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FQP17N08LFAIRCHILDN/a500avai80V LOGIC N-Channel MOSFET


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FQP17N08L
80V LOGIC N-Channel MOSFET
FQP17N08L December 2000 TM QFET QFET QFET QFET FQP17N08L 80V LOGIC N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect  16.5A, 80V, R = 0.1Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary,  Low gate charge ( typical 8.8 nC) planar stripe, DMOS technology.  Low Crss ( typical 29 pF) This advanced technology is especially tailored to minimize  Fast switching on-state resistance, provide superior switching  100% avalanche tested performance, and withstand a high energy pulse in the  Improved dv/dt capability avalanche and commutation modes. These devices are  175°C maximum junction temperature rating well suited for low voltage applications such as automotive,  Low level gate drive requirements allowing high efficiency switching for DC/DC converters, and DC direct operation from logic drives motor control. D ! ! "" !!"" "" G! ! "" G D TO-220 S ! ! FQP Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQP17N08L Units V Drain-Source Voltage 80 V DSS I - Continuous (T = 25°C) Drain Current 16.5 A D C - Continuous (T = 100°C) 11.6 A C I (Note 1) Drain Current - Pulsed 66 A DM V Gate-Source Voltage ± 20 V GSS E (Note 2) Single Pulsed Avalanche Energy 100 mJ AS I Avalanche Current (Note 1) 16.5 A AR E (Note 1) Repetitive Avalanche Energy 6.5 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 6.5 V/ns P Power Dissipation (T = 25°C) 65 W D C - Derate above 25°C 0.43 W/°C T , T Operating and Storage Temperature Range -55 to +175 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8” from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 2.31 °C/W θJC R Thermal Resistance, Case-to-Sink 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA ©2000 Fairchild Semiconductor International Rev. A2, December 2000
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