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FQP18N20V2FAIRCHILDN/a500avai200V N-Channel MOSFET


FQP18N20V2 ,200V N-Channel MOSFETapplications such as automotive, highefficiency switching for DC/DC converters, and DC motorcontrol ..
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FQP18N20V2
200V N-Channel MOSFET
FQP18N20V2/FQPF18N20V2 TM QFET FQP18N20V2/FQPF18N20V2 200V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 18A, 200V, R = 0.14Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 20 nC) planar stripe, DMOS technology. • Low Crss ( typical 25 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, high efficiency switching for DC/DC converters, and DC motor control. D !!!!!!!! ● ● ● ● ● ● ● ● ◀ ◀ ◀ ◀ ◀ ◀ ◀ ◀ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ● ● ● ● ● ● ● ● G!!!!!!!! ● ● ● ● ● ● ● ● TO-220 TO-220F G D S G D S FQP Series FQPF Series !!!!!!!! S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQP18N20V2 FQPF18N20V2 Units V Drain-Source Voltage 200 V DSS I - Continuous (T = 25°C) Drain Current 18 18 A D C - Continuous (T = 100°C) 11.9 11.9 A C I (Note 1) Drain Current - Pulsed 72 72 A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 340 mJ AS I Avalanche Current (Note 1) 18 A AR E (Note 1) Repetitive Avalanche Energy 12.3 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 6.5 V/ns P Power Dissipation (T = 25°C) 123 40 W D C - Derate above 25°C 0.99 0.32 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter FQP18N20V2 FQPF18N20V2 Units R Thermal Resistance, Junction-to-Case 1.01 3.1 °C/W θJC R Thermal Resistance, Case-to-Sink 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W θJA ©2002 Rev. B, August 2002
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