Partno |
Mfg |
Dc |
Qty |
Available | Descript |
HSM88AS |
HITACHI |
N/a |
3000 |
|
MPAK package is suitable for high density surface mounting and high speed assembly |
HSM88ASR RENESAS, MPAK package is suitable for high density surface mounting and high speed assembly
HSM88ASR03TL HITACHI
HSM88ASRTL Renesas
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HSM88ASTR HITACHI
HSM88AS , MPAK package is suitable for high density surface mounting and high speed assembly
HSM88WA , MPAK package is suitable for high density surface mounting and high speed assembly
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