L
INTEGRAL NONLINEARITY
AX1211 toc07
DIGITAL OUTPUT CODE
(L
TWO-TONE FFT PLOT
(16,384-POINT DATA RECORD)

X1211 toc05
FREQUENCY (MHz)
(d
fCLK = 65.00352Msps
fIN1 = 68.4988875MHz
fIN2 = 71.49832MHz
SNR = 63.37dBc
SFDRTT = 87.36dBc
IM3 = -88.91dBc
fIN2
fIN1
2 x fIN1 - fIN28122028162432
AIN1 = -7.04dBFS
AIN2 = -6.98dBFS
SINAD = 63.56dBc
IMD = -85.20dBc
TWO-TONE FFT PLOT
(16,384-POINT DATA RECORD)

X1211 toc06
FREQUENCY (MHz)
(d
fCLK = 65.00352Msps
fIN1 = 172.5029325MHz
fIN2 = 177.50196MHz
SNR = 61.24dBc
SFDRTT = 78.13dBc
IM3 = -81.20dBc
fIN2fIN1
2 x fIN1 - fIN2
fIN2 - fIN1
fIN1 + fIN2
2 x fIN1 + fIN2
3 x fIN1 + fIN28122028162432
AIN1 = -7.03dBFS
AIN2 = -7.02dBFS
SINAD = 61.21dBc
IMD = -78.14dBc
5Msps, 12-Bit, IF Sampling ADCTypical Operating Characteristics (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
SIGNAL-TO-NOISE RATIO
vs. SAMPLING RATE
AX1211 toc09
fCLK (MHz)
(d
fIN ≈ 32.1MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
SIGNAL-TO-NOISE + DISTORTION
vs. SAMPLING RATE
AX1211 toc10
fCLK (MHz)
(d
fIN ≈ 32.1MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
TOTAL HARMONIC DISTORTION
vs. SAMPLING RATE
AX1211 toc11
fCLK (MHz)
(d
fIN ≈ 32.1MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
SPURIOUS-FREE DYNAMIC RANGE
vs. SAMPLING RATE
AX1211 toc12
fCLK (MHz)
(d
fIN ≈ 32.1MHzDIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
5Msps, 12-Bit, IF Sampling ADCTypical Operating Characteristics (continued)
(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)4045503555606570
SIGNAL-TO-NOISE RATIO
vs. SAMPLING RATE

AX1211 toc13
fCLK (MHz)
(d
fIN ≈ 250MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK4045503555606570
SIGNAL-TO-NOISE DISTORTION
vs. SAMPLING RATE

AX1211 toc14
fCLK (MHz)
(d
fIN ≈ 250MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
TOTAL HARMONIC DISTORTION
vs. SAMPLING RATE
AX1211 toc15
fCLK (MHz)
(d
fIN ≈ 250MHz
SINGLE-ENDED CLOCK
DIFFERENTIAL CLOCK4035455055606570
SPURIOUS-FREE DYNAMIC RANGE
vs. SAMPLING RATE

AX1211 toc16
fCLK (MHz)
(d
fIN ≈ 250MHz
DIFFERENTIAL CLOCK
SINGLE-ENDED CLOCK
5Msps, 12-Bit, IF Sampling ADC10050150200250SIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT FREQUENCY

AX1211 toc17
ANALOG INPUT FREQUENCY (MHz)
(d100150200250
SIGNAL-TO-NOISE + DISTORTION
vs. ANALOG INPUT FREQUENCY

AX1211 toc18
ANALOG INPUT FREQUENCY (MHz)
(d
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT FREQUENCY
AX1211 toc19
ANALOG INPUT FREQUENCY (MHz)
(d
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT FREQUENCY
AX1211 toc20
ANALOG INPUT FREQUENCY (MHz)
(d
Typical Operating Characteristics (continued)

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
5Msps, 12-Bit, IF Sampling ADCSIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT POWER
AX1211 toc21
ANALOG INPUT POWER (dBFS)
(d
fIN = 32.1271954MHz
SIGNAL-TO-NOISE + DISTORTION
vs. ANALOG INPUT POWER
AX1211 toc22
ANALOG INPUT POWER (dBFS)
(d
fIN = 32.1271954MHz
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT POWER
1211 toc23
ANALOG INPUT POWER (dBFS)
(d
fIN = 32.1271954MHz
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT POWER
X1211 toc24
ANALOG INPUT POWER (dBFS)
(d
fIN = 32.1271954MHz
Typical Operating Characteristics (continued)

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
5Msps, 12-Bit, IF Sampling ADC403050607080SIGNAL-TO-NOISE RATIO
vs. CLOCK DUTY CYCLE

AX1211 toc25
CLOCK DUTY CYCLE (%)
(d
SINGLE-ENDED CLOCK
fIN = 32.1271954MHz
DCE = HIGH
DCE = LOW403050607080
SIGNAL-TO-NOISE + DISTORTION
vs. CLOCK DUTY CYCLE

AX1211 toc26
CLOCK DUTY CYCLE (%)
(d
SINGLE-ENDED CLOCK
fIN = 32.1271954MHz
DCE = HIGH
DCE = LOW
TOTAL HARMONIC DISTORTION
vs. CLOCK DUTY CYCLE
AX1211 toc27
CLOCK DUTY CYCLE (%)
(d
DCE = LOW
DCE = HIGH
SINGLE-ENDED CLOCK
fIN = 32.1271954MHz65
SPURIOUS-FREE DYNAMIC RANGE
vs. CLOCK DUTY CYCLE
AX1211 toc28
CLOCK DUTY CYCLE (%)
(d
DCE = LOW
DCE = HIGH
SINGLE-ENDED CLOCK
fIN = 32.1271954MHz
Typical Operating Characteristics (continued)

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
5Msps, 12-Bit, IF Sampling ADCSIGNAL-TO-NOISE RATIO vs. ANALOG
INPUT COMMON-MODE VOLTAGE
AX1211 toc29
ANALOG INPUT COMMON-MODE VOLTAGE (V)
(d
fIN = 32.1271954MHz
SIGNAL-TO-NOISE RATIO + DISTORTION
vs. ANALOG INPUT
COMMON-MODE VOLTAGE
X1211 toc30
ANALOG INPUT COMMON-MODE VOLTAGE (V)
(d
fIN = 32.1271954MHz
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT COMMON-MODE VOLTAGE
X1211 toc31
ANALOG INPUT COMMON-MODE VOLTAGE (V)
(d
fIN = 32.1271954MHz
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT COMMON-MODE VOLTAGE
AX1211 toc32
ANALOG INPUT COMMON-MODE VOLTAGE (V)
(d
fIN = 32.1271954MHz
Typical Operating Characteristics (continued)

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
5Msps, 12-Bit, IF Sampling ADCSIGNAL-TO-NOISE RATIO
vs. TEMPERATURE

AX1211 toc33
TEMPERATURE (°C)
(d3510-15
fIN ≈ 70MHz
SIGNAL-TO-NOISE + DISTORTION
vs. TEMPERATURE

X1211 toc34
TEMPERATURE (°C)
(d3510-15
fIN ≈ 70MHz
Typical Operating Characteristics (continued)

(VDD= 3.3V, OVDD= 2.0V, GND = 0, REFIN = REFOUT (internal reference), CREFOUT= 0.1μF, CL≈5pF at digital outputs, differential
input at -0.5dBFS, DCE = high, CLKTYP = high, PD = low, G/T= low, fCLK≈65MHz (50% duty cycle), CREFP= CREFN= 0.1μF to GND,
1μF in parallel with 10μF between REFP and REFN, CCOM= 0.1μF in parallel with 2.2μF to GND, TA= +25°C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION
vs. TEMPERATURE

(d
X1211 toc35
TEMPERATURE (°C)3510-15-4085
fIN ≈ 70MHz
SPURIOUS-FREE DYNAMIC RANGE
vs. TEMPERATURE

(d
AX1211 toc36
TEMPERATURE (°C)3510-15-4085
fIN ≈ 70MHz
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