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FDD3672FSCN/a20avaiN-Channel UltraFET ?Trench MOSFET 100V, 44A, 28mOhm


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FN1L3Z-T2B ,Compound transistorFEATURES in millimeters ( O Resistor Built-in TYPE T C B 2.8+,0.2 R1 = 4.7 k9 . _ R1 _ -0.15 C ..
FN1L4L ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDELECTRICAL CHARACTERISTICS (Ta = 25 "C) CHARACTERISTIC SYMBOL . . ' . TEST CONDITIONS ' Colle ..
FN1L4L-T1B ,Compound transistorELECTRICAL CHARACTERISTICS (Ta = 25 "C) CHARACTERISTIC SYMBOL . . ' . TEST CONDITIONS ' Colle ..
FN1L4M ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDELECTRICAL CHARACTERISTICS(T8=25°C) CHARACTERISTIC SYMBOL . . . TEST CONDITIONS ( Collector C ..
FN1L4M-T1B ,Compound transistorFEATURES PAcKA.GE..PMFNsiONs . Resistors Built-in TYPE In millimeters C 28:02 B FO.1 R1 1T2 47 ..
FN1L4M-T2B ,Compound transistorELECTRICAL CHARACTERISTICS(T8=25°C) CHARACTERISTIC SYMBOL . . . TEST CONDITIONS ( Collector C ..


FDD3672
N-Channel UltraFET ?Trench MOSFET 100V, 44A, 28mOhm
FDD3672 June 2002 FDD3672 ® N-Channel UltraFET Trench MOSFET 100V, 44A, 28mΩ Features Applications r = 24mΩ (Typ.), V = 10V, I = 44A DC/DC converters and Off-Line UPS DS(ON) GS D Q (tot) = 24nC (Typ.), V = 10V g GS Distributed Power Architectures and VRMs Low Miller Charge Primary Switch for 24V and 48V Systems Low Qrr Body Diode High Voltage Synchronous Rectifier Optimized efficiency at high frequencies Direct Injection / Diesel Injection System UIS Capability (Single Pulse and Repetitive Pulse) Qualified to AEC Q10142V Automotive Load Control Electronic Valve Train System Formerly developmental type 82760 DRAIN D (FLANGE) GATE SOURCE G TO-252AB FDD SERIES S MOSFET Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 100 V DSS V Gate to Source Voltage ±20 V GS Drain Current o 44 A Continuous (T = 25 C, V = 10V) C GS o I Continuous (T = 100 C, V = 10V) 31 A D C GS o o Continuous (T = 25 C, V = 10V, R = 52 C/W) 6.5 A amb GS θJA Pulsed Figure 4 A E Single Pulse Avalanche Energy (Note 1) 120 mJ AS Power dissipation 135 W P D o o Derate above 25C0.9W/ C o T , T Operating and Storage Temperature -55 to 175 C J STG Thermal Characteristics o R Thermal Resistance Junction to Case TO-252 1.11 C/W θJC o R Thermal Resistance Junction to Ambient TO-252 100 C/W θJA 2 o R Thermal Resistance Junction to Ambient TO-252, 1in copper pad area 52 C/W θJA This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: http:///products/discrete/reliability/index.html. All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification. ©2002 FDD3672 Rev. A
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