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FDP090N10 |FDP090N10FSC N/a3545avaiN-Channel PowerTrench?MOSFET 100V, 75A, 9m?


FDP090N10 ,N-Channel PowerTrench?MOSFET 100V, 75A, 9m?General Description•R = 7.2 mΩ ( Typ.) @ V = 10 V, I = 75 A This N-Channel MOSFET is producedusing ..
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FDP090N10
N-Channel PowerTrench?MOSFET 100V, 75A, 9m?
® FDP090N10 N-Channel PowerTrench MOSFET April 2013 FDP090N10 tm ® N-Channel PowerTrench MOSFET 100 V, 75 A, 9 mΩ Features General Description •R = 7.2 mΩ ( Typ.) @ V = 10 V, I = 75 A This N-Channel MOSFET is producedusing Fairchild Semicon- DS(on) GS D ® ® ductor ’s advanced PowerTrench process that has been tai- • Fast Switching Speed lored to minimize the on-state resistance while maintaining superior switching performance. • Low Gate Charge • High Performance Trench Technology for Extremely Low Applications R DS(on) • Synchronous Rectification for ATX / Server / Telecom PSU • High Power and Current Handling Capability • Battery Protection Circuit • RoHS Compliant • Motor Drives and Uninterruptible Power Supplies • Micro Solar Inverter D G TO-220 G S D S o MOSFET Maximum Ratings T = 25 C unless otherwise noted* C Symbol Parameter FDP090N10 Unit V Drain to Source Voltage 100 V DSS V Gate to Source Voltage ±20 V GSS o I Drain Current -Continuous (T = 85 C) 75 A D C I Drain Current - Pulsed (Note 1) 300 A DM E Single Pulsed Avalanche Energy (Note 2) 309 mJ AS I Avalanche Current (Note 1) 75 A AR E Repetitive Avalanche Energy (Note 1) 20.8 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.6 V/ns o (T = 25 C) 208 W C P Power Dissipation D o o - Derate above 25C1.39W/ C o T , T Operating and Storage Temperature Range -55 to +175 C J STG Maximum Lead Temperature for Soldering Purpose, o T 300 C L 1/8” from Case for 5 Seconds *Drain current limited by maximum junction temperature Thermal Characteristics Symbol Parameter FDP090N10 Unit R Thermal Resistance, Junction to Case, Max. 0.72 θJC o R Thermal Resistance, Case to Sink Typ. 0.5 C/W θCS R Thermal Resistance, Junction to Ambient, Max. 62.5 θJA ©2008 1 FDP090N10 Rev. C1
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