HYE18L128160BC-7.5 ,BJAWBMSpecialty DRAMs Mobile-RAMfeatures.MOBILE-RAM DEVICES come in a Fine-pitch Ball Grid Array (FBGA) package. These packages lev ..
HYE18L128160BF-7.5 ,BJAWBMSpecialty DRAMs Mobile-RAMInfineon Specialty DRAMs Mobile-RAM/memory/Mobile-RAMNever stop thinking.Mobile-RAM – Extended Batt ..
HYE18L256160BC-7.5 ,Very low Power SDRAM optimized for battery-powered, handheld applicationsData Sheet, V1.42, Sept. 2004HYB18L256160BF-7.5HYE18L256160BF-7.5HYB18L256160BC-7.5HYE18L256160BC-7 ..
HYE18L256160BC-7.5 ,Very low Power SDRAM optimized for battery-powered, handheld applicationscharacteristics.Terms of delivery and rights to technical change reserved.We hereby disclaim any an ..
HYE18L256160BCX-7.5 , DRAMs for Mobile Applications 256-Mbit Mobile-RAM
HYE18L256160BF-7.5 ,Very low Power SDRAM optimized for battery-powered, handheld applicationsData Sheet, V1.42, Sept. 2004HYB18L256160BF-7.5HYE18L256160BF-7.5HYB18L256160BC-7.5HYE18L256160BC-7 ..
ICT49FCT3805ASO , 3.3V CMOS BUFFER/CLOCK DRIVER
ICTE-18 ,Diode TVS Single Uni-Dir 18V 1.5KW 2-Pin Case 41A-04 Boxapplications0.210 (5.3) • High temperature soldering guaranteed:O0.190 (4.8) 265 C/10 seconds, 0.37 ..
ICTE-5 ,Diode TVS Single Uni-Dir 5V 1.5KW 2-Pin Case 41A-04 Box Document Number 883562 23-May-03ICTE5.0 thru ICTE18C, 1N6373 thru 1N6378 & 1N6382 thru 1N6386Visha ..
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ICX039DNA , Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras
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BJAWBMSpecialty DRAMs Mobile-RAM
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( Infineon
technologies
Never stop thinking.
Mobile-RAM - Extended Battery
Lifetime for Handhelds
AS o N E O F T H E W O R L D , s TO P T H R E E memory companies, Infineon offers a wide portfolio of
leading-edge Mobile-RAM devices (low-power SDRAMs) targeted specifically at:
U PDAs
U Cellphones (smart and feature phones)
El Digital cameras
El MP3 players
INFINEON’S MOBILE-RAM productline combines
El Ultra low-power consumption for battery-powered systems with
El Extra compact chip-scale packages for space-constrained applications
I N Fl N E o N , S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions
and system design) - thanks to its latest memory technology, low operating voltage (1.8 V) and its unique, integrated
power management features.
M o B I L E - R A M D EV I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage
Infineon's proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product
generation further improves form factor by reducing package heights from 1.2 to 1 mm.
