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FQP34N20L |FQP34N20LFSC N/a30avai200V LOGIC N-Channel MOSFET
FQP34N20LFAIRCHILDN/a500avai200V LOGIC N-Channel MOSFET


FQP34N20L ,200V LOGIC N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 31A, 200V, R = 0.075Ω @V = 10 VDS(on) ..
FQP34N20L ,200V LOGIC N-Channel MOSFETJune 2000TMQFET QFET QFET QFETFQP34N20L200V LOGIC N-Channel MOSFET
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FQP34N20L
200V LOGIC N-Channel MOSFET
June 2000 TM QFET QFET QFET QFET FQP34N20L 200V LOGIC N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 31A, 200V, R = 0.075Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 55 nC) planar stripe, DMOS technology. • Low Crss ( typical 52 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well • Low level gate drive requirement allowing direct suited for high efficiency switching DC/DC converters, opration from logic drivers switch mode power supply, motor control. D ! ! "" !!"" "" G! ! "" G D TO-220 S ! ! FQP Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQP34N20L Units V Drain-Source Voltage 200 V DSS I - Continuous (T = 25°C) Drain Current 31 A D C - Continuous (T = 100°C) 20 A C I (Note 1) Drain Current - Pulsed 124 A DM V Gate-Source Voltage ± 20 V GSS E (Note 2) Single Pulsed Avalanche Energy 640 mJ AS I Avalanche Current (Note 1) 31 A AR E (Note 1) Repetitive Avalanche Energy 18 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns P Power Dissipation (T = 25°C) 180 W D C - Derate above 25°C 1.43 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 0.7 °C/W θJC R Thermal Resistance, Case-to-Sink 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA ©2000 Fairchild Semiconductor International Rev. A, June 2000 FQP34N20L
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